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    • 8. 发明申请
    • Heat-Dissipating Structure for an LED Lamp
    • LED灯泡散热结构
    • US20140063806A1
    • 2014-03-06
    • US13596133
    • 2012-08-28
    • David Huang
    • David Huang
    • F21V29/00
    • F21V29/507F21K9/00F21V19/0055F21V23/023F21V29/83F21Y2103/33F21Y2115/10
    • A heat-dissipating structure for LED lamp has a lamp cover, and a power conversion device and a ceramic substrate mounted inside the lamp cover. The lamp cover has multiple heat-dissipating holes and multiple mounting ears. Each mounting ear is formed on an edge of one of the heat-dissipating holes and is bent inwardly with the heat-dissipating hole uncovered. The ceramic substrate is mounted on the mounting ears. The ceramic substrate has multiple LEDs mounted thereon, absorbs heat generated when the LEDs emit light and conducts the heat to the lamp cover through the mounting ears. The heat generated when the LEDs are lit and the power conversion converts a mains power is transferred to a heat convection space between the ceramic substrate and the lamp cover, and is further dissipated to an ambient environment, thereby achieving fast heat dissipation and a light LED lamp without additional heat sink thereon.
    • 用于LED灯的散热结构具有灯罩,安装在灯罩内部的电力转换装置和陶瓷基板。 灯罩有多个散热孔和多个安装耳。 每个安装耳形成在一个散热孔的边缘上,并且在散热孔未被覆盖的同时向内弯曲。 陶瓷基板安装在安装耳上。 陶瓷基板上安装有多个LED,吸收当LED发光时产生的热量,并通过安装耳将热量传导到灯罩。 当LED点亮并且功率转换转换为主电源时产生的热量被传递到陶瓷基板和灯罩之间的热对流空间,并且进一步消散到周围环境,从而实现快速散热,并且将LED 灯,其上没有额外的散热器。