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1. 发明专利

DE69519346D1 未知
公开(公告)号：DE69519346D1
公开(公告)日：2000-12-14
申请号：DE69519346
申请日：1995-08-17
申请人： KAWASAKI STEEL CO , FURUKAWA ELECTRIC CO LTD
发明人： UESUGI YASUJI , NISHIYAMA NAOKI , IKEDA RINSEI , HASHIGUCHI KOICHI , MATSUMOTO YOSHIHIRO , NABAE MOTOHIRO , KURIHARA MASAAKI
IPC分类号： B05D7/00 , C23C28/00 , B32B15/08
摘要： An aluminum alloy sheet combining excellent press formability and spot weldability is disclosed. A chromate film of about 1.0 to 50.0 mg/m expressed in terms of metallic chromium is formed as a first layer on an aluminum alloy sheet, and an organic resin film containing about 60-95 % by weight of organic lubricant and having a thickness of 0.02 to 0.90 mu m in terms of dry thickness is formed as a second layer on the chromate film. As the organic lubricant, a high-density polyethylene having a mean molecular weight of about 900 to 15,000 and a density of about 0.93 g/ml or more is preferable. This aluminum alloy sheet can be effectively used for automobile body applications.

2. 发明专利

CA2156477A1 ALUMINUM ALLOY SHEET HAVING EXCELLENT PRESS FORMABILITY AND SPOT WELDABILITY 未知
公开(公告)号：CA2156477A1
公开(公告)日：1996-02-20
申请号：CA2156477
申请日：1995-08-18
申请人： KAWASAKI STEEL CO , FURUKAWA ELECTRIC CO LTD
发明人： UESUGI YASUJI , NISHIYAMA NAOKI , IKEDA RINSEI , HASHIGUCHI KOICHI , MATSUMOTO YOSHIHIRO , NABAE MOTOHIRO , KURIHARA MASAAKI
IPC分类号： B05D7/00 , C23C28/00 , B32B15/08
摘要： An aluminum alloy sheet combining excellent press formability and spot weldability is disclosed. A chromate film of about 1.0 to 50.0 mg/m2 expressed in terms of metallic chromium is formed as a first layer on an aluminum alloy sheet, and an organic resin film containing about 60-95 % by weight of organic lubricant and having a thickness of 0.02 to 0.90 .mu.m in terms of dry thickness is formed as a second layer on the chromate film. As the organic lubricant, a high-density polyethylene having a mean molecular weight of about 900 to 15,000 and a density of about 0.93 g/ml or more is preferable. This aluminum alloy sheet can be effectively used for automobile body applications.

3. 发明专利

DE69519346T2 未知
公开(公告)号：DE69519346T2
公开(公告)日：2001-04-12
申请号：DE69519346
申请日：1995-08-17
申请人： KAWASAKI STEEL CO , FURUKAWA ELECTRIC CO LTD
发明人： UESUGI YASUJI , NISHIYAMA NAOKI , IKEDA RINSEI , HASHIGUCHI KOICHI , MATSUMOTO YOSHIHIRO , NABAE MOTOHIRO , KURIHARA MASAAKI
IPC分类号： B05D7/00 , C23C28/00 , B32B15/08
摘要： An aluminum alloy sheet combining excellent press formability and spot weldability is disclosed. A chromate film of about 1.0 to 50.0 mg/m expressed in terms of metallic chromium is formed as a first layer on an aluminum alloy sheet, and an organic resin film containing about 60-95 % by weight of organic lubricant and having a thickness of 0.02 to 0.90 mu m in terms of dry thickness is formed as a second layer on the chromate film. As the organic lubricant, a high-density polyethylene having a mean molecular weight of about 900 to 15,000 and a density of about 0.93 g/ml or more is preferable. This aluminum alloy sheet can be effectively used for automobile body applications.

