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1. 发明申请

US20110291073A1 QUANTUM DOT PHOSPHOR FOR LIGHT EMITTING DIODE AND METHOD OF PREPARING THE SAME 有权
公开(公告)号：US20110291073A1
公开(公告)日：2011-12-01
申请号：US13194359
申请日：2011-07-29
申请人： Eun Joo JANG , Mi Yang KIM , Hyung Kun KIM , Shin Ae JUN , Yong Wan JIN , Seong Jae CHOI
发明人： Eun Joo JANG , Mi Yang KIM , Hyung Kun KIM , Shin Ae JUN , Yong Wan JIN , Seong Jae CHOI
IPC分类号： H01L33/06
CPC分类号： C09K11/025 , B82Y10/00 , B82Y20/00 , B82Y40/00 , C09K11/02 , C09K11/565 , C09K11/883 , H01L29/127 , H01L33/06 , H01L33/502 , H01L33/507 , H01L33/56 , Y10S977/774 , Y10S977/892 , Y10S977/95
摘要： Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.

2. 发明申请

US20110121260A1 QUANTUM DOT PHOSPHOR FOR LIGHT EMITTING DIODE AND METHOD OF PREPARING THE SAME 有权
标题翻译：用于发光二极管的量子点磷光体及其制备方法
公开(公告)号：US20110121260A1
公开(公告)日：2011-05-26
申请号：US12939613
申请日：2010-11-04
申请人： Eun Joo JANG , Mi Yang KIM , Hyung Kun KIM , Shin Ae JUN , Yong Wan JIN , Seong Jae CHOI
发明人： Eun Joo JANG , Mi Yang KIM , Hyung Kun KIM , Shin Ae JUN , Yong Wan JIN , Seong Jae CHOI
IPC分类号： H01L29/06 , H01L33/00 , C09K11/06 , C09K11/54 , C09K11/56 , C09K11/84 , C09K11/81 , B82Y30/00
CPC分类号： C09K11/025 , B82Y10/00 , B82Y20/00 , B82Y40/00 , C09K11/02 , C09K11/565 , C09K11/883 , H01L29/127 , H01L33/06 , H01L33/502 , H01L33/507 , H01L33/56 , Y10S977/774 , Y10S977/892 , Y10S977/95
摘要： Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.
摘要翻译：这里公开了用于发光二极管的量子点荧光体，其包括量子点和其上支撑量子点的固体基板。另外，提供了制备量子点荧光体的方法。由于本发明的量子点荧光体由支撑在固体基板上的量子点组成，所以当分配通过将量子点与用于封装发光二极管的糊状树脂所获得的糊剂分配时，量子点不会聚集。由此，可以制造能够保持发光效率优异的发光二极管。

3. 发明申请

US20090322248A1 LED DRIVING CIRCUIT AND LIGHT EMITTING DIODE ARRAY DEVICE 有权
标题翻译： LED驱动电路和发光二极管阵列器件
公开(公告)号：US20090322248A1
公开(公告)日：2009-12-31
申请号：US12262801
申请日：2008-10-31
申请人： Young Jin LEE , Joong Kon SON , Hyung Kun KIM , Jung Ja YANG , Grigory ONUSHKIN
发明人： Young Jin LEE , Joong Kon SON , Hyung Kun KIM , Jung Ja YANG , Grigory ONUSHKIN
IPC分类号： H05B41/36
CPC分类号： H05B33/0821
摘要： There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n−1) number (here, n is a positive integer satisfying n≧2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n−1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches.
摘要翻译：提供了LED驱动电路。根据本发明的一个方面的LED驱动电路可以包括：至少一个梯形电路，包括：设置在第一和第二结之间的第一分支的（n-1）个数（这里，n是满足n> = 2的正整数）点，并且通过n个第一中间连接点彼此并排连接，（n-1）个与第一分支平行布置的第二分支，并且彼此连接成n个第二中间第一和第二接合点之间的接合点以及将第m个第一和第二中间接合点彼此连接的n个中间分支，其中至少一个LED器件设置在第一，第二和中间分支中的每一个上。这里，包括在第一和第二分支中的每个中的LED装置的数量大于包括在每个中间分支中的LED装置的数量。

4. 发明申请

US20100128461A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20100128461A1
公开(公告)日：2010-05-27
申请号：US12343452
申请日：2008-12-23
申请人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Jeong Wook Lee
发明人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Jeong Wook Lee
IPC分类号： F21V9/08
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/60 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.
摘要翻译：提供了一种发光二极管（LED）封装。 LED封装包括封装主体，第一和第二电极结构，第一和第二LED芯片以及第一和第二树脂封装部件。包装主体包括凹部和将凹部分成至少第一和第二容纳凹部的阻挡壁。第一和第二电极结构形成在封装主体处，分别暴露在第一和第二容纳凹槽的底表面处。第一和第二LED芯片电连接到第一和第二电极结构分别安装在第一和第二容纳凹部的底表面上。第一和第二树脂包装部分包括至少一种荧光材料，并且形成在用于包装第一和第二LED芯片的第一和第二容纳凹部中。

