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1. 发明授权

US6360762B2 Method for feeding gases for use in semiconductor manufacturing 有权
标题翻译：供应用于半导体制造的气体的方法
公开(公告)号：US6360762B2
公开(公告)日：2002-03-26
申请号：US76566501
申请日：2001-01-22
申请人： FUJIKIN KK , TOKYO ELECTRON LTD
发明人： KITAYAMA HIROFUMI , KURONO YOICHI , IKEDA NOBUKAZU , MASUDA NAOYA
IPC分类号： C23C16/44 , C23C16/455 , F17D1/04 , H01L21/00 , H01L21/205 , H01L21/302 , H01L21/3065 , F16K31/02
CPC分类号： H01L21/67017 , C23C16/44 , C23C16/455 , C23C16/45561 , F17D1/04 , G05D7/0641 , Y10T137/0318 , Y10T137/0352 , Y10T137/86389 , Y10T137/87314 , Y10T137/87676 , Y10T137/87692
摘要： An apparatus for feeding gases for use in semiconductor manufacturing reduced in size and manufacturing costs and facilitating maintenance and operation of the gas supply system. The apparatus comprises a plurality of gas supply sources, gas source valves provided on the gas lead-out pipes from the respective gas supply sources, flow rate controllers provided on main gas feed pipes into which the lead-out pipes converge, and gas supply valves provided on the outlet side of the flow rate controllers.
摘要翻译：用于半导体制造中供给气体的装置减小了尺寸和制造成本，并促进了供气系统的维护和运行。该装置包括多个气体供给源，从各个气体供给源设置在气体导出管上的气体源，设置在引出管汇接的主要供气管上的流量控制器，以及气体供给阀设置在流量控制器的出口侧。

2. 发明专利

JP2000323464A APPARATUS AND METHOD FOR SUPPLYING GAS FOR SEMICONDUCTOR MANUFACTURING APPARATUS 失效
公开(公告)号：JP2000323464A
公开(公告)日：2000-11-24
申请号：JP2000103112
申请日：2000-04-05
申请人： TOKYO ELECTRON LTD , FUJIKIN KK
发明人： KITAYAMA HIROBUMI , KURONO YOICHI , IKEDA SHINICHI , MASUDA HISAYA
IPC分类号： C23C16/44 , C23C16/455 , F17D1/04 , H01L21/00 , H01L21/205 , H01L21/302 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To downsize the apparatus and reduce the manufacturing cost and maintenance control cost by grouping the same or a plurality of kinds of gases to be fed to a semiconductor device so that the gas in one group is fed to the semiconductor device economically through one flow rate controller. SOLUTION: Required gases are fed from gas feeders A1 to A3 to various processes B1 to B3 executed in a process reactor R.R forming a part of a semiconductor manufacturing apparatus. For the process B1 e.g. in the reactor R.R, a gas feed valve V1 is opened and gas feed valves V2, V3 are closed, and gases in gas feed sources G1 to G4 are switched and fed from a gas supply A1 one after another into the reactor R.R, wherein the gases from the feed sources G1 to G4 are sent to the gas feed valve V1 through gas feed side valves VG1 to VG4 via one flow rate controller FRC and a gas take-out hole F1.

3. 发明专利

JPH067572B2 失效
公开(公告)号：JPH067572B2
公开(公告)日：1994-01-26
申请号：JP29964786
申请日：1986-12-16
申请人： TOKYO ELECTRON LTD
发明人： KURONO YOICHI
IPC分类号： H01L21/66 , G01R31/26 , H01L21/673 , H01L21/68

