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    • 10. 发明授权
    • Substrate support with symmetrical feed structure
    • 具有对称进料结构的基板支撑
    • US09123762B2
    • 2015-09-01
    • US12910547
    • 2010-10-22
    • Xing LinDouglas A. Buchberger, Jr.Xiaoping ZhouAndrew NguyenAnchel Sheyner
    • Xing LinDouglas A. Buchberger, Jr.Xiaoping ZhouAndrew NguyenAnchel Sheyner
    • C23C16/00C23F1/00H01L21/306H01L21/683H01J37/32H01L21/67
    • H01L21/67069H01J37/32532H01J37/32577H01J37/32715H01J37/32724H01L21/6831
    • Apparatus for processing a substrate is disclosed herein. In some embodiments, a substrate support may include a substrate support having a support surface for supporting a substrate the substrate support having a central axis; a first electrode disposed within the substrate support to provide RF power to a substrate when disposed on the support surface; an inner conductor coupled to the first electrode about a center of a surface of the first electrode opposing the support surface, wherein the inner conductor is tubular and extends from the first electrode parallel to and about the central axis in a direction away from the support surface of the substrate support; an outer conductor disposed about the inner conductor; and an outer dielectric layer disposed between the inner and outer conductors, the outer dielectric layer electrically isolating the outer conductor from the inner conductor. The outer conductor may be coupled to electrical ground.
    • 本文公开了用于处理衬底的装置。 在一些实施例中,衬底支撑件可以包括具有用于支撑衬底的支撑表面的衬底支撑件,衬底支撑件具有中心轴线; 设置在所述基板支撑件内的第一电极,用于当设置在所述支撑表面上时向基板提供RF功率; 内部导体,其围绕第一电极的与支撑表面相对的表面的中心耦合到第一电极,其中内部导体是管状的,并且从第一电极沿着远离支撑表面的方向平行于中心轴并围绕中心轴线延伸 的基板支撑; 设置在内部导体周围的外部导体; 以及设置在所述内部和外部导体之间的外部电介质层,所述外部电介质层将所述外部导体与所述内部导体电隔离。 外部导体可以耦合到电气接地。