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1. 发明申请

US20090179157A1 VAPOR DELIVERY TO DEVICES UNDER VACUUM 失效
标题翻译：蒸汽输送到真空设备
公开(公告)号：US20090179157A1
公开(公告)日：2009-07-16
申请号：US12299702
申请日：2007-06-11
申请人： Frank R. Sinclair , Douglas R. Adams , Brent M. Copertino
发明人： Frank R. Sinclair , Douglas R. Adams , Brent M. Copertino
IPC分类号： H01J27/00 , A61N5/00
CPC分类号： C23C14/48 , C23C14/228 , H01J37/02 , H01J37/32412 , H01J2237/006 , H01J2237/022 , H01J2237/08 , H01J2237/31701
摘要： Providing vapor to a vapor-receiving device housed in a high vacuum chamber. An ion beam implanter, as an example, has a removable high voltage ion source within a high vacuum chamber and a vapor delivery system that delivers vapor to the ion source and does not interfere with removal of the ion source for maintenance. For delivering vapor to a vapor-receiving device, such as the high voltage ion source under vacuum, a flow interface device is in the form of a thermally conductive valve block. A delivery extension of the interface device automatically connects and disconnects within the high vacuum chamber with the removable vapor receiving device by respective installation and removal motions. In an ion implanter, the flow interface device or valve block and source of reactive cleaning gas are mounted in a non-interfering way on the electrically insulating bushing that insulates the ion source from the vacuum housing and the ion source may be removed without disturbing the flow interface device. Multiple vaporizers for solid material, provisions for reactive gas cleaning, and provisions for controlling flow are provided in the flow interface device.
摘要翻译：向容纳在高真空室中的蒸汽接收装置提供蒸汽。作为示例，离子束注入机在高真空室内具有可移除的高电压离子源，以及将蒸气输送到离子源并且不干扰离子源的去除以进行维护的蒸气输送系统。为了将蒸汽输送到蒸汽接收装置，例如在真空下的高压离子源，流动接口装置是导热阀块的形式。接口设备的传送延伸部通过相应的安装和移除动作，利用可移除的蒸气接收装置自动地在高真空室内连接和断开。在离子注入机中，流动界面装置或阀块和反应性清洁气体源以非干涉的方式安装在电绝缘衬套上，该电绝缘套管使离子源与真空壳体绝缘，并且离子源可被去除而不会干扰流接口设备。在流体接口装置中提供了用于固体材料的多个蒸发器，用于反应性气体清洁的设备和用于控制流量的设备。

2. 发明授权

US08110815B2 Vapor delivery to devices under vacuum 失效
标题翻译：在真空下蒸气输送到设备
公开(公告)号：US08110815B2
公开(公告)日：2012-02-07
申请号：US12299702
申请日：2007-06-11
申请人： Frank Sinclair , Douglas R. Adams , Brent M. Copertino
发明人： Frank Sinclair , Douglas R. Adams , Brent M. Copertino
IPC分类号： H01J37/08
CPC分类号： C23C14/48 , C23C14/228 , H01J37/02 , H01J37/32412 , H01J2237/006 , H01J2237/022 , H01J2237/08 , H01J2237/31701
摘要： Providing vapor to a vapor-receiving device housed in a high vacuum chamber. An ion beam implanter, as an example, has a removable high voltage ion source within a high vacuum chamber and a vapor delivery system that delivers vapor to the ion source and does not interfere with removal of the ion source for maintenance. For delivering vapor to a vapor-receiving device, such as the high voltage ion source under vacuum, a flow interface device is in the form of a thermally conductive valve block. A delivery extension of the interface device automatically connects and disconnects within the high vacuum chamber with the removable vapor receiving device by respective installation and removal motions. In an ion implanter, the flow interface device or valve block and source of reactive cleaning gas are mounted in a non-interfering way on the electrically insulating bushing that insulates the ion source from the vacuum housing and the ion source may be removed without disturbing the flow interface device. Multiple vaporizers for solid material, provisions for reactive gas cleaning, and provisions for controlling flow are provided in the flow interface device.
摘要翻译：向容纳在高真空室中的蒸汽接收装置提供蒸汽。作为示例，离子束注入机在高真空室内具有可移除的高电压离子源，以及将蒸气输送到离子源并且不干扰离子源的去除以进行维护的蒸气输送系统。为了将蒸汽输送到蒸汽接收装置，例如在真空下的高压离子源，流动接口装置是导热阀块的形式。接口设备的传送延伸部通过相应的安装和移除动作，利用可移除的蒸气接收装置自动地在高真空室内连接和断开。在离子注入机中，流动界面装置或阀块和反应性清洁气体源以非干扰的方式安装在电绝缘衬套上，该电绝缘衬套使离子源与真空壳体绝缘，并且离子源可被去除而不会干扰流接口设备。在流体接口装置中提供了用于固体材料的多个蒸发器，用于反应性气体清洁的设备和用于控制流量的设备。

