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    • 1. 发明授权
    • Product with a security element
    • 具有安全元素的产品
    • US06827283B2
    • 2004-12-07
    • US10380944
    • 2003-07-23
    • Frank KappeDirk FischerLothar FannaschMichael Hennemeyer-SchwenkerMathias Schumacher
    • Frank KappeDirk FischerLothar FannaschMichael Hennemeyer-SchwenkerMathias Schumacher
    • G06K1906
    • B42D25/41B41M3/14B41M5/28B41M5/286B42D25/342B42D25/45B42D2035/20G06K19/06046
    • The invention relates especially to a method for producing a product that is secure against fraud, i.e. a security product. The inventive method for producing a security product with a high degree of protection against fraud or tampering is characterized as follows: in a first step, a non-personalized and/or non-individualized support is provided with a non-personalized and/or non-individualized security element (100); in a second step and/or in further steps, the non-personalized and/or non-individualized support and the non-personalized and/or non-individualized security element (100) are personalized and/or individualized; a structure (101) that is optically effective in the security element (100) produces at least two especially, color effects; at least one of the color effects (106,107) only appears within a certain angular range to a vertical to the surface of the security element, and a personalizable and/or individualizable layer (102) that is provided in the security element (100) and/or a personalized and/or individualized layer that is provided in the security element (100) shows personalization and/or individualization information.
    • 本发明尤其涉及一种用于生产防止欺诈的产品的方法,即安全产品。 用于制造具有高度防止欺诈或篡改的保护的安全产品的创造性方法的特征如下:在第一步骤中,非个性化和/或非个性化的支持被提供有非个性化和/或非个性化的 个人化安全要素(100) 在第二步骤和/或进一步的步骤中,非个人化和/或非个性化支持和非个性化和/或非个性化安全元件(100)被个性化和/或个性化; 在安全元件(100)中光学有效的结构(101)产生至少两种特别的颜色效果; 颜色效果(106,107)中的至少一个仅出现在与安全元件的表面垂直的一定角度范围内,以及设置在安全元件(100)中的个性化和/或可个性化的层(102)和 /或提供在安全元件(100)中的个性化和/或个性化层显示个性化和/或个性化信息。
    • 2. 发明授权
    • Method for applying colored information on an object
    • 将彩色信息应用于对象的方法
    • US07158145B1
    • 2007-01-02
    • US10130540
    • 2000-09-14
    • Lothar FannaschDirk FischerMichael Hennemeyer-Schwenker
    • Lothar FannaschDirk FischerMichael Hennemeyer-Schwenker
    • G09G5/02
    • B23K26/0613B23K26/0604B41M5/262B41M5/267
    • A description is given of a method for applying colored information to an object (4), the object having at least two different chromophoric particles, at least in a layer (4A) close to the surface, which change the color of this layer (4A) under the influence of laser radiation, laser radiation (1, 2, 3) having at least two different wavelengths (λ1, μ2, λ3) being used in order to change the color of this layer (4A), the object (4) being acted on by laser radiation in the vector and/or raster method by means of a two-coordinate beam deflection device (6) and a focusing device (7) for focusing the laser radiation onto the layer (4A) of the object (4). According to the invention, at least one beam guiding means (8) is provided in order to guide a first laser beam (1) having the wavelength (λ1) and at least one further laser beam (2) having a wavelength (λ2), which is different from the wavelength of the first laser beam, via the two-coordinate beam deflection device (6) and the focusing device (7) onto the layer (4A) of the object (4).
