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1. 发明授权

US07804147B2 Light emitting diode package element with internal meniscus for bubble free lens placement 有权
标题翻译：具有内部半月板的发光二极管封装元件，用于无泡沫透镜放置
公开(公告)号：US07804147B2
公开(公告)日：2010-09-28
申请号：US11496918
申请日：2006-07-31
申请人： Eric Tarsa , Thomas C. Yuan , Maryanne Becerra , Praveen Yadev
发明人： Eric Tarsa , Thomas C. Yuan , Maryanne Becerra , Praveen Yadev
IPC分类号： H01L31/0203 , H01L31/0232 , H01L31/00 , H01L51/00 , H01L33/00
CPC分类号： H01L33/58 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portion over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.
摘要翻译：一种用于制造发光二极管（LED）封装的方法，包括提供LED芯片并且用具有曲率半径的液体密封剂覆盖所述LED芯片的至少一部分。提供一种具有底表面的光学元件，其具有至少一部分具有比液体密封剂大的曲率半径的部分。光学元件的较大的曲率半径部分与液体密封剂接触。然后将光学元件移动到更靠近LED芯片，增加所述光学元件和所述液体密封剂之间的接触面积。然后固化液体密封剂。一种发光二极管，包括安装有LED芯片的基板。半月板环位于LED芯片周围的基板上，弯液面具有弯月面保持特征。内部密封剂设置在LED芯片上，内部密封剂在基底上具有接触表面，其中弯月面保持特征限定接触表面的边缘。包括具有至少一部分凹陷的底表面的光学元件。光学元件布置在基板上，其中凹部在LED芯片上。内密封剂和光学元件之间包括接触密封剂。

2. 发明申请

US20080026498A1 Light emitting diode package element with internal meniscus for bubble free lens placement 有权
标题翻译：具有内部半月板的发光二极管封装元件，用于无泡沫透镜放置
公开(公告)号：US20080026498A1
公开(公告)日：2008-01-31
申请号：US11496918
申请日：2006-07-31
申请人： Eric Tarsa , Thomas C. Yuan , Maryanne Becerra , Praveen Yadev
发明人： Eric Tarsa , Thomas C. Yuan , Maryanne Becerra , Praveen Yadev
IPC分类号： H01L21/00
CPC分类号： H01L33/58 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portion over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.
摘要翻译：一种用于制造发光二极管（LED）封装的方法，包括提供LED芯片并且用具有曲率半径的液体密封剂覆盖所述LED芯片的至少一部分。提供一种具有底表面的光学元件，其具有至少一部分具有比液体密封剂大的曲率半径的部分。光学元件的较大的曲率半径部分与液体密封剂接触。然后将光学元件移动到更靠近LED芯片，增加所述光学元件和所述液体密封剂之间的接触面积。然后固化液体密封剂。一种发光二极管，包括安装有LED芯片的基板。半月板环位于LED芯片周围的基板上，弯液面具有弯月面保持特征。内部密封剂设置在LED芯片上，内部密封剂在基底上具有接触表面，其中弯月面保持特征限定接触表面的边缘。包括具有至少一部分凹陷的底表面的光学元件。光学元件布置在基板上，其中凹部在LED芯片上。内密封剂和光学元件之间包括接触密封剂。

3. 发明授权

US08735920B2 Light emitting diode package with optical element 有权
标题翻译：具有光学元件的发光二极管封装
公开(公告)号：US08735920B2
公开(公告)日：2014-05-27
申请号：US11496922
申请日：2006-07-31
申请人： James Ibbetson , Eric Tarsa , Michael Leung , Maryanne Becerra , Bernd Keller
发明人： James Ibbetson , Eric Tarsa , Michael Leung , Maryanne Becerra , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2933/005 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.
摘要翻译：一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

4. 发明申请

US20080023711A1 Light emitting diode package with optical element 有权
标题翻译：具有光学元件的发光二极管封装
公开(公告)号：US20080023711A1
公开(公告)日：2008-01-31
申请号：US11496922
申请日：2006-07-31
申请人： Eric Tarsa , Michael Leung , Maryanne Becerra , Bernd Keller , James Ibbetson
发明人： Eric Tarsa , Michael Leung , Maryanne Becerra , Bernd Keller , James Ibbetson
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2933/005 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.
摘要翻译：一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。在基板和透镜之间布置粘合剂以将透镜保持在基板上并且补偿透镜与封装的其余部分之间的不同的热膨胀系数（CTE）。一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

