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    • 10. 发明申请
    • WAFER TAPING
    • WO2010077597A2
    • 2010-07-08
    • PCT/US2009/066961
    • 2009-12-07
    • FUJIFILM DIMATIX, INC.DEMING, SteveBIRKMEYER, JeffreySCHNEIDER, David W.BIBL, Andreas
    • DEMING, SteveBIRKMEYER, JeffreySCHNEIDER, David W.BIBL, Andreas
    • H01L21/50
    • H01L21/67132
    • A method for applying tape to a substrate can include positioning a tape proximate and substantially parallel to a surface of a substrate. A pressure source can be configured to apply pressure to a region of tape smaller than the surface in both an x direction and y direction, the x and y directions being parallel to the surface and perpendicular to one another. For example, the pressure source can be a stream of fluid such as air. Pressure can be applied to a side of the tape opposite the surface in a region smaller than the surface to cause the tape to adhere to the substrate opposite the region. The region can be moved relative to the substrate in an outward radial direction while applying the pressure. The region can be moved such that no unadhered region of tape is enclosed by any adhered region of tape.
    • 用于将带施加到基底的方法可以包括将带定位成接近并基本平行于基底的表面。 压力源可以被构造成在x方向和y方向上向比表面小的带的区域施加压力,x方向和y方向平行于表面并且彼此垂直。 例如,压力源可以是诸如空气的流体流。 可以将压力施加到胶带的与表面相反的小于表面的区域,以使胶带粘附到与该区域相对的基板上。 该区域可以在施加压力的同时沿径向向外的方向相对于衬底移动。 该区域可以移动,使得没有未粘附的胶带区域被任何粘附的胶带区域所包围。