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1. 发明申请

US20060172599A1 Universal serial bus connector and socket coupling arrangements 有权
标题翻译：通用串行总线连接器和插座耦合布置
公开(公告)号：US20060172599A1
公开(公告)日：2006-08-03
申请号：US11327819
申请日：2006-01-06
申请人： Evans Hankey , Rico Zorkendorfer , John Filson , Douglas Weber , Stephen Zadesky
发明人： Evans Hankey , Rico Zorkendorfer , John Filson , Douglas Weber , Stephen Zadesky
IPC分类号： H01R13/648
CPC分类号： H01R13/6276 , H01R13/4538 , H01R13/6582 , Y10S439/953
摘要： A Universal Serial Bus socket-equipped arrangement (USB-SEA) configured for mating with a Universal Serial Bus (USB) plug having a plug metal housing and an aperture disposed in the plug metal housing. The arrangement includes a plug-receiving cavity configured to receive the USB plug. The arrangement further includes a spring-loaded mechanism disposed within the plug-receiving cavity. The spring-loaded mechanism is biased toward an interior region of the plug-receiving cavity. The spring-loaded mechanism is also configured to slide along the connector metal housing of the USB plug when the USB plug is inserted into the plug-receiving cavity and to movably mate with the aperture disposed in the plug metal housing when the USB plug is in a terminal mating position with the USB socket assembly. The spring-loaded mechanism represents one of a spring-loaded ball and a spring-loaded pin.
摘要翻译：通用串行总线插座配置（USB-SEA）被配置为与具有插头金属外壳和设置在插头金属外壳中的孔的通用串行总线（USB）插头配合。该装置包括被配置为接收USB插头的插头接收腔。该装置还包括设置在插头接收腔内的弹簧加载机构。弹簧加载机构偏向插头接收腔的内部区域。弹簧加载机构还被配置为当USB插头插入插头接收腔中时沿着USB插头的连接器金属外壳滑动，并且当USB插头处于USB插头时，可移动地与设置在插头金属外壳中的孔配合与USB插座组件的端子配合位置。弹簧加载机构表示弹簧加载球和弹簧加载销中的一个。

2. 发明授权

US08738099B2 Thermal spray coating for seamless and radio-transparent electronic device housing 有权
标题翻译：用于无缝和无线电透明的电子设备外壳的热喷涂
公开(公告)号：US08738099B2
公开(公告)日：2014-05-27
申请号：US13452253
申请日：2012-04-20
申请人： Douglas Weber , Naoto Matsuyuki , David A. Pakula , Evans Hankey
发明人： Douglas Weber , Naoto Matsuyuki , David A. Pakula , Evans Hankey
IPC分类号： H04M1/00
CPC分类号： H05K5/0247 , H01Q1/243
摘要： Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.
摘要翻译：公开了适于接收电磁波通信的电子设备和其它设备。外壳包围各种设备部件，包括至少一个位于其中的内部天线，并且适于经由RF或其它电磁波接收/发送与外部源的通信。陶瓷涂层可以是覆盖靠近内部天线的外表面的至少一部分的热喷涂，并且可以是“RF透明的”，以允许通过电磁波与内部天线进行通信。外壳可以是塑料，金属或其组合。对于金属或其他非RF透明外壳，RF透明插入件可以安装在外壳中的窗口中，以允许与内部天线的通信。陶瓷涂层覆盖了包括外壳和表面的部分或全部金属，塑料和/或插入物，以便对装置进行最终的美观。

3. 发明授权

US08185166B2 Thermal spray coating for seamless and radio-transparent electronic device housing 有权
标题翻译：用于无缝和无线电透明的电子设备外壳的热喷涂
公开(公告)号：US08185166B2
公开(公告)日：2012-05-22
申请号：US12343335
申请日：2008-12-23
申请人： Douglas Weber , Naoto Matsuyuki , David A. Pakula , Evans Hankey
发明人： Douglas Weber , Naoto Matsuyuki , David A. Pakula , Evans Hankey
IPC分类号： H04M1/00
CPC分类号： H05K5/0247 , H01Q1/243
摘要： Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.
摘要翻译：公开了适于接收电磁波通信的电子设备和其它设备。外壳包围各种设备部件，包括至少一个位于其中的内部天线，并且适于经由RF或其它电磁波接收/发送与外部源的通信。陶瓷涂层可以是覆盖靠近内部天线的外表面的至少一部分的热喷涂，并且可以是“RF透明的”，以允许通过电磁波与内部天线通信。外壳可以是塑料，金属或其组合。对于金属或其他非RF透明外壳，RF透明插入件可以安装在外壳中的窗口中，以允许与内部天线的通信。陶瓷涂层覆盖了包括外壳和表面的部分或全部金属，塑料和/或插入物，以便对装置进行最终的美观。

