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1. 发明申请

US20060125066A1 Self-adhesive frame applied in package of field emission display, the manufacturing method for the same and the package method by the same 审中-公开
公开(公告)号：US20060125066A1
公开(公告)日：2006-06-15
申请号：US11345295
申请日：2006-02-02
申请人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
发明人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
IPC分类号： H01L23/02
CPC分类号： H01J5/24 , H01J9/261 , H01J29/86 , H01J2329/862 , H01J2329/8675
摘要： A self-adhesive frame is applied in package of field emission display, the manufacturing method for the same and the package method by the same being also discussed in the specification. The self-adhesive frame can be designed as an independent component and suitable to be manufactured independently. The cathode plate and the anode plate do not need to join the process of pre-heating of the self-adhesive frame. The self-adhesive frame also has a plurality of fixing side strips for alignment of temporary fixing of the cathode plate and the anode plate. Wherein the fixing side strips do not increase the void area of the field emission display. The self-adhesive frame comprises: a main body frame having the cathode plate sealing surface and the anode plate sealing surface; and a fixing side strip extending from the outer side of the main body frame.

2. 发明授权

US07285900B2 Field emission display having self-adhesive frame 有权
标题翻译：具有自粘框架的场发射显示
公开(公告)号：US07285900B2
公开(公告)日：2007-10-23
申请号：US10689686
申请日：2003-10-22
申请人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
发明人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
IPC分类号： H01J29/86 , H01J9/26
CPC分类号： H01J5/24 , H01J9/261 , H01J29/86 , H01J2329/862 , H01J2329/8675
摘要： A self-adhesive frame is applied in package of field emission display, the manufacturing method for the same and the package method by the same being also discussed in the specification. The self-adhesive frame can be designed as an independent component and suitable to be manufactured independently. The cathode plate and the anode plate do not need to join the process of pre-heating of the self-adhesive frame. The self-adhesive frame also has a plurality of fixing side strips for alignment of temporary fixing of the cathode plate and the anode plate. Wherein the fixing side strips do not increase the void area of the field emission display. The self-adhesive frame comprises: a main body frame having the cathode plate sealing surface and the anode plate sealing surface; and a fixing side strip extending from the outer side of the main body frame.
摘要翻译：将自粘框架应用于场致发射显示器的封装中，其制造方法和包装方法也在说明书中讨论。自粘框架可以设计为独立的部件，适合独立制造。阴极板和阳极板不需要加入自粘框架的预热过程。自粘合框架还具有多个固定侧条，用于对准阴极板和阳极板的临时固定。其中固定侧条不增加场发射显示的空隙面积。该自粘框架包括：具有阴极板密封面和阳极板密封面的主体框架; 以及从主体框架的外侧延伸的固定侧条。

3. 发明申请

US20060124235A1 Self-adhesive frame applied in package of field emission display, the manufacturing method for the same and the package method by the same 审中-公开
标题翻译：自粘框架应用于场发射显示器的封装，其制造方法与封装方法相同
公开(公告)号：US20060124235A1
公开(公告)日：2006-06-15
申请号：US11345294
申请日：2006-02-02
申请人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
发明人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
IPC分类号： B32B37/00
CPC分类号： H01J5/24 , H01J9/261 , H01J29/86 , H01J2329/862 , H01J2329/8675
摘要： A self-adhesive frame is applied in package of field emission display, the manufacturing method for the same and the package method by the same being also discussed in the specification. The self-adhesive frame can be designed as an independent component and suitable to be manufactured independently. The cathode plate and the anode plate do not need to join the process of pre-heating of the self-adhesive frame. The self-adhesive frame also has a plurality of fixing side strips for alignment of temporary fixing of the cathode plate and the anode plate. Wherein the fixing side strips do not increase the void area of the field emission display. The self-adhesive frame comprises: a main body frame having the cathode plate sealing surface and the anode plate sealing surface; and a fixing side strip extending from the outer side of the main body frame.
摘要翻译：将自粘框架应用于场致发射显示器的封装中，其制造方法和包装方法也在说明书中讨论。自粘框架可以设计为独立的部件，适合独立制造。阴极板和阳极板不需要加入自粘框架的预热过程。该自粘合框架还具有用于对准阴极板和阳极板的临时固定的多个固定侧条。其中固定侧条不增加场发射显示的空隙面积。该自粘框架包括：具有阴极板密封面和阳极板密封面的主体框架; 以及从主体框架的外侧延伸的固定侧条。

