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1. 发明申请

WO2009042976A2 APPARATUS FOR TESTING DEVICES 审中-公开
标题翻译：设备测试设备
公开(公告)号：WO2009042976A2
公开(公告)日：2009-04-02
申请号：PCT/US2008078036
申请日：2008-09-26
申请人： FORMFACTOR INC , HOBBS ERIC D , KAWAMATA NOBUHIRO , MCFARLAND ANDREW W , URAKAWA YOICHI , REYNOLDS CARL V
发明人： HOBBS ERIC D , KAWAMATA NOBUHIRO , MCFARLAND ANDREW W , URAKAWA YOICHI , REYNOLDS CARL V
IPC分类号： H01L21/66
CPC分类号： G01R31/2863 , G01R31/2889 , G01R31/31905
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
摘要翻译：本文提供了用于测试半导体器件的方法和设备。在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件和布置在热障下面的探针卡组件的部分之间的热传递。

2. 发明申请

WO2008082859A3 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：强化装置与测试装置一起使用
公开(公告)号：WO2008082859A3
公开(公告)日：2008-11-27
申请号：PCT/US2007086892
申请日：2007-12-08
申请人： FORMFACTOR INC , HOBBS ERIC D , MCFARLAND ANDREW W
发明人： HOBBS ERIC D , MCFARLAND ANDREW W
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道外部成员。

3. 发明申请

WO2009105497A2 APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES 审中-公开
标题翻译：用于调节机电组件的热引起的运动的装置和方法
公开(公告)号：WO2009105497A2
公开(公告)日：2009-08-27
申请号：PCT/US2009034440
申请日：2009-02-19
申请人： FORMFACTOR INC , MCFARLAND ANDREW W , YASUMURA KEVIN Y , HOBBS ERIC D , BREINLINGER KEITH J
发明人： MCFARLAND ANDREW W , YASUMURA KEVIN Y , HOBBS ERIC D , BREINLINGER KEITH J
IPC分类号： H01L21/66 , G01R1/073
CPC分类号： G01R1/44 , G01R1/07307 , G01R31/2891
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.
摘要翻译：一种用于调节机电组件的一个或多个热感应运动的热调节装置包括：补偿元件，其以不同于第二速率的第一速率膨胀，在第一速率下机电组件膨胀以响应于变化而产生反作用力温度; 以及将补偿元件联接到机电组件的联接机构，并且该联接机构可调节以随着温度改变来控制施加到机电组件的抵抗力的量。

4. 发明申请

WO2009042679A3 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：强化装置与测试装置一起使用
公开(公告)号：WO2009042679A3
公开(公告)日：2009-07-09
申请号：PCT/US2008077512
申请日：2008-09-24
申请人： FORMFACTOR INC , HOBBS ERIC D , MCFARLAND ANDREW W
发明人： HOBBS ERIC D , MCFARLAND ANDREW W
IPC分类号： G01R1/067 , H01L21/66 , H01R12/00
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

5. 发明申请

WO2010018463A3 PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES 审中-公开
标题翻译：探针卡组件探针头控制机构
公开(公告)号：WO2010018463A3
公开(公告)日：2010-05-06
申请号：PCT/IB2009007028
申请日：2009-10-03
申请人： FORMFACTOR INC , MCFARLAND ANDREW W , LIEW BRANDON , PORTER JAMES M , YASUMURA KEVIN Y
发明人： MCFARLAND ANDREW W , LIEW BRANDON , PORTER JAMES M , YASUMURA KEVIN Y
IPC分类号： G01R31/28 , G01R1/073
CPC分类号： G01R31/2891 , G01R1/07342
摘要： A probe card assembly includes a first probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, a second probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, and a controlling mechanism coupled to the first and second probe heads for controlling movement of the first and second probe heads in a first direction substantially parallel to the respective surfaces more than in a second direction substantially normal to the respective surfaces.
摘要翻译：探针卡组件包括具有设置在相应表面上的接触元件的第一探针头，用于形成与相应电子设备的对应端子的电接触;第二探针头，具有设置在相应表面上的接触元件，用于形成与对应电子装置以及耦合到所述第一和第二探头的控制机构，用于控制所述第一和第二探头在基本上平行于所述相应表面的第一方向上的运动，而不是基本垂直于所述相应表面的第二方向。

6. 发明专利

JP2011075342A Probe head control mechanism for probe card assembly 审中-公开
标题翻译：探头卡组件探头控制机制
公开(公告)号：JP2011075342A
公开(公告)日：2011-04-14
申请号：JP2009225635
申请日：2009-09-29
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： MCFARLAND ANDREW W , LIEW BRANDON , PORTER JAMES M JR , YASUMURA KEVIN Y
IPC分类号： G01R31/28 , G01R1/06 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To overcome the problem with a conventional probe card assembly, wherein usable material characteristics of components are varied, resulting in limiting the sphere and the accuracy in adjustment of movement by heat.
SOLUTION: The probe card assembly includes a first probe head having a contact element which is disposed on the respective surface for forming electric contact with a corresponding terminal of a corresponding electronic device, a second probe head having the contact element which is disposed on the respective surface for forming the electric contact with a corresponding terminal of a corresponding electronic device, and a control mechanism which is connected to the first and second probe heads and controls movement of the first and second probe heads to a first direction parallel substantially to the respective surfaces thereof, more than to a second direction perpendicular substantially to the respective surfaces.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了克服常规探针卡组件的问题，其中组件的可用材料特性是变化的，导致球体的限制和由热量调节的精度。解决方案：探针卡组件包括具有接触元件的第一探针头，该接触元件设置在相应的表面上，用于与对应的电子设备的相应端子形成电接触;第二探针头，其具有布置的接触元件在相应的表面上形成与对应的电子设备的相应端子的电接触;以及控制机构，其连接到第一和第二探头，并且控制第一和第二探头的运动到基本相同的第一方向其各自的表面大于垂直于相应表面垂直的第二方向。版权所有（C）2011，JPO＆INPIT

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