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    • 3. 发明授权
    • LED lamp
    • 点灯
    • US08585244B1
    • 2013-11-19
    • US13565864
    • 2012-08-03
    • Hong-Ping LiuHui-Ju HsuYen-Wei Ho
    • Hong-Ping LiuHui-Ju HsuYen-Wei Ho
    • F21S4/00
    • F21V29/507F21V15/013F21V19/0055F21V21/116F21V29/2212F21W2131/103F21Y2103/10F21Y2115/10
    • An LED lamp includes a heat dissipating base and a plurality of light strips. The heat dissipating base is formed by aluminum extrusion and has a length direction defined by the aluminum extrusion direction. The heat dissipating base has a main body and a plurality of heat dissipating fins. The bottom side of the main body has a flat connecting surface. The heat dissipating fins extend outward from the main body. Each light strip has a circuit board and at least one LED module provided on the circuit board. The circuit board of each light strip is provided on the connecting surface of the heat dissipating base. The width (W1) of the connecting surface of the heat dissipating base is greater than three times the width (W2) of each light strip, i.e., W1>3W2.
    • LED灯包括散热基座和多个光条。 散热基座由铝挤压形成,其长度方向由铝挤压方向限定。 散热基座具有主体和多个散热翅片。 主体的底部具有平坦的连接表面。 散热片从主体向外延伸。 每个灯条具有电路板和设置在电路板上的至少一个LED模块。 每个灯条的电路板设置在散热基座的连接表面上。 散热基座的连接表面的宽度(W1)大于每个光条的宽度(W2)的三倍,即W1> 3W2。
    • 4. 发明授权
    • LED lighting device
    • LED照明装置
    • US08807795B2
    • 2014-08-19
    • US13589495
    • 2012-08-20
    • Hui-Ju HsuHong-Ping LiuYen-Wei Ho
    • Hui-Ju HsuHong-Ping LiuYen-Wei Ho
    • F21S4/00
    • F21V29/15F21V29/74F21Y2103/10F21Y2115/10
    • An LED lighting device at least comprises a base made of metal materials; a substrate which is disposed on a surface of the base and has one electrode and at least one LED chip; and an insulation sheet which is disposed between the base and the substrate. The insulation sheet and the substrate satisfy the correlations L2+2×T≧L1+2×Cr, W2+2×T≧W1+2×Cr and Cr≧1.6 mm. By controlling the dimension of the insulation sheet, a creepage distance between the electrode and the base can be increased, so as to solve the safety problem of lighting devices without increasing manufacturing costs.
    • LED照明装置至少包括由金属材料制成的基座; 基板,其设置在所述基板的表面上,具有一个电极和至少一个LED芯片; 以及设置在基底和基底之间的绝缘片。 绝缘片和基片满足L2 + 2×T≥L1+ 2×Cr,W2 + 2×T≥W1+ 2×Cr,Cr≥1.6mm的关系。 通过控制绝缘片的尺寸,可以增加电极和基座之间的爬电距离,从而解决照明装置的安全问题而不增加制造成本。