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1. 发明授权

US07940528B2 Electronic device and heat sink thereof 有权
标题翻译：电子设备及其散热器
公开(公告)号：US07940528B2
公开(公告)日：2011-05-10
申请号：US12539182
申请日：2009-08-11
申请人： Feng-Ku Wang , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/3677 , F28F3/022 , F28F3/06 , G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.
摘要翻译：电子设备包括壳体，热产生元件和散热器。热产生元件设置在壳体内并用于产生热能。散热器包括热转印板和多个可移动热转印构件。热传递板接触热发生元件并且包括多个凹部。每个可移动热传递构件具有重量端和自由端。重物端部容纳在凹部中。由热发生元件产生的热能通过热传递板被传导到可动热传递部件。当壳体倾斜一定角度时，可移动热转印构件相对于热转印板摆动，使得其自由端指向与正常状态下的重力加速度相反的方向。

2. 发明授权

US07826227B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07826227B2
公开(公告)日：2010-11-02
申请号：US12068909
申请日：2008-02-13
申请人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
IPC分类号： H01L23/34 , F28F7/00
CPC分类号： H01L23/467 , F28F1/30 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.
摘要翻译：散热装置设置在电子装置中，与电子装置的电子部件进行热交换。散热装置包括散热片和多个颤振片。散热器附着在电子部件上，以传导电子部件的热能。颤振片设置在散热器上，并且当电子设备移动时，振动片被致动以产生气流，从而干扰电子设备内部的空气，从而达到提高散热性能的目的。

3. 发明授权

US07946336B2 Heat sink structure 有权
标题翻译：散热器结构
公开(公告)号：US07946336B2
公开(公告)日：2011-05-24
申请号：US12071488
申请日：2008-02-21
申请人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.
摘要翻译：散热器用于消散由电子设备的电子部件产生的热能。散热器包括接触底座和散热片底座。接触基座安装在电子部件上以传递热能，翅片基座枢转地连接到接触基底，以便与接触基底传递热能。翅片底座具有多个翅片，并且相对于接触基座旋转。翅片底座的重心偏离旋转轴线。当电子设备移动时，由于重心的偏离，散热片基座旋转以使散热片干扰电子设备内部的空气。

4. 发明申请

US20090211729A1 Heat sink structure 有权
标题翻译：散热器结构
公开(公告)号：US20090211729A1
公开(公告)日：2009-08-27
申请号：US12071488
申请日：2008-02-21
申请人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.
摘要翻译：散热器用于消散由电子设备的电子部件产生的热能。散热器包括接触底座和散热片底座。接触基座安装在电子部件上以传递热能，翅片基座枢转地连接到接触基底，以便与接触基底传递热能。翅片底座具有多个翅片，并且相对于接触基座旋转。翅片底座的重心偏离旋转轴线。当电子设备移动时，由于重心的偏离，散热片基座旋转以使散热片干扰电子设备内部的空气。

5. 发明申请

US20100053892A1 ELECTRONIC DEVICE AND HEAT SINK THEREOF 有权
标题翻译：电子设备及其散热
公开(公告)号：US20100053892A1
公开(公告)日：2010-03-04
申请号：US12539182
申请日：2009-08-11
申请人： Feng-Ku WANG , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
发明人： Feng-Ku WANG , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , F28F3/022 , F28F3/06 , G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.
摘要翻译：电子设备包括壳体，热产生元件和散热器。热产生元件设置在壳体内并用于产生热能。散热器包括热转印板和多个可移动热转印构件。热传递板接触热发生元件并且包括多个凹部。每个可移动热传递构件具有重量端和自由端。重物端部容纳在凹部中。由热发生元件产生的热能通过热传递板被传导到可动热传递部件。当壳体倾斜一定角度时，可移动热转印构件相对于热转印板摆动，使得其自由端指向与正常状态下的重力加速度相反的方向。

