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1. 发明申请

US20060120055A1 Locking device for heat sink 失效
标题翻译：散热器锁定装置
公开(公告)号：US20060120055A1
公开(公告)日：2006-06-08
申请号：US11141096
申请日：2005-05-31
申请人： Fang-Xiang Yu , Yih-Jong Hsieh , Shu-Ho Lin
发明人： Fang-Xiang Yu , Yih-Jong Hsieh , Shu-Ho Lin
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A locking device for mounting a heat sink (50) to a heat generating component surrounded by a retention module (60). The locking device includes a first locking member (10), a second locking member (20) and an operating member (30). The first locking member secures a first side of the heat sink with a first side of the retention module. The second locking member is disposed at a second side of the heat sink opposing to the first side. The operating member is pivotably attached to the second locking member and is capable of acting upon the heat sink to drive the second locking member moving from a released position to a locked position. The operating member has a cam (31) and a free end. At the locked position, the cam downwardly depresses the heat sink and upwardly pulls the second locking member, and the free end locks at the retention module.
摘要翻译：一种用于将散热器（50）安装到由保持模块（60）围绕的发热部件的锁定装置。锁定装置包括第一锁定构件（10），第二锁定构件（20）和操作构件（30）。第一锁定构件用保持模块的第一侧固定散热器的第一侧。第二锁定构件设置在散热器的与第一侧相对的第二侧。操作构件可枢转地附接到第二锁定构件并且能够作用在散热器上以驱动第二锁定构件从释放位置移动到锁定位置。操作构件具有凸轮（31）和自由端。在锁定位置，凸轮向下按压散热器并向上拉动第二锁定构件，并且自由端锁定在保持模块上。

2. 发明授权

US07283367B2 Locking device for heat sink 失效
标题翻译：散热器锁定装置
公开(公告)号：US07283367B2
公开(公告)日：2007-10-16
申请号：US11141096
申请日：2005-05-31
申请人： Fang-Xiang Yu , Yih-Jong Hsieh , Shu-Ho Lin
发明人： Fang-Xiang Yu , Yih-Jong Hsieh , Shu-Ho Lin
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A locking device for mounting a heat sink (50) to a heat generating component surrounded by a retention module (60). The locking device includes a first locking member (10), a second locking member (20) and an operating member (30). The first locking member secures a first side of the heat sink with a first side of the retention module. The second locking member is disposed at a second side of the heat sink opposing to the first side. The operating member is pivotably attached to the second locking member and is capable of acting upon the heat sink to drive the second locking member moving from a released position to a locked position. The operating member has a cam (31) and a free end. At the locked position, the cam downwardly depresses the heat sink and upwardly pulls the second locking member, and the free end locks at the retention module.
摘要翻译：一种用于将散热器（50）安装到由保持模块（60）围绕的发热部件的锁定装置。锁定装置包括第一锁定构件（10），第二锁定构件（20）和操作构件（30）。第一锁定构件用保持模块的第一侧固定散热器的第一侧。第二锁定构件设置在散热器的与第一侧相对的第二侧。操作构件可枢转地附接到第二锁定构件并且能够作用在散热器上以驱动第二锁定构件从释放位置移动到锁定位置。操作构件具有凸轮（31）和自由端。在锁定位置，凸轮向下按压散热器并向上拉动第二锁定构件，并且自由端锁定在保持模块上。

3. 发明申请

US20060232943A1 Heat dissipating device for electronic component 失效
标题翻译：电子元件散热装置
公开(公告)号：US20060232943A1
公开(公告)日：2006-10-19
申请号：US11107039
申请日：2005-04-15
申请人： Richard Tseng , Rong-Che Chen , Yih-Jong Hsieh , Chien-Yi Lo
发明人： Richard Tseng , Rong-Che Chen , Yih-Jong Hsieh , Chien-Yi Lo
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H05K7/20445 , H01L2924/00
摘要： A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.
摘要翻译：散热装置用于夹在主板和底盘之间，用于将热量从主板传送到底盘。散热装置包括与母板的底侧接触的主体和从主体延伸的多个翼。每个翼包括从主体延伸的连接部分和从连接部分进一步延伸以与底架接触的接触部分。主体与主板的底面在与发热电子部件安装在主板顶部相对应的位置处接合。由电子部件产生的热量通过母板和散热装置传递到底盘。散热装置通过对导热性高的金属板进行冲压而形成。

4. 发明授权

US07304854B2 Heat dissipating device for electronic component 失效
标题翻译：电子元件散热装置
公开(公告)号：US07304854B2
公开(公告)日：2007-12-04
申请号：US11107039
申请日：2005-04-15
申请人： Richard Tseng , Rong-Che Chen , Yih-Jong Hsieh , Chien-Yi Lo
发明人： Richard Tseng , Rong-Che Chen , Yih-Jong Hsieh , Chien-Yi Lo
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H05K7/20445 , H01L2924/00
摘要： A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.
摘要翻译：散热装置用于夹在主板和底盘之间，用于将热量从主板传送到底盘。散热装置包括与母板的底侧接触的主体和从主体延伸的多个翼。每个翼包括从主体延伸的连接部分和从连接部分进一步延伸以与底架接触的接触部分。主体与主板的底面在与发热电子部件安装在主板顶部相对应的位置处接合。由电子部件产生的热量通过母板和散热装置传递到底盘。散热装置通过对导热性高的金属板进行冲压而形成。

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