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1. 发明申请

US20130020304A1 ARTICLE OF CLOTHING HAVING AN ELECTRICALLY CONDUCTIVE ASSEMBLY 审中-公开
标题翻译：具有电导体组件的衣服
公开(公告)号：US20130020304A1
公开(公告)日：2013-01-24
申请号：US13549999
申请日：2012-07-16
申请人： Erich Zainzinger , Michael Benedict Corbett , Huang Chen-Hsiang , Chen Wei , Haibo Fan
发明人： Erich Zainzinger , Michael Benedict Corbett , Huang Chen-Hsiang , Chen Wei , Haibo Fan
IPC分类号： H05B3/00
CPC分类号： H05B3/345 , H05B3/347 , H05B2203/015
摘要： An article of clothing having an electrical assembly formed of conductive thread. The article includes a clothing article and an electrical assembly formed using conductive thread wherein the electrical assembly is adapted to form a part of the clothing article. A pliable connector may connect the electrical assembly to a power cord. The inventions may further include a power supply connected to the power cord.
摘要翻译：具有由导电线形成的电气组件的衣物。该制品包括服装制品和使用导电线形成的电气组件，其中电组件适于形成服装制品的一部分。柔性连接器可将电气组件连接到电源线。本发明还可以包括连接到电源线的电源。

2. 发明授权

US08604603B2 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers 有权
标题翻译：具有通过插入器通过硅的热增强和具有成本效益的3D IC集成结构的装置
公开(公告)号：US08604603B2
公开(公告)日：2013-12-10
申请号：US12709291
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： H01L29/72
CPC分类号： H01L23/5384 , H01L23/055 , H01L23/433 , H01L23/5385 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/16225 , H01L2224/32 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48235 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.
摘要翻译：本文描述了具有三维集成电路结构的装置。该装置包括用于承载多个高功率和低功率芯片的插入器。高功率芯片被连接并连接到插入器的一侧，而低功率芯片被附接并连接到插入器的另一侧。一般来说，高功率芯片在运行时产生比低功率芯片更多的热量。插入器还包括通过硅通孔和用于连接两个表面上的芯片的再分配层。此外，插入器组件附接并连接到衬底层，衬底层又连接并连接到印刷电路板。为了提供改进的热管理，承载大功率芯片的插入器表面远离电路板。散热器附着在大功率芯片的背面以散热。

3. 发明申请

US20100213600A1 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers 有权
标题翻译：具有通过插入器通过硅的热增强和具有成本效益的3D IC集成结构的装置
公开(公告)号：US20100213600A1
公开(公告)日：2010-08-26
申请号：US12709291
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： H01L23/34 , H01L21/60 , H01L23/498
CPC分类号： H01L23/5384 , H01L23/055 , H01L23/433 , H01L23/5385 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/16225 , H01L2224/32 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48235 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.
摘要翻译：本文描述了具有三维集成电路结构的装置。该装置包括用于承载多个高功率和低功率芯片的插入器。高功率芯片被连接并连接到插入器的一侧，而低功率芯片被附接并连接到插入器的另一侧。一般来说，高功率芯片在运行时产生比低功率芯片更多的热量。插入器还包括通过硅通孔和用于连接两个表面上的芯片的再分配层。此外，插入器组件附接并连接到衬底层，衬底层又连接并连接到印刷电路板。为了提供改进的热管理，承载大功率芯片的插入器表面远离电路板。散热器附着在大功率芯片的背面以散热。

4. 发明申请

US20100215314A1 Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects 有权
标题翻译：具有用于光电互连的嵌入式3D混合集成的装置
公开(公告)号：US20100215314A1
公开(公告)日：2010-08-26
申请号：US12709279
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： G02B6/12 , G02B6/42
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K2201/10121
摘要： An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.
摘要翻译：本文描述了一种光电子器件，包括发射器，接收器和光波导，所有这些都嵌入在PCB中。发射机包括激光发生器和用于产生电信号和光信号的其它电路，其通过波导传输到接收器。接收器包括用于检测和将光信号转换成电信号的电路和检测器。发射器和接收器的电路和光学部件集成在3D混合芯片组中，其中芯片组件以3D结构堆叠。由于所有电路和光学元件均嵌入在PCB中，因此该设备非常紧凑，适用于便携式产品。