4. 发明申请

US20210251420A1 DEVICE FOR CLEANING AN ESPRESSO MACHINE 有权
公开(公告)号：US20210251420A1
公开(公告)日：2021-08-19
申请号：US16791865
申请日：2020-02-14
申请人： Douglas Weber
发明人： Douglas Weber
IPC分类号： A47J31/60 , B08B9/032
摘要： A back-blush cleaning container may have a spring-biased piston that allows the container to fill with hot water when attached to a group head of the espresso machine. When the hot water of the espresso machine is turned off, the piston due to the spring urges the hot water out and back through a 3-way valve to clean the espresso machine. The backflush cleaning container also may have a steam conduit that allows steam from a steam wand of the espresso machine to clean the group head, 3-way valve and tubes. Moreover, the container may have a window which based on the position of the piston, a particular color is shown. The colors indicate whether the container is safe to remove from the group head of the espresso machine and when the container is full of water.

5. 发明申请

US20180125300A1 APPARATUS AND METHOD FOR GRINDING COFFEE BEANS 审中-公开
公开(公告)号：US20180125300A1
公开(公告)日：2018-05-10
申请号：US15344685
申请日：2016-11-07
申请人： Craig Robert Lyn , Douglas Weber
发明人： Craig Robert Lyn , Douglas Weber
IPC分类号： A47J42/26 , A47J42/50 , A47J42/40
CPC分类号： A47J42/26 , A47J42/40
摘要： A device for grinding coffee beans one shot at a time. The device may consist of an inlet funnel attached to a main body, wherein the beans are gravity fed to a set of burrs that grind the coffee into a grounds chamber, where they are then expunged into a grounds receptacle. The grounds receptacle may be adjusted in height via arms attached to the grinder depending on the workflow of the user and the type of receptacle being used. The grounds chamber is a clamshell design easily removable by the user for cleaning and held in place with magnets and alignment pins. As the grinder grinds coffee, wipers on the mounts for the burr create a positive pressure air flow to expunge the ground beans in addition to physically manipulating them out of the exit chute. This allows for grinding and expulsion of all of the input coffee without retention, a common problem in the industry when grinders are used for single shot grinding.

6. 发明授权

US08546702B2 Ultrasonic bonding of discrete plastic parts to metal 有权
标题翻译：离散塑料部件与金属的超声波接合
公开(公告)号：US08546702B2
公开(公告)日：2013-10-01
申请号：US13244162
申请日：2011-09-23
申请人： Christopher David Prest , Douglas Weber
发明人： Christopher David Prest , Douglas Weber
IPC分类号： H05K7/02 , B29C65/00
CPC分类号： B29C65/645 , B29C66/112 , B29C66/1122 , B29C66/116 , B29C66/118 , B29C66/301 , B29C66/30223 , B29C66/30322 , B29C66/30325 , B29C66/532 , B29C66/61 , B29C66/73161 , B29C66/742 , B29K2305/00 , B29L2031/3431 , Y10T428/24521
摘要： Electronic devices and other apparatuses that include plastic parts ultrasonically bonded to metal parts are disclosed. A first component or part includes a metallic surface region having a surface roughness with one or more surface irregularities. A second component or part formed from a plastic material that can include an energy director is attached to the metallic surface region via an ultrasonic bond, such that a portion of the plastic material is melted or otherwise formed into the surface irregularities to attach the two components or parts together. The parts can be housings, internal components or other items. The surface irregularities can be formed as a result of a chemical etching process, a machining process, or a combination thereof, and can result in the creation of undercuts or cavities in the metallic surface region.
摘要翻译：公开了包括与金属部件超声波接合的塑料部件的电子设备和其他设备。第一部件或部件包括具有一个或多个表面凹凸的表面粗糙度的金属表面区域。由包括能量导向器的塑料材料形成的第二部件或部件经由超声波接合附接到金属表面区域，使得塑料材料的一部分熔化或以其它方式形成为表面凹凸以附接两个部件或零件在一起。零件可以是外壳，内部组件或其他物品。作为化学蚀刻工艺，机械加工或其组合的结果，可以形成表面凹凸，并且可能导致在金属表面区域中产生底切或凹陷。

7. 发明授权

US08417779B2 Apparatus and method for interacting with handheld carrier hosting media content 有权
公开(公告)号：US08417779B2
公开(公告)日：2013-04-09
申请号：US12686294
申请日：2010-01-12
申请人： Douglas Weber
发明人： Douglas Weber
IPC分类号： G06F15/16 , G06F3/033 , G06F3/041 , H04W4/00 , H04J3/16
CPC分类号： G09G5/12 , H04W4/023 , H04W4/60
摘要： Improved techniques for interacting with one or more handheld carriers hosting media content are disclosed. The handheld carrier hosting media content may be sensed, and at least a portion of the media content may be integrated into operation of a media activity provided by a computing device, upon recognizing the media activity and the media content. The media activity provided by the computing device may involve creating or editing an electronic document. The integration of the media content into operation of the media activity may involve insertion or importation of the media content into the electronic document.

