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1. 发明授权

US07228888B2 Rotatable liquid reservoir for computer cooling 失效
标题翻译：用于计算机冷却的可旋转液体储存器
公开(公告)号：US07228888B2
公开(公告)日：2007-06-12
申请号：US11249912
申请日：2005-10-13
申请人： Eric Alan Eckberg , James Dorance Gerken , Cary Michael Huettner , Roger Ray Schmidt
发明人： Eric Alan Eckberg , James Dorance Gerken , Cary Michael Huettner , Roger Ray Schmidt
IPC分类号： F28D7/10 , F28D15/00
CPC分类号： H05K7/20272 , H01L2924/0002 , H01L2924/00
摘要： In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.
摘要翻译：在电子设备的液体冷却系统中，电子设备在空间中旋转，液体冷却剂储存箱包括脱气和防涡旋结构，以允许气泡漂浮到罐内的液体表面，并且还包括防止涡流从储罐出口附近形成。该结构包括嵌套管或导管。内部导管从入口延伸到罐中，其开口端被第二导管覆盖，第二导管在其端部上具有挡板，使得流动被挡板引导以沿着内部管道的外部向后流动，并且内部的外管。特别是在入口处，具有大穿孔的第三导管围绕外导管的开口端。出口侧内管上较小的穿孔阻止任何涡流形成。液体流动的反转，流动横截面的逐渐增加可以防止罐内涌动。

2. 发明申请

US20090260384A1 Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger 审中-公开
标题翻译：具有后门热交换器的机架的冷却液分配系统
公开(公告)号：US20090260384A1
公开(公告)日：2009-10-22
申请号：US12106710
申请日：2008-04-21
申请人： David Frederick Champion , Eric Alan Eckberg , James Dorance Gerken , Howard Victor Mahaney, JR.
发明人： David Frederick Champion , Eric Alan Eckberg , James Dorance Gerken , Howard Victor Mahaney, JR.
IPC分类号： F25D23/12
CPC分类号： H05K7/20754
摘要： One embodiment of the invention provides a rack assembly for cooling a computer system. A rack provides support for one or more columns of heat-generating electronic devices. Device fans move air from an air inlet side of the rack through the devices and through an air outlet side of the rack. A unitary door has a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The unitary door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet side of the rack must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the one or more columns of heat-generating devices. A coolant circulation system includes a coolant distribution unit for chilling liquid coolant, a supply hose placing the coolant distribution unit in fluid communication with an inlet manifold of the air-to-liquid heat exchanger, and a return hose placing an outlet manifold of the air-to-liquid heat exchanger in fluid communication with the coolant distribution unit. The supply hose and return hose are routed outside the cross-sectional area of the air outlet passage.
摘要翻译：本发明的一个实施例提供了一种用于冷却计算机系统的机架组件。机架提供对一列或多列发热电子设备的支持。设备风扇通过设备和机架的出风口将空气从机架的空气入口侧移动。整体门具有横跨机架出风口的支撑架，并将门铰接到机架的后垂直边缘。整体门包括空气 - 液体热交换器面板，跨越支撑框架内的空气出口通道，使得通过机架的空气出口侧的大部分空气必须通过热交换器面板。空气出口通道的横截面面积基本上等于或大于一列或多列发热装置的横截面面积。冷却剂循环系统包括用于冷却液体冷却剂的冷却剂分配单元，将冷却剂分配单元与空气至液体热交换器的入口歧管流体连通的供应软管，以及放置空气出口歧管的回流软管液体热交换器与冷却剂分配单元流体连通。供气软管和回流软管布置在出气通道的横截面外。