4. 发明申请

US20050088072A1 Self-adhesive frame applied in package of field emission display, the manufacturing method for the same and the package method by the same 有权
标题翻译：自粘框架应用于场发射显示器的封装，其制造方法与封装方法相同
公开(公告)号：US20050088072A1
公开(公告)日：2005-04-28
申请号：US10689686
申请日：2003-10-22
申请人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
发明人： Frank Yang , Guo-Hua Chen , Jin-Shou Fang , Kuei-Wen Cheng
IPC分类号： H01J5/20 , H01J5/24 , H01J9/18 , H01J9/26 , H01J29/02 , H01J29/86 , H01J1/88 , B32B31/12 , B32B31/26 , B32B31/28 , H01J19/42 , H01K1/18
CPC分类号： H01J5/24 , H01J9/261 , H01J29/86 , H01J2329/862 , H01J2329/8675
摘要： A self-adhesive frame is applied in package of field emission display, the manufacturing method for the same and the package method by the same being also discussed in the specification. The self-adhesive frame can be designed as an independent component and suitable to be manufactured independently. The cathode plate and the anode plate do not need to join the process of pre-heating of the self-adhesive frame. The self adhesive frame also has a plurality of fixing side strips for alignment of temporary fixing of the cathode plate and the anode plate. Wherein the fixing side strips do not increase the void area of the field emission display. The self-adhesive frame comprises: a main body frame having the cathode plate sealing surface and the anode plate sealing surface; and a fixing side strip extending from the outer side of the main body frame.
摘要翻译：将自粘框架应用于场致发射显示器的封装中，其制造方法和包装方法也在说明书中讨论。自粘框架可以设计为独立的部件，适合独立制造。阴极板和阳极板不需要加入自粘框架的预热过程。自粘合框架还具有多个固定侧条，用于对准阴极板和阳极板的临时固定。其中固定侧条不增加场发射显示的空隙面积。该自粘框架包括：具有阴极板密封面和阳极板密封面的主体框架; 以及从主体框架的外侧延伸的固定侧条。

5. 发明申请

US20100201263A1 VACUUM DEGASSING BOX OF A FIELD EMISSION DISPLAY 审中-公开
标题翻译：真空排气显示屏的真空灭菌盒
公开(公告)号：US20100201263A1
公开(公告)日：2010-08-12
申请号：US12369827
申请日：2009-02-12
申请人： Chuan-Chen CHEN , Guo-Hua Chen , Jin-Shou Fang
发明人： Chuan-Chen CHEN , Guo-Hua Chen , Jin-Shou Fang
IPC分类号： H01J19/70
CPC分类号： H01J31/123 , H01J29/94 , H01J2329/946
摘要： In a vacuum degassing box of a field emission display, the field emission display includes a faceplate, and the faceplate has a chamber and a through opening which is defined on the faceplate and communicated with the chamber. The vacuum degassing box includes a housing and a getter. The through opening of the faceplate is covered by the housing. A contained chamber is formed between the housing and the faceplate, and a rough surface is formed inside the contained chamber. The getter is distributed on the rough surface of the contained chamber. Therefore, a vacuum condition of the vacuum degassing box is kept for a long time to increase use life of the field emission display.
摘要翻译：在场致发射显示器的真空脱气箱中，场发射显示器包括面板，并且面板具有限定在面板上并与腔室连通的腔室和通孔。真空脱气箱包括壳体和吸气剂。面板的通孔被外壳覆盖。容纳室形成在壳体和面板之间，并且在容纳室内形成粗糙表面。吸气剂分布在容纳室的粗糙表面上。因此，真空脱气箱的真空条件保持很长时间，以增加场致发射显示器的使用寿命。

