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    • 10. 发明授权
    • Laser-beam machining method, laser-beam machining device and auxiliary tool for piercing
    • 激光束加工方法,激光束加工装置和穿刺辅助工具
    • US06335507B1
    • 2002-01-01
    • US09401942
    • 1999-09-23
    • Yoshinori NakataAtsushi MoriTadashi Kurosawa
    • Yoshinori NakataAtsushi MoriTadashi Kurosawa
    • B23K2600
    • B23K26/1482B23K26/0665B23K26/14B23K26/142B23K26/1436B23K26/1476B23K26/382B23K26/40B23K2103/04B23K2103/50
    • A piercing nozzle (2) having a nozzle hole (2a) larger than the diameter of a converged laser beam (10) and smaller than the diameter of a hole (1a) of a cutting nozzle (1) is in use. Further, an underlay (3) having a hole (3a) at a position corresponding to the nozzle hole (2a) is placed under the piercing nozzle (2) through a clearance (5). Piercing is carried out by irradiating the laser beam (10) to a machining target (6) through nozzle holes (1a, 2a) and (3a) on condition that a laser oscillator is set to output high power. The diameter of a hole machined by the piercing is small, and less scattered dross is produced. The scattered dross is cooled down within the clearance (5) and is then dropped down to the underlay (3), so that the adhesion of the scattered dross to the machining target does not occur. Since a small hole is machined with the high power, the machining time for piercing is remarkably shortened.
    • 使用具有大于会聚的激光束(10)的直径并且小于切割喷嘴(1)的孔(1a)的直径的喷嘴孔(2a)的穿刺喷嘴(2)。 此外,在与喷嘴孔(2a)对应的位置具有孔(3a)的底垫(3)通过间隙(5)放置在穿刺喷嘴(2)的下方。 在激光振荡器设定为输出高功率的条件下,通过喷嘴孔(1a,2a)和(3a)将激光束(10)照射到加工对象(6)上来进行穿孔。 由穿孔机加工的孔的直径小,产生较少散落的渣滓。 分散的渣滓在间隙(5)内被冷却,然后下降到底层(3),使得不会发生散射浮渣对加工对象的粘附。 由于通过高功率加工小孔,所以穿孔加工时间显着缩短。