3. 发明申请

US20090260874A1 Biased Air Baffle For Computer Rack 有权
标题翻译：电脑机架偏置空气挡板
公开(公告)号：US20090260874A1
公开(公告)日：2009-10-22
申请号：US12107026
申请日：2008-04-21
申请人： Eric Alan Eckberg , James Dorance Gerken , John Theodore Gullicksrud , Stephen Peter Mroz , Scott Alan Shruson
发明人： Eric Alan Eckberg , James Dorance Gerken , John Theodore Gullicksrud , Stephen Peter Mroz , Scott Alan Shruson
IPC分类号： H02G3/18
CPC分类号： H05K7/20736 , H05K7/1491
摘要： One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction.
摘要翻译：一个实施例提供了一种用于控制通过机架中的电缆开口的气流的空气挡板组件。机架被配置为可移除地支撑多个模块化电子部件。机架上的电缆开口接收连接到模块化电子部件的多条电缆。空气挡板组件包括固定到邻近电缆开口的齿条的轨道和可移动地支撑在电缆开口上的轨道上的空气挡板。轨道包括轨道导轨。空气挡板包括至少一个由第一轨道导轨可移动地容纳的柔性第一轨道。第一轨道沿着第一轨道与第一轨道导轨的接合范围横向张开，以在一个纵向方向上偏压空气挡板。

4. 发明授权

US07345881B2 Non-influencing fastener for mounting a heat sink in contact with an electronic component 有权
标题翻译：用于安装与电子部件接触的散热器的不影响的紧固件
公开(公告)号：US07345881B2
公开(公告)日：2008-03-18
申请号：US11379417
申请日：2006-04-20
申请人： John Lee Colbert , John Saunders Corbin, Jr. , Eric Alan Eckberg , James Dorance Gerken , Roger Duane Hamilton , Maurice Francis Holahan
发明人： John Lee Colbert , John Saunders Corbin, Jr. , Eric Alan Eckberg , James Dorance Gerken , Roger Duane Hamilton , Maurice Francis Holahan
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2224/16225 , Y10T24/44017 , Y10T24/44026
摘要： A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.
摘要翻译：负载框架具有暴露电子部件的表面的开放区域。散热器设置在负载框架上并且具有与电子部件的表面热接触的表面。不影响的紧固件设置在散热器的孔内并且拧入负载框架中，以将散热器固定到负载框架上。非影响性紧固件包括具有头部的螺钉; 锥形环设置在螺钉的头部下方并具有锥形的下外周表面; 与锥形环的锥形下周面接合的密封环; 以及设置在密封环和负载框架之间的负载垫圈。通过将螺钉转入负载框架来压缩环使得密封环相对于散热器的孔膨胀。优选地，密封环具有弯曲的外表面。

5. 发明授权

US07999179B2 Biased air baffle for computer rack 有权
标题翻译：电脑机架偏置空气挡板
公开(公告)号：US07999179B2
公开(公告)日：2011-08-16
申请号：US12107026
申请日：2008-04-21
申请人： Eric Alan Eckberg , James Dorance Gerken , John Theodore Gullicksrud , Stephen Peter Mroz , Scott Alan Shruson
发明人： Eric Alan Eckberg , James Dorance Gerken , John Theodore Gullicksrud , Stephen Peter Mroz , Scott Alan Shruson
IPC分类号： H05K5/00
CPC分类号： H05K7/20736 , H05K7/1491
摘要： One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction.
摘要翻译：一个实施例提供了一种用于控制通过机架中的电缆开口的气流的空气挡板组件。机架被配置为可移除地支撑多个模块化电子部件。机架上的电缆开口接收连接到模块化电子部件的多条电缆。空气挡板组件包括固定到邻近电缆开口的齿条的轨道和可移动地支撑在电缆开口上的轨道上的空气挡板。轨道包括轨道导轨。空气挡板包括至少一个由第一轨道导轨可移动地容纳的柔性第一轨道。第一轨道沿着第一轨道与第一轨道导轨的接合范围横向张开，以在一个纵向方向上偏压空气挡板。

