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    • 1. 发明申请
    • EMBEDDED WAVEGUIDE DETECTORS
    • 嵌入式波形检测器
    • US20090269878A1
    • 2009-10-29
    • US12420558
    • 2009-04-08
    • Francisco A. LeonLawrence C. WestYuichi WadaGregory L. WojcikStephen Moffatt
    • Francisco A. LeonLawrence C. WestYuichi WadaGregory L. WojcikStephen Moffatt
    • H01L21/20
    • G02B6/12004G02B2006/12061H01L31/0232H01L31/0288H01L31/105H01L31/1812Y02E10/50
    • A method of fabricating a detector that involves: forming a trench in a substrate, the substrate having an upper surface; forming a first doped semiconductor layer on the substrate and in the trench; forming a second semiconductor layer on the first doped semiconductor layer and extending into the trench, the second semiconductor layer having a conductivity that is less than the conductivity of the first doped semiconductor layer; forming a third doped semiconductor layer on the second semiconductor layer and extending into the trench; removing portions of the first, second and third layers that are above a plane defined by the surface of the substrate to produce an upper, substantially planar surface and expose an upper end of the first doped semiconductor layer in the trench; forming a first electrical contact to the first semiconductor doped layer; and forming a second electrical contact to the third semiconductor doped layer.
    • 一种制造检测器的方法,包括:在衬底中形成沟槽,所述衬底具有上表面; 在所述衬底和所述沟槽中形成第一掺杂半导体层; 在所述第一掺杂半导体层上形成第二半导体层并延伸到所述沟槽中,所述第二半导体层的导电率小于所述第一掺杂半导体层的导电性; 在所述第二半导体层上形成第三掺杂半导体层并延伸到所述沟槽中; 去除在由衬底的表面限定的平面之上的第一层,第二层和第三层的部分,以产生上部基本平坦的表面,并且暴露沟槽中的第一掺杂半导体层的上端; 形成第一电接触到第一半导体掺杂层; 以及向所述第三半导体掺杂层形成第二电接触。
    • 2. 发明授权
    • Embedded waveguide detectors
    • 嵌入式波导检测器
    • US07075165B2
    • 2006-07-11
    • US10856750
    • 2004-05-28
    • Francisco A. LeonLawrence C. WestYuichi WadaGregory L. WojcikStephen Moffatt
    • Francisco A. LeonLawrence C. WestYuichi WadaGregory L. WojcikStephen Moffatt
    • H01L31/075
    • G02B6/12004G02B2006/12061H01L31/0232H01L31/0288H01L31/105H01L31/1812Y02E10/50
    • A method of fabricating a detector that involves: forming a trench in a substrate, the substrate having an upper surface; forming a first doped semiconductor layer on the substrate and in the trench; forming a second semiconductor layer on the first doped semiconductor layer and extending into the trench, the second semiconductor layer having a conductivity that is less than the conductivity of the first doped semiconductor layer; forming a third doped semiconductor layer on the second semiconductor layer and extending into the trench; removing portions of the first, second and third layers that are above a plane defined by the surface of the substrate to produce an upper, substantially planar surface and expose an upper end of the first doped semiconductor layer in the trench; forming a first electrical contact to the first semiconductor doped layer; and forming a second electrical contact to the third semiconductor doped layer.
    • 一种制造检测器的方法,包括:在衬底中形成沟槽,所述衬底具有上表面; 在所述衬底和所述沟槽中形成第一掺杂半导体层; 在所述第一掺杂半导体层上形成第二半导体层并延伸到所述沟槽中,所述第二半导体层的导电率小于所述第一掺杂半导体层的导电性; 在所述第二半导体层上形成第三掺杂半导体层并延伸到所述沟槽中; 去除在由衬底的表面限定的平面之上的第一层,第二层和第三层的部分,以产生上部基本平坦的表面,并且暴露沟槽中的第一掺杂半导体层的上端; 形成第一电接触到第一半导体掺杂层; 以及向所述第三半导体掺杂层形成第二电接触。
    • 6. 发明授权
    • Self-aligned implanted waveguide detector
    • 自对准植入波导检测器
    • US07205624B2
    • 2007-04-17
    • US10959897
    • 2004-10-06
    • Francisco A. LeonLawrence C. West
    • Francisco A. LeonLawrence C. West
    • H01L31/00
    • H01L31/035254B82Y20/00G02B6/12004
    • A method of fabricating a detector, the method including forming an island of detector core material on a substrate, the island having a horizontally oriented top end, a vertically oriented first sidewall, and a vertically oriented second sidewall that is opposite said first sidewall; implanting a first dopant into the first sidewall to form a first conductive region that has a top end that is part of the top end of the island; implanting a second dopant into the second sidewall to form a second conductive region that has a top end that is part of the top end of the island; fabricating a first electrical connection to the top end of the first conductive region; and fabricating a second electrical connection to the top end of the second conductive region.