5. 发明申请

US20070228387A1 Uniform emission LED package 有权
标题翻译：均匀排放LED封装
公开(公告)号：US20070228387A1
公开(公告)日：2007-10-04
申请号：US11398214
申请日：2006-04-04
申请人： Gerald Negley , Michael Leung , Maryanne Becerra , Eric Tarsa , Peter Andrews
发明人： Gerald Negley , Michael Leung , Maryanne Becerra , Eric Tarsa , Peter Andrews
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/54 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2924/00
摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.
摘要翻译：一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。表面包含基质密封剂并覆盖LED。靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。然后固化基质密封剂。

6. 发明授权

US08969908B2 Uniform emission LED package 有权
标题翻译：均匀排放LED封装
公开(公告)号：US08969908B2
公开(公告)日：2015-03-03
申请号：US11398214
申请日：2006-04-04
申请人： Gerald Negley , Michael Leung , Maryanne Becerra , Eric Tarsa , Peter Andrews
发明人： Gerald Negley , Michael Leung , Maryanne Becerra , Eric Tarsa , Peter Andrews
IPC分类号： H01L33/00 , H01L33/50 , H01L33/48
CPC分类号： H01L33/54 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2924/00
摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.
摘要翻译：一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。表面包含基质密封剂并覆盖LED。靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。然后固化基质密封剂。

7. 发明授权

US07799586B2 Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same 有权
标题翻译：包括发光转换元件的半导体发光器件及其封装方法
公开(公告)号：US07799586B2
公开(公告)日：2010-09-21
申请号：US12398626
申请日：2009-03-05
申请人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
发明人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
IPC分类号： H01L29/207 , H01L21/00
CPC分类号： H01L33/507 , H01L33/52 , H01L33/58 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要翻译：包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。空腔中的第一量的密封剂材料被处理以形成具有选定形状的硬化的上表面。在被处理的第一量的密封剂材料的上表面上设置发光转换元件。发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

8. 发明授权

US08039859B2 Semiconductor light emitting devices including an optically transmissive element 有权
标题翻译：包括光学透射元件的半导体发光器件
公开(公告)号：US08039859B2
公开(公告)日：2011-10-18
申请号：US12886001
申请日：2010-09-20
申请人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
发明人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/52 , H01L33/58 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要翻译：包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。将空腔中的第一量的密封材料进行处理以形成具有形状的硬化的上表面。在被处理的第一量的密封剂材料的上表面上设置发光转换元件。发光转换元件包括波长转换材料，并且在空腔的中间区域处的厚度大于靠近空腔侧壁的厚度。

9. 发明申请

US20110006330A1 SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME 有权
标题翻译：包含光传输元件的半导体发光器件及其封装方法
公开(公告)号：US20110006330A1
公开(公告)日：2011-01-13
申请号：US12886001
申请日：2010-09-20
申请人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
发明人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
IPC分类号： H01L33/52 , H01L33/50
CPC分类号： H01L33/507 , H01L33/52 , H01L33/58 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要翻译：包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。将空腔中的第一量的密封材料进行处理以形成具有形状的硬化的上表面。在被处理的第一量的密封剂材料的上表面上设置发光转换元件。发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

10. 发明授权

US07517728B2 Semiconductor light emitting devices including a luminescent conversion element 有权
标题翻译：包括发光转换元件的半导体发光器件
公开(公告)号：US07517728B2
公开(公告)日：2009-04-14
申请号：US11055194
申请日：2005-02-10
申请人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
发明人： Michael Leung , Thomas G. Coleman , Maryanne Becerra
IPC分类号： H01L21/00
CPC分类号： H01L33/507 , H01L33/52 , H01L33/58 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要翻译：包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。空腔中的第一量的密封剂材料被处理以形成具有选定形状的硬化的上表面。在被处理的第一量的密封剂材料的上表面上设置发光转换元件。发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

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