6. 发明授权

US07307856B2 Apparatus for tool-less removal of PCB assembly 有权
标题翻译：用于无需拆卸PCB组件的设备
公开(公告)号：US07307856B2
公开(公告)日：2007-12-11
申请号：US11335764
申请日：2006-01-19
申请人： Donald Wayne Dingfelder , James Dorance Gerken , Scott Raymond LaPree , Gregory Todd Smith
发明人： Donald Wayne Dingfelder , James Dorance Gerken , Scott Raymond LaPree , Gregory Todd Smith
IPC分类号： H05K7/14
CPC分类号： H05K7/1407 , Y10T29/53274
摘要： Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.
摘要翻译：用于从单元去除印刷电路板（PCB）和挡板组件的装置包括拉簧连接到PCB和挡板组件的相对侧。每个拉簧包括一般为M形的弹簧。 M形弹簧的第一端包括承载旋钮的第一销。第一销延伸穿过挡板中的开口，并且手柄设置在挡板的凹陷部分内，并且与正常约束位置压缩的M形弹簧大致与挡板的前表面齐平。在M形弹簧恢复到基本上未压缩状态的延伸位置处，把手被向前推并且在前挡板的前方间隔开，从而使人能够握住和拉动每个旋钮，从而将PCB和挡板组件从安装的单位。

7. 发明申请

US20100254089A1 Cooling System for Electronic Components 有权
标题翻译：电子元件冷却系统
公开(公告)号：US20100254089A1
公开(公告)日：2010-10-07
申请号：US12417921
申请日：2009-04-03
申请人： William James Anderl , Evan George Colgan , James Dorance Gerken , Christopher Michael Marroquin , Shurong Tian
发明人： William James Anderl , Evan George Colgan , James Dorance Gerken , Christopher Michael Marroquin , Shurong Tian
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
摘要翻译：本发明的实施例提供电子外壳的非中断流体冷却。可以从具有流体流动系统的电路卡移除一个或多个电子部件封装。当安装时，电子部件封装与流体流动系统重合并处于热关系。如果特定的电子部件封装变得不起作用，则可以从电子外壳移除，而不会影响流体流动系统或其他相邻的电子元件封装。

8. 发明授权

US09342121B2 Cooling system for electronic components 有权
公开(公告)号：US09342121B2
公开(公告)日：2016-05-17
申请号：US12417921
申请日：2009-04-03
申请人： William James Anderl , Evan George Colgan , James Dorance Gerken , Christopher Michael Marroquin , Shurong Tian
发明人： William James Anderl , Evan George Colgan , James Dorance Gerken , Christopher Michael Marroquin , Shurong Tian
IPC分类号： H05K7/20 , G06F1/20 , H01L23/40 , H01L23/473
CPC分类号： G06F1/206 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

9. 发明授权

US07382626B2 Apparatus for tool-less removal of PCB assembly 有权
标题翻译：用于无需拆卸PCB组件的设备
公开(公告)号：US07382626B2
公开(公告)日：2008-06-03
申请号：US11845960
申请日：2007-08-28
申请人： Donald Wayne Dingfelder , James Dorance Gerken , Scott Raymond LaPree , Gregory Todd Smith
发明人： Donald Wayne Dingfelder , James Dorance Gerken , Scott Raymond LaPree , Gregory Todd Smith
IPC分类号： H05K5/00
CPC分类号： H05K7/1407 , Y10T29/53274
摘要： Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.
摘要翻译：用于从单元去除印刷电路板（PCB）和挡板组件的装置包括拉簧连接到PCB和挡板组件的相对侧。每个拉簧包括一般为M形的弹簧。 M形弹簧的第一端包括承载旋钮的第一销。第一销延伸穿过挡板中的开口，并且手柄设置在挡板的凹陷部分内，并且与正常约束位置压缩的M形弹簧大致与挡板的前表面齐平。在M形弹簧恢复到基本上未压缩状态的延伸位置处，把手被向前推并且在前挡板的前方间隔开，从而使人能够握住和拉动每个旋钮，从而将PCB和挡板组件从安装的单位。

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