    • 给出了将彩色信息应用于物体(4)的方法的描述,所述物体至少在靠近表面的层(4A)中具有至少两个不同的发色粒子,其改变了该层的颜色( 如图4A所示,在激光辐射的影响下,激光辐射(1,2,3)具有至少两个不同波长(λ1,λ2,λ2, 3),以便改变该层(4A)的颜色,物体(4)通过激光辐射在矢量和/或光栅方法中借助于双坐标光束偏转 装置(6)和聚焦装置(7),用于将激光辐射聚焦到物体(4)的层(4A)上。 根据本发明,提供至少一个光束引导装置(8),以便引导具有波长(λλ1)的第一激光束(1)和至少一个另外的激光束(2) )具有通过双坐标光束偏转装置(6)和聚焦装置(7)到该层上的具有不同于第一激光束的波长的波长(λ<2> 2 < 对象(4)的4 A)。
    • 4. 发明授权
    • Method for producing a multi-layer chip card
    • 多层芯片卡的制造方法
    • US06659355B1
    • 2003-12-09
    • US10049840
    • 2002-05-30
    • Dirk FischerLothar Fannasch
    • Dirk FischerLothar Fannasch
    • G06K1906
    • G06K19/07722G06K19/07745H01L2224/48091H01L2224/73265H05K1/183H05K3/0044H05K3/281H05K3/4007H05K3/4084H05K2201/0367H05K2201/09045H05K2203/0228H05K2203/063H01L2924/00014
    • Disclosed is a method for producing a chip card which is provided with a plastic card body (1) comprising several layers, an integrated circuit that is arranged in a chip module (2) and at least two additional electronic components (3,4) for producing an interactive chip card. The components and the chip module are connected to each other by means of strip conductors (4, 5, 9) which are arranged on a carrier layer (8) and metallic contact surfaces (7) which are connected to the conductors. According to the invention, several cover layers (10, 11) are mounted on the conductor carrier layer. Said cover layers are provided with recesses (15, 16, 15′, 16′) corresponding to the metallic contact surfaces (7). The individual card layers of the plastic card body (1) are laminated and as a result the metallic contact surfaces (7) are pushed upwards within the recesses (15, 16, 15′, 16′) of the cover layers (10, 11) to a point where said contact surfaces rest on a cover layer (10) or a thickness compensation layer (12), whereby said recesses are arranged above the contact surfaces. Three-dimensional conductor carrier layers (8) can be easily produced by means of the inventive method in such a way that electronic components of different thicknesses can be introduced into the chip card body without entailing problems.
    • 公开了一种芯片卡的制造方法,该芯片卡设置有包括数层的塑料卡体(1),布置在芯片模块(2)中的集成电路和至少两个附加的电子部件(3,4),用于 制作交互式芯片卡。 组件和芯片模块通过布置在连接到导体的载体层(8)和金属接触表面(7)上的条状导体(4,5,9)彼此连接。 根据本发明,几个覆盖层(10,11)安装在导体载体层上。 所述覆盖层设置有对应于金属接触表面(7)的凹槽(15,16,15',16')。 层压塑料卡体(1)的各卡片层,结果金属接触面(7)在覆盖层(10,11)的凹部(15,16',15',16')内向上推动 )到所述接触表面位于覆盖层(10)或厚度补偿层(12)上的点,由此所述凹部布置在接触表面上方。 可以通过本发明的方法容易地制造三维导体载体层(8),使得可以将不同厚度的电子部件引入芯片卡体中而不引起问题。
    • 5. 发明授权
    • Method for manufacturing a chip card and chip card manufactured in
accordance with said method
    • 用于制造根据所述方法制造的芯片卡和芯片卡的方法
    • US5969951A
    • 1999-10-19
    • US41750
    • 1998-03-13
    • Dirk FischerLothar Fannasch
    • Dirk FischerLothar Fannasch
    • G06K19/077H05K1/11H05K1/14
    • G06K19/0775G06K19/07745G06K19/07749H01L2224/16225H01L2224/16227H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/0102H01L2924/181
    • A method for manufacturing a chip card comprising a multi-layer plastic card body; an integrated circuit arranged within a chip module; at least one coil which serves for the energy supply and/or the data exchange between the integrated circuit with external devices, with the chip module having at least two metallic contacts for an electrically conducting connection of the integrated circuit with the terminals of the coil arranged on a coil carrier layer, comprising the steps of: providing the coil carrier layer with the coil and the coil terminals being arranged on same; providing a cover layer to be applied onto the coil carrier layer on the side of the coil terminals, with the cover layer comprising recesses which correspond to the coil terminals; providing at least one thickness compensation layer to be applied onto the cover layer; stacking of the card layers in registered relationship, with the cover layer being positioned in such a manner that each of the recesses in the cover layer comes to lie in the area of the coil terminals; placing the stacked card layers into a lamination press where the card layers are combined with each other under pressure and heat whereby during lamination synthetic material compound of the coil carrier layer is pressed into the recesses of the cover layer raising the coil terminals; removal of the laminated cards from the lamination press; recess milling of a recess for accommodating the chip module in the laminated card body, whereby the raised coil terminals are exposed; and fitting the chip module into the recess of the card body and making an electrically conducting connection between the contacts of the chip module and the coil terminals.