4. 发明专利

JP2000178670A COPPER ALLOY FOR SEMICONDUCTOR LEAD FRAME 失效
公开(公告)号：JP2000178670A
公开(公告)日：2000-06-27
申请号：JP35288698
申请日：1998-12-11
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MIHARA KUNITERU , KURIHARA MASAAKI , HIRAI TAKAO , YOSHIDA KOICHI
IPC分类号： H01L23/48 , C22C9/04 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy for a semiconductor lead frame excellent in strength, electroconductivity, bending workability, punching press workability or the like, further small in the softening characteristics of stress relaxation, moreover low in the sensitivity of stress corrosion cracking and improved in heat resistance. SOLUTION: A copper alloy having a compsn. contg., by weight, 5 to

5. 发明专利

JP2000080426A COPPER ALLOY FOR ELECTRONIC EQUIPMENT 失效
公开(公告)号：JP2000080426A
公开(公告)日：2000-03-21
申请号：JP24705798
申请日：1998-09-01
申请人： FURUKAWA ELECTRIC CO LTD
发明人： HIRAI TAKAO , KURIHARA MASAAKI , MIHARA KUNITERU
IPC分类号： H01L23/48 , C22C9/04
摘要： PROBLEM TO BE SOLVED: To obtain an alloy sufficiently applicable even to a multipin lead frame or the like by using a Cu-Zn alloy as the base and improving its stress corrosion cracking by the addition of specified amounts of Mn and/or Al and the control of the crystal grain size to a specified range. SOLUTION: This copper alloy for electronic equipment is the one having a compsn. contg., by weight 5 to 35% Zn and at least one kind of Mn and Al by 0.5 to 3% in total, contg., at need, at least one kind among Pb, Bi, Se, Te, Ca, Sr and rare earth elements by 0.001 to 0.5% in total, and the balance Cu and having 5 to 35 μm crystal grain size. Mn or Al contributes to the improvement of the strength and the improvement of the stress corrosion cracking resistance, in the case of 3%, its electric conductivity and castability deteriorate. Moreover, as to the crystal grain size, both in the case of 35 μm, its bending workability and stress corrosion cracking resistance are not sufficiently improved.

6. 发明专利

JPH11111783A PLATE FOR REINFORCING CARRIER TAPE 失效
公开(公告)号：JPH11111783A
公开(公告)日：1999-04-23
申请号：JP28927497
申请日：1997-10-07
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KURIHARA MASAAKI , HIRAI TAKAO , UNO GAKUO
IPC分类号： C22C9/04 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To improve the strength round device holes and mold sealing resin adhesion by mounting a Cu-Zn alloy reinforcing plate round the device holes; the alloy having specified Zn content. SOLUTION: A carrier tape-reinforcing plate uses a Cu-Zn alloy having a Zn content of 5-36 wt.%. If the Zn content is less than 5 wt.%, the Zn addition less improves the strength and provides a less adhesion to a resin when the surface is oxidized at heating steps. If the Zn content exceeds 36 wt.%, the β-phase much appears to cause cold cracking, thus deteriorating the cold workability to make the thin reinforcing plate hard to be worked, causing troubles in productivity. Thus it is possible to supply carrier tape reinforcing plates superior in strength, resin adhesion and productivity at a low cost.

7. 发明专利

JPH1136028A LEAD FRAME FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1136028A
公开(公告)日：1999-02-09
申请号：JP13518298
申请日：1998-05-18
申请人： FURUKAWA ELECTRIC CO LTD , SHINKO ELECTRIC IND CO
发明人： KURIHARA MASAAKI , EGUCHI TATSUHIKO , HIRAI TAKAO
IPC分类号： C22C9/04 , H01L23/48 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for semiconductor device, excellent in blankability, corrosion resistance, bendability, stress corrosion cracking resistance, strength, electric conductivity, manufacturability, etc. SOLUTION: Pd is formed into lamellar state on a copper alloy member having a composition consisting of, by weight, 5-35% Zn, 0.1-3% Sn, and the balance Cu with inevitable impurities and also having 5-35 μ grain size. Moreover, this copper alloy can further contain 0.001-0.5 wt.%, in total, of one or >=2 elements selected from the group consisting of Pb, Bi, Se, Te, Ca, Sr, and rare earth elements and can further contain 0.001-1 wt.%, in total, of one or >=2 elements selected from the group consisting of Ni, Si, Cr, Zr, Fe, Co, Mn, Al, Ag, Mg, and P.