6. 发明申请

US20090321055A1 LOOP HEAT PIPE 审中-公开
标题翻译： LOOP热管
公开(公告)号：US20090321055A1
公开(公告)日：2009-12-31
申请号：US12491752
申请日：2009-06-25
申请人： FENG-KU WANG , Chiun-Peng Chen , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
发明人： FENG-KU WANG , Chiun-Peng Chen , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
IPC分类号： F28D15/04
CPC分类号： F28D15/043 , F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A loop heat pipe for heat dissipating to a heat source including a first pipe, a first capillary structure, a second capillary structure, a second pipe, and a working fluid is provided. The first pipe has an evaporating portion adjacent to the heat source and a condensing portion. The first capillary structure is disposed on an inner surface of the first pipe and extends from the evaporating portion to the condensing portion. The second capillary structure is disposed on the inner surface and located within the evaporating portion. The second pipe is connected between the evaporating portion and the condensing portion. The working fluid disposed in the first pipe and the second pipe is capable of being transferred from the evaporating portion to the condensing portion via the second pipe, and is capable of being transferred from the condensing portion to the evaporating portion in the first.
摘要翻译：提供了一种用于散热到包括第一管，第一毛细结构，第二毛细结构，第二管和工作流体的热源的回路热管。第一管具有与热源相邻的蒸发部分和冷凝部分。第一毛细结构设置在第一管的内表面上并从蒸发部延伸到冷凝部。第二毛细结构设置在内表面上并位于蒸发部分内。第二管连接在蒸发部和冷凝部之间。设置在第一管和第二管中的工作流体能够经由第二管从蒸发部转移到冷凝部，并且能够从第一管中的冷凝部转移到蒸发部。

7. 发明申请

US20090201647A1 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US20090201647A1
公开(公告)日：2009-08-13
申请号：US12068909
申请日：2008-02-13
申请人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F1/30 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.
摘要翻译：散热装置设置在电子装置中，与电子装置的电子部件进行热交换。散热装置包括散热片和多个颤振片。散热器附着在电子部件上，以传导电子部件的热能。颤振片设置在散热器上，并且当电子设备移动时，振动片被致动以产生气流，以便干扰电子设备内的空气，从而达到提高散热性能的目的。

8. 发明授权

US07835152B2 Heat dissipating module 有权
标题翻译：散热模块
公开(公告)号：US07835152B2
公开(公告)日：2010-11-16
申请号：US12401098
申请日：2009-03-10
申请人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
发明人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
IPC分类号： H05K7/20 , F28D5/00
CPC分类号： G06F1/203
摘要： A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.
摘要翻译：散热模块包括散热单元，具有位置限制孔的集热板，连接在散热元件和集热板之间的导热构件和固定结构。固定结构包括两个端部，一个弓形弹性部分，以及一个连接到弓形弹性部分并延伸穿过位置限制孔的位置限制部分。每个端部可滑动地设置在集热板上。弓形弹性部分连接在两个端部之间并且适于紧固到集热板和基座，使得电气部件夹在集热板和基座之间。

9. 发明申请

US20090047152A1 SWING TYPE FAN 有权
标题翻译：风扇风扇
公开(公告)号：US20090047152A1
公开(公告)日：2009-02-19
申请号：US12016419
申请日：2008-01-18
申请人： Ting-Chiang Huang , Shaw-Fuu Wang , Shih-Chen Shen , Sheng-Jie Syu
发明人： Ting-Chiang Huang , Shaw-Fuu Wang , Shih-Chen Shen , Sheng-Jie Syu
IPC分类号： F04D33/00
CPC分类号： F04D33/00
摘要： A swing type fan including a frame, a motor, at least one blade, at least one first magnetic element and at least one second magnetic element is provided. The motor is fixed to the frame and has a shaft passing through the frame. The blade is disposed between the shaft and the frame and has a first side and a second side opposite to the first side. The first side of the blade is connected to the frame. The first magnetic element is disposed on the blade and is located between the first side and the second side of the blade. The second magnetic element is connected to the shaft and is corresponding to the first magnetic element. The second side of the blade swings via a magnetic force between the first magnetic element and the second magnetic element as the shaft drives the second magnetic element to rotate.
摘要翻译：提供了包括框架，电动机，至少一个叶片，至少一个第一磁性元件和至少一个第二磁性元件的摆动式风扇。电机固定在框架上，并有一个穿过框架的轴。刀片设置在轴和框架之间，并且具有与第一侧相对的第一侧和第二侧。叶片的第一侧连接到框架。第一磁性元件设置在叶片上并且位于叶片的第一侧和第二侧之间。第二磁性元件连接到轴并且对应于第一磁性元件。当轴驱动第二磁性元件旋转时，刀片的第二侧通过第一磁性元件和第二磁性元件之间的磁力摆动。

10. 发明申请

US20100124026A1 HEAT DISSIPATING MODULE 有权
标题翻译：散热模块
公开(公告)号：US20100124026A1
公开(公告)日：2010-05-20
申请号：US12401098
申请日：2009-03-10
申请人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
发明人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.
摘要翻译：散热模块包括散热单元，具有位置限制孔的集热板，连接在散热元件和集热板之间的导热构件和固定结构。固定结构包括两个端部，一个弓形弹性部分，以及一个连接到弓形弹性部分并延伸穿过位置限制孔的位置限制部分。每个端部可滑动地设置在集热板上。弓形弹性部分连接在两个端部之间并且适于紧固到集热板和基座，使得电气部件夹在集热板和基座之间。

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