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    • 3. 发明申请
    • LOW VISCOSITY ELECTROSTATIC DISCHARGE (ESD) DISSIPATING ADHESIVE
    • 低粘度静电放电(ESD)消散胶粘剂
    • US20120033332A1
    • 2012-02-09
    • US12852428
    • 2010-08-06
    • William T. Bandy, IVDylan J. BodayIcko E. T. IbenWayne A. McKinley
    • William T. Bandy, IVDylan J. BodayIcko E. T. IbenWayne A. McKinley
    • G11B5/127
    • G11B5/00817G11B5/40
    • In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 MΩ. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.
    • 在一个实施例中,系统包括电缆,该电缆包括多个引线以及耦合到覆盖区域中的多个引线的ESD消散粘合剂,用于向电子设备的元件提供ESD保护。 ESD粘合剂包括分散在膜中的聚合物薄膜和导电填料的混合物,并且ESD粘合剂具有约50至100MΩ的电阻率。 在另一个实施例中,用于向电子设备的元件提供ESD保护的方法包括将ESD粘合剂穿过电缆的暴露引线并从ESD粘合剂蒸发溶剂。 至少一些引线耦合到电子设备的元件。 ESD粘合剂包括聚合物薄膜,分散在聚合物薄膜中的导电填料和用于控制ESD粘合剂的粘度的溶剂。
    • 4. 发明授权
    • Low viscosity electrostatic discharge (ESD) dissipating adhesive
    • 低粘度静电放电(ESD)消散胶
    • US08493699B2
    • 2013-07-23
    • US12852428
    • 2010-08-06
    • William T. Bandy, IVDylan J. BodayIcko E. T. IbenWayne A. McKinley
    • William T. Bandy, IVDylan J. BodayIcko E. T. IbenWayne A. McKinley
    • H02H3/22
    • G11B5/00817G11B5/40
    • In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 MΩ. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.
    • 在一个实施例中,系统包括电缆,该电缆包括多个引线以及耦合到覆盖区域中的多个引线的ESD消散粘合剂,用于向电子设备的元件提供ESD保护。 ESD粘合剂包括分散在膜中的聚合物薄膜和导电填料的混合物,并且ESD粘合剂具有约50至100摩尔%的电阻率。 在另一个实施例中,用于向电子设备的元件提供ESD保护的方法包括将ESD粘合剂穿过电缆的暴露引线并从ESD粘合剂蒸发溶剂。 至少一些引线耦合到电子设备的元件。 ESD粘合剂包括聚合物薄膜,分散在聚合物薄膜中的导电填料和用于控制ESD粘合剂的粘度的溶剂。