    • 一种制造检测器的方法,所述方法包括在衬底上形成检测器芯材料岛,所述岛具有水平取向的顶端,垂直取向的第一侧壁和与所述第一侧壁相对的垂直取向的第二侧壁; 将第一掺杂剂注入到所述第一侧壁中以形成具有作为所述岛的顶端的一部分的顶端的第一导电区域; 将第二掺杂剂注入所述第二侧壁中以形成具有作为所述岛的顶端的一部分的顶端的第二导电区域; 制造到第一导电区域的顶端的第一电连接; 以及制造到所述第二导电区域的顶端的第二电连接。
    • 7. 发明授权
    • Solution to thermal budget
    • 热预算解决方案
    • US07101725B2
    • 2006-09-05
    • US10896754
    • 2004-07-22
    • Yuichi WadaFrancisco A. Leon
    • Yuichi WadaFrancisco A. Leon
    • H01L21/00
    • G02B6/12004B82Y20/00C30B29/12C30B33/00G02B6/12G02B6/4214G02B6/43H01L21/84H01L27/1203H01L31/035254
    • A method of fabricating on optical detector, the method including providing a substrate that includes an optical waveguide formed therein and having a surface for fabricating microelectronic circuitry thereon; fabricating microelectronic circuitry on the substrate, the fabricating involving a plurality of sequential process phases; after a selected one of the plurality of sequential process phases has occurred and before the next process phase after the selected one of the plurality of process phases begins, fabricating an optical detector within the optical waveguide; and after fabricating the optical detector in the waveguide, completing the plurality of sequential process phases for fabricating the microelectronic circuitry.
    • 一种在光学检测器上制造的方法,所述方法包括提供包括其中形成的光波导并且具有用于在其上制造微电子电路的表面的衬底; 在衬底上制造微电子电路,该制造涉及多个连续的工艺阶段; 在所述多个顺序处理阶段中的所选择的一个已经发生并且在所述多个处理阶段中所选择的一个处理阶段开始之后的下一个处理阶段之前,在所述光波导内制造光学检测器; 并且在波导中制造光学检测器之后,完成用于制造微电子电路的多个顺序处理阶段。
    • 9. 发明授权
    • Surface sweeping method for surface movement in three dimensional
topography simulation
    • 三维地形模拟中表面移动的表面扫描方法
    • US5586230A
    • 1996-12-17
    • US148181
    • 1993-11-05
    • Francisco A. LeonSatoshi Tazawa
    • Francisco A. LeonSatoshi Tazawa
    • G06F17/50G06T17/10G06T17/00
    • G06T17/10
    • A method for deforming a solid and avoiding the creation of self-intersecting solid structures in a topography simulator. In a topography simulated based on a solids modeling system, self-intersecting structures are solids which have boundaries that intersect. Such self-intersecting structures are invalid and cannot be processed. A general method for sweeping a solid surface to create a deformed solid and avoid the creation of self-intersecting solid structures is described, which include the steps of: providing a material solid with a surface represented as one or more segments; constructing a first segment solid for a first segment; performing a boolean set operation between the solid being swept and the first segment solid creating a temporary first solid; identifying a second segment; constructing a second segment solid for the second segment; and performing the boolean set operation between said temporary first solid and said first segment solid creating said deformed first solid. The case where simultaneous deposition and etch is occurring requires utilizes separate temporary deposition and etch solids for each segment both of which are swept to create the deformed solid.
    • 一种使固体变形并避免在地形模拟器中产生自相交固体结构的方法。 在基于实体建模系统模拟的地形中,自相交结构是具有相交边界的固体。 这种自相交结构无效,无法处理。 描述了用于扫掠固体表面以产生变形固体并避免产生自相交固体结构的一般方法,其包括以下步骤:提供具有表示为一个或多个段的表面的材料固体; 为第一段构造第一段固体; 在被扫描的实体和创建临时的第一实体的第一段固定之间执行布尔组操作; 识别第二段; 为第二段构造第二段实体; 以及在所述临时第一实体和所述第一段固体之间执行布尔组合操作,创建所述变形的第一固体。 同时沉积和蚀刻发生的情况需要对每个段进行单独的临时沉积和蚀刻固体,两个扫描都被扫过以产生变形的固体。