    • 一种用于制造包括多层塑料卡体的芯片卡的方法; 布置在芯片模块内的集成电路; 至少一个线圈,其用于在具有外部设备的集成电路之间进行能量供应和/或数据交换,所述芯片模块具有至少两个用于集成电路与线圈的端子的导电连接的金属触点, 在线圈载体层上,包括以下步骤:为线圈载体层提供线圈,线圈端子布置在其上; 在线圈端子侧设置覆盖层,覆盖层包括与线圈端子对应的凹部; 提供要施加到覆盖层上的至少一个厚度补偿层; 以层叠的方式堆叠卡层,其中覆盖层被定位成使得覆盖层中的每个凹槽都位于线圈端子的区域中; 将堆叠的卡层放置在层压机中,其中卡层在压力和热量下彼此组合,由此在层压合成材料化合物的线圈载体层中被压入提升线圈端子的覆盖层的凹部中; 从层压机去除层压卡; 用于将芯片模块容纳在层叠的卡体中的凹部的凹部铣削,由此凸起的线圈端子露出; 并将芯片模块装配到卡体的凹部中,并在芯片模块的触点和线圈端子之间形成导电连接。
    • 8. 发明授权
    • Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card
    • 用于层叠在芯片卡内的导体轨道支撑层,包括导体轨道支撑层的芯片卡,以及用于制造芯片卡的方法
    • US06783077B1
    • 2004-08-31
    • US10069419
    • 2002-04-12
    • Lothar Fannasch
    • Lothar Fannasch
    • G06K1906
    • H05K1/183G06K19/077G06K19/07743H05K1/113H05K3/107H05K3/4069H05K2201/09036H05K2203/0156
    • A conductor track supporting layer for laminating inside a chip card includes at least one conductor track and connecting areas that are connected to the conductor track. The conductor track is applied to the conductor track supporting layer during a screen printing method and is made of a screen printing paste. The conductor track supporting layer has indentations which are located in the area of the connecting areas and which are filled with the screen printing paste during the screen printing process. As a result, it is possible to produce conductor track supporting layers provided with connecting areas of varying thicknesses which enable the production of recesses in the chip cards, after the conductor track supporting layers are laminated in chip cards. These recesses expose the connecting i, areas for connection to electronic components. And, the sensitive strip conductors, also located in the chip card, are prevented from becoming damaged.
    • 用于层叠在芯片卡内的导体轨道支撑层包括至少一个导体轨道和连接到导体轨道的连接区域。 在丝网印刷方法中,导体轨迹被施加到导体轨道支撑层,并由丝网印刷浆料制成。 导体轨道支撑层具有位于连接区域的区域中的凹陷,并且在丝网印刷过程中填充有丝网印刷浆料。 结果,在将导体轨道支撑层层压在芯片卡中之后,可以制造设置有可变厚度的连接区域的导体轨道支撑层,这些连接区域能够在芯片卡片中产生凹槽。 这些凹槽暴露连接i,连接到电子元件的区域。 并且,防止也位于芯片卡中的敏感条导体被损坏。