8. 发明申请

US20120234791A1 Methods and Systems for Forming a Dual Layer Housing 审中-公开
标题翻译：用于形成双层外壳的方法和系统
公开(公告)号：US20120234791A1
公开(公告)日：2012-09-20
申请号：US13488309
申请日：2012-06-04
申请人： Douglas Weber , Stephen P. Zadesky , Stephen Brian Lynch
发明人： Douglas Weber , Stephen P. Zadesky , Stephen Brian Lynch
IPC分类号： B29C59/16 , B29C47/02
CPC分类号： B29C45/1657 , B23K26/382 , B29C37/0082 , B29C45/14311 , B29C45/14344 , B29C45/1671 , B29C2045/14327 , B29K2055/02 , B29K2069/00 , B29K2705/00 , B29L2031/3481 , B32B2355/02 , B32B2369/00 , B32B2457/00 , C23F1/00 , C23F1/16 , Y10T428/13 , Y10T428/1352 , Y10T428/1355 , Y10T428/24008 , Y10T428/24273 , Y10T428/24521 , Y10T428/31678
摘要： Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.
摘要翻译：公开了将内部特征或复杂的机械结构应用于金属部件的表面的方法和装置。根据本发明的一个方面，一种用于产生包括基底和模制件的组件的方法包括获得基底，并在基底的表面上形成至少一个结合特征。该方法还包括在结合特征的表面和基底的表面上模制。在粘合特征表面和基材表面上的模塑将模制件机械地结合到基底上。

9. 发明申请

US20120063115A1 ULTRASONIC BONDING OF DISCRETE PLASTIC PARTS TO METAL 有权
标题翻译：将超声塑料零件超声波粘结到金属上
公开(公告)号：US20120063115A1
公开(公告)日：2012-03-15
申请号：US13244162
申请日：2011-09-23
申请人： Christopher David Prest , Douglas Weber
发明人： Christopher David Prest , Douglas Weber
IPC分类号： H05K7/02 , B32B37/00 , B32B3/10
CPC分类号： B29C65/645 , B29C66/112 , B29C66/1122 , B29C66/116 , B29C66/118 , B29C66/301 , B29C66/30223 , B29C66/30322 , B29C66/30325 , B29C66/532 , B29C66/61 , B29C66/73161 , B29C66/742 , B29K2305/00 , B29L2031/3431 , Y10T428/24521
摘要： Electronic devices and other apparatuses that include plastic parts ultrasonically bonded to metal parts are disclosed. A first component or part includes a metallic surface region having a surface roughness with one or more surface irregularities. A second component or part formed from a plastic material that can include an energy director is attached to the metallic surface region via an ultrasonic bond, such that a portion of the plastic material is melted or otherwise formed into the surface irregularities to attach the two components or parts together. The parts can be housings, internal components or other items. The surface irregularities can be formed as a result of a chemical etching process, a machining process, or a combination thereof, and can result in the creation of undercuts or cavities in the metallic surface region.
摘要翻译：公开了包括与金属部件超声波接合的塑料部件的电子设备和其他设备。第一部件或部件包括具有一个或多个表面凹凸的表面粗糙度的金属表面区域。由包括能量导向器的塑料材料形成的第二部件或部件经由超声波接合附接到金属表面区域，使得塑料材料的一部分熔化或以其它方式形成为表面凹凸以附接两个部件或零件在一起。零件可以是外壳，内部组件或其他物品。作为化学蚀刻工艺，机械加工或其组合的结果，可以形成表面凹凸，并且可能导致在金属表面区域中产生底切或凹陷。

10. 发明申请

US20110085316A1 CONFORMING EMI SHIELDING 有权
标题翻译：符合EMI屏蔽
公开(公告)号：US20110085316A1
公开(公告)日：2011-04-14
申请号：US12777775
申请日：2010-05-11
申请人： Scott Myers , Douglas Weber
发明人： Scott Myers , Douglas Weber
IPC分类号： H05K9/00 , H05K3/30
CPC分类号： H05K3/284 , H05K1/0218 , H05K9/0024 , H05K2201/09872 , H05K2203/1311 , Y10T29/49146
摘要： This is directed to an EMI shield constructed from a conformal coating. A circuit board can include electronic components for which EMI shielding is required. To provide such shielding in a space-efficient manner, a first non-conductive conformal coating can be placed over the circuit board and the electronic components. A second conductive conformal coating can then be placed over the first such that at least portions of the second coating around the periphery of the electronic components are electrically coupled to the circuit board.
摘要翻译：这是针对由保形涂层构成的EMI屏蔽。电路板可以包括需要EMI屏蔽的电子部件。为了以空间有效的方式提供这种屏蔽，可以在电路板和电子部件上放置第一非导电保形涂层。然后可以将第二导电保形涂层放置在第一导电保形涂层上，使得围绕电子部件的周边的第二涂层的至少一部分电耦合到电路板。

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