5. 发明授权

US09057853B2 Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects 有权
标题翻译：具有用于光电互连的嵌入式3D混合集成的装置
公开(公告)号：US09057853B2
公开(公告)日：2015-06-16
申请号：US12709279
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： G02B6/43 , H05K1/02 , G02B6/42
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K2201/10121
摘要： An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.
摘要翻译：这里描述了一种光电子器件，包括发射器，接收器和光波导，它们都嵌入在PCB中。发射机包括激光发生器和用于产生电信号和光信号的其它电路，其通过波导传输到接收器。接收器包括用于检测和将光信号转换成电信号的电路和检测器。发射器和接收器的电路和光学部件集成在3D混合芯片组中，其中芯片组件以3D结构堆叠。由于所有电路和光学元件均嵌入在PCB中，因此该设备非常紧凑，适用于便携式产品。

6. 发明授权

US07387089B2 Water heater with cross-sectionally elongated raw fuel jet pilot orifice 有权
标题翻译：热水器具有横截面细长的原燃料喷射引燃孔
公开(公告)号：US07387089B2
公开(公告)日：2008-06-17
申请号：US11348287
申请日：2006-02-06
申请人： Jacob A. Peart , Haibo Fan
发明人： Jacob A. Peart , Haibo Fan
IPC分类号： F23N5/10
CPC分类号： F23D14/26 , F23D2203/005 , F23D2203/1055 , F23D2209/20 , F24H1/205
摘要： A radiant gas burner within the combustion chamber of a water heater has a pilot flame created using a cross-sectionally elongated raw fuel jet that impinges on an interior surface portion of a flame holding outer burner wall portion, representatively of a metal wire mesh material, and is mixed within the burner with combustion air delivered thereto from outside the combustion chamber. The resulting fuel/air mixture passes outwardly through the impinged upon mesh wall portion, which functions as a pilot flame stabilizing structure, and is ignited to form a pilot flame on the exterior of the burner body. A thermocouple portion of a clogging detection system senses a change in the pilot flame shape caused by particulate clogging of the metal mesh material and responsively terminates further gas supply to the water heater.
摘要翻译：在热水器的燃烧室内的辐射气体燃烧器具有使用横截面细长的原料燃料射流产生的引燃火焰，其以代表金属丝网材料的火焰保持外燃烧器壁部分的内表面部分，并在燃烧器内与从燃烧室外部输送的燃烧空气混合。所产生的燃料/空气混合物通过撞击的网孔壁部分向外通过，该壁部分起到引燃火焰稳定结构的作用，并被点燃以在燃烧器主体的外部形成引燃火焰。堵塞检测系统的热电偶部分感测由金属网材料的微粒堵塞引起的导向火焰形状的变化，并且响应地终止对热水器的进一步气体供应。

7. 发明申请

US20060207524A1 Water heater with cross-sectionally elongated raw fuel jet pilot orifice 有权
标题翻译：热水器具有横截面细长的原燃料喷射引燃孔
公开(公告)号：US20060207524A1
公开(公告)日：2006-09-21
申请号：US11348287
申请日：2006-02-06
申请人： Jacob Peart , Haibo Fan
发明人： Jacob Peart , Haibo Fan
IPC分类号： F24H9/20
CPC分类号： F23D14/26 , F23D2203/005 , F23D2203/1055 , F23D2209/20 , F24H1/205
摘要： A radiant gas burner within the combustion chamber of a water heater has a pilot flame created using a cross-sectionally elongated raw fuel jet that impinges on an interior surface portion of a flame holding outer burner wall portion, representatively of a metal wire mesh material, and is mixed within the burner with combustion air delivered thereto from outside the combustion chamber. The resulting fuel/air mixture passes outwardly through the impinged upon mesh wall portion, which functions as a pilot flame stabilizing structure, and is ignited to form a pilot flame on the exterior of the burner body. A thermocouple portion of a clogging detection system senses a change in the pilot flame shape caused by particulate clogging of the metal mesh material and responsively terminates further gas supply to the water heater.
摘要翻译：在热水器的燃烧室内的辐射气体燃烧器具有使用横截面细长的原料燃料射流产生的引燃火焰，其以代表金属丝网材料撞击在火焰保持外燃烧器壁部分的内表面部分上，并在燃烧器内与从燃烧室外部输送的燃烧空气混合。所产生的燃料/空气混合物通过撞击的网孔壁部分向外通过，该壁部分起到引燃火焰稳定结构的作用，并被点燃以在燃烧器主体的外部形成引燃火焰。堵塞检测系统的热电偶部分感测由金属网材料的微粒堵塞引起的导向火焰形状的变化，并且响应地终止对热水器的进一步气体供应。

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