8. 发明专利

JPH1136027A LEAD FRAME FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1136027A
公开(公告)日：1999-02-09
申请号：JP13518198
申请日：1998-05-18
申请人： FURUKAWA ELECTRIC CO LTD , SHINKO ELECTRIC IND CO
发明人： KURIHARA MASAAKI , EGUCHI TATSUHIKO , HIRAI TAKAO
IPC分类号： C23C28/02 , C22C9/04 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for semiconductor device, excellent in blankability, corrosion resistance, stress corrosion cracking resistance, strength, electric conductivity, manufacturability, etc. SOLUTION: Pd is formed into lamellar state on a copper alloy member having a composition consisting of, by weight, 5-35% Zn, 0.1-3% Sn, and the balance Cu with inevitable impurities. This copper alloy can further contain 0.001-0.5 wt.%, in total, of one or >=2 elements selected from the group consisting of Pb, Bi, Se, Te, Ca, Sr, and rare earth elements and can further contain 0.001-1 wt.%, in total, of one or >=2 elements selected from the group consisting of Ni, Si, Cr, Zr, Fe, Co, Mn, Al, Ag, Mg, and P.

9. 发明专利

JPH03285337A WIRE BONDING DEVICE AND WIRE BONDING 失效
公开(公告)号：JPH03285337A
公开(公告)日：1991-12-16
申请号：JP8300390
申请日：1990-03-31
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KURIHARA MASAAKI , TANIGAWA TORU
IPC分类号： H01L21/60
摘要： PURPOSE:To remove an external terminal film and to perform a good direct bonding by a method wherein the external terminals of a lead frame and the like are preheated in a reducing atmosphere in a transfer part, by which the external terminals are carried to a bonding part. CONSTITUTION:A transfer part 8 and a bonding part 9 are respectively provided with heater blocks 3 and 4. These blocks 3 and 4 are constituted in such a way that a temperature control can be performed independently to the blocks 3 and 4 by temperature control means 5a and 5b. Moreover, a ceiling plate 6 for gas shielding use is provided over the upper surfaces of the parts 8 and 9. One part of this plate 6 is opened at the part 9 so that a capillary pinching a wire can be made to descend. Reducing gas is made to flow on the peripheries of the parts 8 and 9 to perform a gas shielding and at the same time, the blocks 3 and 4 are respectively set into a prescribed temperature and a lead frame 2 with semiconductor chips 1 die bonded thereon is moved from the left direction to the right direction of the paper surface at a prescribed speed and a wire bonding is performed in order.

10. 发明专利

JPH03245560A LEAD FRAME 失效
公开(公告)号：JPH03245560A
公开(公告)日：1991-11-01
申请号：JP4129390
申请日：1990-02-23
申请人： FURUKAWA ELECTRIC CO LTD
发明人： TANIGAWA TORU , KURIHARA MASAAKI
IPC分类号： H01L23/50
摘要： PURPOSE:To enable a lead frame to cope with a die provided with a large number of pins by a method wherein the width of an inner lead except its bonding part located at its tip is smaller than that of the bonding part, and the bonding parts are arranged so as to protrude alternately. CONSTITUTION:In a lead frame 1, the width 5 of an inner lead 3 extending toward a die pad 2 of the lead frame 1 is smaller than that of a wire bonding part 4 of the inner lead 3. The inner leads 3 formed as above are arranged so as to extend their bonding parts 4 alternately toward the die pad 2.

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