3. 发明授权

US6123502A Substrate holder having vacuum holding and gravity holding 失效
标题翻译：基板支架具有真空保持和重力保持
公开(公告)号：US6123502A
公开(公告)日：2000-09-26
申请号：US889516
申请日：1997-07-08
申请人： Douglas R. Adams , Robert T. Caveney , Twan T. Ha , Brian M. Lucas
发明人： Douglas R. Adams , Robert T. Caveney , Twan T. Ha , Brian M. Lucas
IPC分类号： G03F7/20 , H01L21/683
CPC分类号： G03F7/70725 , H01L21/6838 , Y10S414/141
摘要： A substrate processing apparatus having a substrate transport with substrate holders. The holders are adapted to vacuum hold substrates and thereby allow for rapid movement of the substrates without risk that the substrates will move off of the holders. If vacuum holding of a substrate on a holder fails, the movement of the substrate holder is automatically changed to provide a less rapid gravity only holding of the substrate on the holder.
摘要翻译：一种基板处理装置，具有基板保持器的基板输送。保持器适于真空保持基板，从而允许基板的快速移动，而不会使基板从保持器移开的风险。如果保持器上的基板的真空保持器失效，则基板保持器的移动被自动地改变，以提供不太快的重力，仅将基板保持在保持器上。

4. 发明授权

US6059507A Substrate processing apparatus with small batch load lock 失效
标题翻译：基板加工设备，小批量装载锁
公开(公告)号：US6059507A
公开(公告)日：2000-05-09
申请号：US49314
申请日：1998-03-27
申请人： Douglas R. Adams
发明人： Douglas R. Adams
IPC分类号： G03F7/20 , H01L21/677 , B65G1/10
CPC分类号： H01L21/67748 , G03F7/7075 , G03F7/70808 , H01L21/67201 , H01L21/67751 , H01L21/67778 , Y10S414/137 , Y10S414/139
摘要： A substrate load lock comprising a frame and a substrate support movably mounted to the frame. The frame forms at least three chambers. The substrate support has at least two separate support areas. The first one of the support areas is movable between the first one of the chambers. A second one of the support areas is movable between the second chamber and a third one of the chambers.
摘要翻译：一种衬底加载锁，其包括可移动地安装到框架的框架和基板支撑件。框架至少形成三个室。衬底支撑件具有至少两个单独的支撑区域。第一个支撑区域可以在第一个腔室之间移动。支撑区域中的第二个可在第二腔室和第三腔室之间移动。

5. 发明申请

US20090206281A1 VAPOR DELIVERY SYSTEM USEFUL WITH ION SOURCES AND VAPORIZERS FOR USE IN SUCH SYSTEM 审中-公开
标题翻译：使用离子源和蒸发器用于这种系统的蒸气输送系统
公开(公告)号：US20090206281A1
公开(公告)日：2009-08-20
申请号：US12300918
申请日：2007-06-12
申请人： Dror Oved , Thomas N. Horsky , Douglas R. Adams
发明人： Dror Oved , Thomas N. Horsky , Douglas R. Adams
IPC分类号： H01J37/08 , H01J27/02 , H01J27/08
CPC分类号： C23C14/48 , C23C14/228 , H01J37/02 , H01J37/32412 , H01J2237/006 , H01J2237/022 , H01J2237/08 , H01J2237/31701
摘要： Vapor delivery systems and methods that control the heating and flow of vapors from solid feed material, especially material that comprises cluster molecules for semiconductor manufacture. The systems and methods safely and effectively conduct the vapor to a point of utilization, especially to an ion source for ion implantation. Ion beam implantation is shown employing ions from the cluster materials. The vapor delivery system includes reactive gas cleaning of the ion source, control systems and protocols, wide dynamic range flow-control systems and vaporizer selections that are efficient and safe. Borane, decarborane, carboranes, carbon clusters and other large molecules are vaporized for ion implantation. Such systems are shown cooperating with novel vaporizers, ion sources, and reactive cleaning systems.
摘要翻译：控制来自固体进料的蒸气的加热和流动的蒸气输送系统和方法，特别是包含用于半导体制造的聚簇分子的材料。这些系统和方法安全有效地将蒸汽传导到一个利用点，特别是离子源的离子源。示出了离子束注入使用来自簇材料的离子。蒸汽输送系统包括离子源的反应气体清洁，控制系统和协议，宽动态范围流量控制系统和有效和安全的蒸发器选择。硼烷，癸二硼烷，碳硼烷，碳簇和其他大分子蒸发用于离子注入。示出了这样的系统与新型蒸发器，离子源和反应性清洁系统协作。