4. 发明专利

JPH03135021A TREATMENT APPARATUS 失效
公开(公告)号：JPH03135021A
公开(公告)日：1991-06-10
申请号：JP27334189
申请日：1989-10-20
申请人： TOKYO ELECTRON LTD
发明人： KURONO YOICHI , KAGATSUME SATORU
IPC分类号： C23C14/56 , H01L21/302 , H01L21/3065 , H01L21/31
摘要： PURPOSE:To enhance a throughput by a method wherein a whole system composed of a treatment chamber, a sender part, a receiver part and a conveyance mechanism is housed inside the same vacuum system and it is treated by one vacuum suction operation. CONSTITUTION:When the inside of a unit chamber 20 is in a prescribed vacuum state, a sender part 24 is opened to the air and a carrier 33 on which many untreated wafers are placed is housed in it; a receiver part 25 is opened to the air and an empty carrier 34 is housed in it. Then, the inside of the sender part 24 and the inside of the receiver part 25 are set to the same vacuum state as the inside of the chamber 20. One wafer is taken out from the carrier 33 by using a handling arm 21; it is placed on an alignment station 22 and is aligned; after that, the wafer is conveyed to an electrode 41 in a process chamber part 26. Then, an elevator mechanism 50 is driven; an airtight chamber 30 is formed; electric power is applied between the electrode 41 and an amorphous carbon electrode 45; a prescribed etching treatment gas is supplied to an airtight chamber 53; then, the gas is transformed into a plasma; and the surface of a semiconductor wafer is etched.

5. 发明专利

JPH01102315A DETECTING METHOD OF POSITION OF ROTARY BODY 失效
公开(公告)号：JPH01102315A
公开(公告)日：1989-04-20
申请号：JP26103387
申请日：1987-10-16
申请人： TOKYO ELECTRON LTD
发明人： KURONO YOICHI , OSHIRO HIROTOSHI
IPC分类号： G01D5/249
摘要： PURPOSE:To provide a detecting method enabling the prevention of an accident or the like in operation and the execution of a stable processing, by detecting the position of a rotary body from a fixed absolute position so as to know the position of the rotating rotary body accurately at all times. CONSTITUTION:A motor 5 provided with a rotary shaft 4 piercing rotatably through a hole 2 of a fixed element 1 is fixed 1, and a rotary body (arm) 7 is connected to the end part of the shaft 4 through the intermediary of a connecting element 6 so that it can be rotated with the rotation of the motor 5. When a semiconductor wafer 9 is set in a setting element provided on the rotary body 7 and the motor 5 is driven, the rotary body 7 is rotated and the wafer 9 is subjected to a conveyance processing. By the operations of a sensor 11 provided on the rotary body 7 and a position information plate 12 fixed on the fixed element, the absolute position of the rotary body 7 itself is detected, and a control element 14 conducts a position control on the basis of the position data thus obtained. Since a position information on an absolute value of the rotating rotary body is detected, according to this constitution, it is possible to prevent the occurrence of an accident or the like due to the imperfection of mechanical connection and thus to execute a reliable and stable processing.

6. 发明专利

JPS648630A CLEANING METHOD 失效
公开(公告)号：JPS648630A
公开(公告)日：1989-01-12
申请号：JP16474187
申请日：1987-06-30
申请人： TOKYO ELECTRON LTD
发明人： AMAMIYA YUTAKA , IIMURO SHUNICHI , KONISHI NOBUO , KURONO YOICHI
IPC分类号： B08B3/02 , H01L21/304
摘要： PURPOSE:To prevent a static electricity from generating due to a collision when cleaning fluid is injected to a matter to be cleaned or a friction of air by dissolving ozone in water, and cleaning the matter to perform oxidative destruction of organic materials, on the matter to be cleaned. CONSTITUTION:An upper chamber 1 is raised, a semiconductor wafer 11 is conveyed into a cleaning chamber, supported fixedly on an induction motor 10, and the chamber 1 is moved down to be connected to a lower chamber 2. The chamber is sealed in this state. Then, pure water is introduced by a pure water inlet tube 5 into a bubbler tank 4, ozone is introduced by an ozone inlet tube 6 which is arrived at the bottom of the tank 4 through the upper face of the tank 4, bubbled in the tank 4 to dissolve the ozone in the water. Cleaning fluid formed by the dissolving is injected through a supply tube by a high pressure pump 7 from a high pressure nozzle 3 provided at the center of the upper face of the chamber 1 on a semiconductor wafer 11 which is, for example, rotated at 1000rpm by the motor 10. Thus, organic materials on the wafer 11 is subjected to oxidative destruction.