6. 发明授权

US07254037B2 Mounting apparatus for motherboards 失效
标题翻译：主板安装装置
公开(公告)号：US07254037B2
公开(公告)日：2007-08-07
申请号：US10989701
申请日：2004-11-16
申请人： Yun-Lung Chen , Guo-Hua Chen
发明人： Yun-Lung Chen , Guo-Hua Chen
IPC分类号： H05K5/00
CPC分类号： G06F1/184
摘要： A mounting apparatus for mounting a motherboard (10) includes a base (200) with a number of standoffs (210) formed thereon, a driving member (130), an operating member (110) and a supporting tray (20) with a number of mounting holes (27) defined therein. The driving member is slidably attached to the base and a driving shaft (144) is formed thereon. The operating member is pivotally attached to the base with a first cutout (114) and a second cutout (116) defined therein. The supporting tray is secured on a bottom surface of the motherboard with a post (42) formed thereunder. The driving shaft and the post is respectively engaged in the first cutout and the second cutout. After the standoffs are received in corresponding mounting holes, the motherboard is assembled or disassembled by pushing or pulling the driving member.
摘要翻译：一种用于安装母板（10）的安装装置包括：具有形成在其上的多个支座（210）的基座（200），具有数字的驱动构件（130），操作构件（110）和支撑托盘（20）的安装孔（27）。驱动构件可滑动地附接到基座上，并且在其上形成驱动轴（144）。操作构件以限定在其中的第一切口（114）和第二切口（116）枢转地附接到基部。支撑托盘固定在主板的底表面上，其上形成有一个柱（42）。驱动轴和柱分别接合在第一切口和第二切口中。在相应的安装孔中接收到支座之后，通过推动或拉动驱动构件来组装或拆卸主板。

7. 发明申请

US20050168927A1 Mounting apparatus for motherboards 失效
标题翻译：主板安装装置
公开(公告)号：US20050168927A1
公开(公告)日：2005-08-04
申请号：US10989701
申请日：2004-11-16
申请人： Yun-Lung Chen , Guo-Hua Chen
发明人： Yun-Lung Chen , Guo-Hua Chen
IPC分类号： G06F1/16 , G06F1/18 , H05K7/12
CPC分类号： G06F1/184
摘要： A mounting apparatus for mounting a motherboard (10) includes a base (200) with a number of standoffs (210) formed thereon, a driving member (130), an operating member (110) and a supporting tray (20) with a number of mounting holes (27) defined therein. The driving member is slidably attached to the base and a driving shaft (144) is formed thereon. The operating member is pivotally attached to the base with a first cutout (114) and a second cutout (116) defined therein. The supporting tray is secured on a bottom surface of the motherboard with a post (42) formed thereunder. The driving shaft and the post is respectively engaged in the first cutout and the second cutout. After the standoffs are received in corresponding mounting holes, the motherboard is assembled or disassembled by pushing or pulling the driving member.
摘要翻译：一种用于安装母板（10）的安装装置包括：具有形成在其上的多个支座（210）的基座（200），具有数字的驱动构件（130），操作构件（110）和支撑托盘（20）的安装孔（27）。驱动构件可滑动地附接到基座上，并且在其上形成驱动轴（144）。操作构件以限定在其中的第一切口（114）和第二切口（116）枢转地附接到基部。支撑托盘固定在主板的底表面上，其上形成有一个柱（42）。驱动轴和柱分别接合在第一切口和第二切口中。在相应的安装孔中接收到支座之后，通过推动或拉动驱动构件来组装或拆卸主板。

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