5. 发明申请

US20090283785A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20090283785A1
公开(公告)日：2009-11-19
申请号：US12204095
申请日：2008-09-04
申请人： Hyung Kun KIM
发明人： Hyung Kun KIM
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip.
摘要翻译：提供了一种发光二极管（LED）封装，其中均匀地形成封装LED芯片的荧光体层以便于处理。 LED封装包括：具有安装区域的封装体; 保持部，安装在所述安装区域上，以暴露所述安装区域的一部分; 安装在安装区域上的LED芯片，由保持部分包围的LED芯片发光; 以及由所述保持部保持的荧光体层，以密封由所述保持部限定的空间，所述荧光体层转换来自所述LED芯片的光的波长。

6. 发明申请

US20120307480A1 LIGHT EMITTING DIODE MODULE AND LIGHTING APPARATUS USING THE SAME 审中-公开
标题翻译：发光二极管模块和使用其的照明设备
公开(公告)号：US20120307480A1
公开(公告)日：2012-12-06
申请号：US13484915
申请日：2012-05-31
申请人： Hyung Kun KIM
发明人： Hyung Kun KIM
IPC分类号： F21V13/02 , F21V19/02 , F21V9/16
CPC分类号： F21V9/30 , F21V9/40 , F21V13/02 , F21V17/02 , F21Y2105/10 , F21Y2115/10
摘要： A light emitting diode (LED) module and a lighting apparatus using the same are disclosed. The LED module includes a circuit board to which at least one LED emitting light of a first wavelength range is mounted, a first wavelength conversion plate to convert the light of the first wavelength range, generated from the at least one LED, to light of a second wavelength range, and a plate control module connected with the first wavelength conversion plate by a first region to selectively dispose the first wavelength conversion plate on the at least one LED by rotatably moving the first wavelength conversion plate.
摘要翻译：公开了一种发光二极管（LED）模块和使用其的照明装置。 LED模块包括电路板，至少一个发射第一波长范围的光的LED被安装在该电路板上，第一波长转换板将从至少一个LED产生的第一波长范围的光转换为第二波长范围，以及板控制模块，其通过第一区域与第一波长转换板连接，以通过可旋转地移动第一波长转换板来选择性地将第一波长转换板布置在至少一个LED上。

7. 发明申请

US20120305970A1 LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20120305970A1
公开(公告)日：2012-12-06
申请号：US13484965
申请日：2012-05-31
申请人： Hyung Kun KIM
发明人： Hyung Kun KIM
IPC分类号： H01L33/44 , H01L33/58
CPC分类号： H01L33/504 , H01L33/507 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： There is provided a light emitting device package including a substrate having a cavity therein; alight emitting device mounted on a bottom surface of the cavity; a first wavelength conversion part including a first phosphor for a wavelength conversion of light emitted from the light emitting device and covering the light emitting device within the cavity; and a second wavelength conversion part including a second phosphor allowing for emission of light having a wavelength different to that of the first phosphor and formed as a sheet on the first wavelength conversion part.
摘要翻译：提供一种发光器件封装，其包括其中具有空腔的衬底; 安装在腔的底表面上的发光装置; 第一波长转换部分，包括用于从发光器件发射的光的波长转换并且在腔内覆盖发光器件的第一荧光体; 以及第二波长转换部分，其包括允许发射具有与第一荧光体的波长不同的波长并且在第一波长转换部分上形成为片材的光的第二荧光体。

8. 发明申请

US20100128463A1 HEADLIGHT FOR VEHICLE 审中-公开
标题翻译：车辆头灯
公开(公告)号：US20100128463A1
公开(公告)日：2010-05-27
申请号：US12626813
申请日：2009-11-27
申请人： Hyung Kun KIM , Young Jin LEE
发明人： Hyung Kun KIM , Young Jin LEE
IPC分类号： F21V9/16
CPC分类号： F21S45/43 , F21S41/147 , F21S41/28 , F21V29/677 , F21V29/76 , H01L2224/48091 , H01L2924/00014
摘要： There is provided a headlight for a vehicle. The headlight uses a light emitting device as a light source, so that light intensity can be enhanced and rectangular beams without discontinuity can be emitted, thereby enhancing light distribution characteristic.
摘要翻译：为车辆提供前大灯。头灯使用发光器件作为光源，从而可以增强光强度，并且可以发射不间断的矩形光束，从而增强光分布特性。

9. 发明申请

US20100051985A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20100051985A1
公开(公告)日：2010-03-04
申请号：US12255469
申请日：2008-10-21
申请人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
发明人： Hyung Kun KIM , Ho Sun Paek , Suk Ho Jung , Hak Hwan Kim , Young Jin Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , F21K9/00 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
摘要翻译：本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

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