7. 发明专利

JPH04264715A VERTICAL BATCH TREATMENT DEVICE 失效
公开(公告)号：JPH04264715A
公开(公告)日：1992-09-21
申请号：JP4604291
申请日：1991-02-19
申请人： TOKYO ELECTRON LTD , TEL SAGAMI LTD
发明人： KURONO YOICHI , HANDA SAKAE
IPC分类号： H01L21/30 , H01J37/32 , H01L21/00 , H01L21/027 , H01L21/302 , H01L21/3065
摘要： PURPOSE:To separate generated plasma and a treatment object in a vertical batch treatment device and to restrain damage of a semiconductor wafer caused by plasma. CONSTITUTION:In a vertical batch treatment device wherein a plurality of treatment objects 12 contained in a reaction tube 6 erected perpendicularly are made to be treated by plasma P, a plurality of electrodes 25 for generating plasma P are provided to an outer periphery of the reaction tube 6, an inside tube 7 having a plurality of hole parts 9 is provided concentrically inside the reaction tube 6 and plasma P is formed between the reaction tube 6 and the inside tube 7 to separate the plasma and the treatment object.

8. 发明专利

JPH0422337B2 失效
公开(公告)号：JPH0422337B2
公开(公告)日：1992-04-16
申请号：JP7996585
申请日：1985-04-15
申请人： TOKYO ELECTRON LTD
发明人： KURONO YOICHI , INOE JUNICHI
IPC分类号： G01R31/26 , H01L21/66

9. 发明专利

JPS61237444A HANDLER DEVICE FOR INSPECTING IC PRODUCT 失效
公开(公告)号：JPS61237444A
公开(公告)日：1986-10-22
申请号：JP7996585
申请日：1985-04-15
申请人： TOKYO ELECTRON LTD
发明人： KURONO YOICHI , INOUE JUNICHI
IPC分类号： G01R31/26 , H01L21/66
摘要： PURPOSE:To eliminate the need for the positioning of a measuring operator, and to automate the titled device by capturing the packaging external form of an IC product, the shape of an IC lead and printed characters on the IC product in plane pictures, A/D converting an output and comparing the output with a previously inputted reference data. CONSTITUTION:Printed characters on the surface of an IC product are read from an image pickup device 3, and transmitted over a processor 2. A stopper device 5 is driven in response to a signal, and brought into contact with a tester conductor 8, thus inspecting the IC product. The shape of IC Leads and a packaging external form are also photographed, signals 53, 54, 56 are outputted in response to the results of comparisons with a shape reference data memory of the shapes of the IC leads, and a lifting gear 57 is lifted when there is a defect, and the IC product is not positioned, and is carried directly to a selector 9. A positioning processor outputs the signal 53 in an IC product having no defect, the stopper is adjusted at a specified position, an IC product circuit is combined, and a tester is operated, thus inspecting the IC product. Acceptables and defectives are carried to respective housing section.

10. 发明专利

JPH07209377A IC HANDLER AND PROBING METHOD FOR IC 失效
公开(公告)号：JPH07209377A
公开(公告)日：1995-08-11
申请号：JP514995
申请日：1995-01-17
申请人： TOKYO ELECTRON LTD
发明人： KURONO YOICHI
IPC分类号： G01R31/26 , H01L21/66 , H01L21/673 , H01L21/68 , H01L21/683
摘要： PURPOSE:To provide an IC handier, and a probing method for IC, in which IC products of different shapes can be carried while being arranged in one carrier through a containing jig. CONSTITUTION:The IC handler comprises a plurality of types of containing jig 11 of predetermined outer profile each having a part 11a for housing one of A plurality of IC products having different profiles, and a carrier 12 having a plurality of parts 12a for housing the jigs 11 and carrying various types of IC products 10 arranged and housing in the parts 12a through the jigs 11.

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