6. 发明申请

US20120064705A1 VAPORIZER 审中-公开
标题翻译：蒸气器
公开(公告)号：US20120064705A1
公开(公告)日：2012-03-15
申请号：US13218895
申请日：2011-08-26
申请人： Thomas N. Horsky , Douglas R. Adams , Dror Oved , George Sacco , David J. Hartnett
发明人： Thomas N. Horsky , Douglas R. Adams , Dror Oved , George Sacco , David J. Hartnett
IPC分类号： H01L21/265 , F22B1/28
CPC分类号： H01J37/08 , H01J37/3171 , H01J2237/006 , H01J2237/08 , Y10T137/8593
摘要： Vapor delivery systems and methods that control the heating and flow of vapors from solid feed material, especially material that comprises cluster molecules for semiconductor manufacture. The systems and methods safely and effectively conduct the vapor to a point of utilization, especially to an ion source for ion implantation. Ion beam implantation is shown employing ions from the cluster materials. The vapor delivery system includes reactive gas cleaning of the ion source, control systems and protocols, wide dynamic range flow-control systems and vaporizer selections that are efficient and safe. Borane, decarborane, carboranes, carbon clusters and other large molecules are vaporized for ion implantation. Such systems are shown cooperating with novel vaporizers, ion sources, and reactive cleaning systems.
摘要翻译：控制来自固体进料的蒸气的加热和流动的蒸气输送系统和方法，特别是包含用于半导体制造的聚簇分子的材料。这些系统和方法安全有效地将蒸汽传导到一个利用点，特别是离子源的离子源。示出了离子束注入使用来自簇材料的离子。蒸汽输送系统包括离子源的反应气体清洁，控制系统和协议，宽动态范围流量控制系统和有效和安全的蒸发器选择。硼烷，癸二硼烷，碳硼烷，碳簇和其他大分子蒸发用于离子注入。示出了这样的系统与新型蒸发器，离子源和反应性清洁系统协作。

7. 发明授权

US06719517B2 Substrate processing apparatus with independently configurable integral load locks 有权
标题翻译：基板处理装置，具有可独立配置的整体负载锁
公开(公告)号：US06719517B2
公开(公告)日：2004-04-13
申请号：US10006263
申请日：2001-12-04
申请人： David R. Beaulieu , Douglas R. Adams , Mitchell Drew , Peter Van Der Meulen
发明人： David R. Beaulieu , Douglas R. Adams , Mitchell Drew , Peter Van Der Meulen
IPC分类号： B65G4907
CPC分类号： H01L21/67167 , H01L21/67201 , H01L21/67739 , Y10S414/139
摘要： A substrate processing apparatus comprising a frame, at least one processing module, and a substrate transport apparatus. The frame defines a first chamber with outer substrate transport openings for transporting substrates between the first chamber and an exterior of the frame. The processing module is connected to the exterior of the frame. The processing module communicates with the first chamber of the frame through at least one of the outer openings. The substrate transport apparatus is connected to the frame for transporting substrates between the first chamber and the processing module exterior to the frame. The frame has a second integral chamber formed therein. The second integral chamber communicates with the first chamber through an internal substrate transport opening of the frame. The second integral chamber of the frame has a selectable configuration from a number of predetermined configurations. The configuration of the second integral chamber to the frame is selected in accordance with a predetermined characteristic of the substrate processing apparatus.
摘要翻译：一种基板处理装置，包括框架，至少一个处理模块和基板输送装置。框架限定具有外基板输送开口的第一室，用于在第一室和框架的外部之间输送基板。处理模块连接到框架的外部。处理模块通过至少一个外部开口与框架的第一室连通。基板输送装置连接到框架，用于在第一室和框架外部的处理模块之间输送基板。框架具有形成在其中的第二整体室。第二整体室通过框架的内部基板输送开口与第一室连通。框架的第二整体室具有多个预定构造的可选配置。根据基板处理装置的预定特性来选择到框架的第二整体室的构造。

8. 发明授权

US5879461A Metered gas control in a substrate processing apparatus 失效
标题翻译：基板处理装置中的计量气体控制
公开(公告)号：US5879461A
公开(公告)日：1999-03-09
申请号：US49315
申请日：1998-03-27
申请人： Douglas R. Adams
发明人： Douglas R. Adams
IPC分类号： B01J3/02 , C03C15/00 , C23C16/455 , H01J37/32 , H01L21/302 , H01L21/3065 , C23C16/00 , C23C14/00 , F25D25/00 , F28F7/00
CPC分类号： C23C14/566 , C03C15/00 , C23C14/568 , C23C16/455 , C23C16/54 , H01J37/3244 , H01L21/67109 , Y10T137/0379
摘要： A method of introducing gas into a substrate processing chamber. The method of introducing gas into a substrate processing chamber comprises the steps of filling a gas metering area with the gas to a first predetermined pressure, closing the area to maintain the area at the first predetermined pressure and opening the area to the substrate processing chamber. When the area is opened to the substrate processing chamber, the gas inside the area will expand into the chamber to provide the chamber with a second predetermined pressure.
摘要翻译：将气体引入基板处理室的方法。将气体引入基板处理室的方法包括以下步骤：将具有气体的气体计量区域填充到第一预定压力，闭合该区域以将该区域保持在第一预定压力并打开到基板处理室的区域。当该区域被打开到基板处理室时，该区域内的气体将扩展到该室中，以使该室具有第二预定压力。

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