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    • 4. 发明授权
    • Scheduling method for processing equipment
    • 加工设备调度方法
    • US07522968B2
    • 2009-04-21
    • US11775365
    • 2007-07-10
    • Steve S. HongkhamEric A. EnglhardtMichael R. RiceHelen R. ArmerChongyang Chris Wang
    • Steve S. HongkhamEric A. EnglhardtMichael R. RiceHelen R. ArmerChongyang Chris Wang
    • G06F19/00
    • H01L21/67276
    • Methods and apparatus for increasing the processing throughput of multiple lots of semiconductor wafers through a cluster tool while maintaining a constant wafer history for each lot are provided. A first lot of wafers containing one through n-th wafers is introduced into a cluster tool containing one or more processing chambers. The first lot of wafers is processed for a first time period. A second lot of wafers containing one through n-th wafers is introduced into the cluster tool prior to completion of the first time period, wherein the second lot is introduced so as to minimize a time gap between the n-th wafer of the first lot of wafers and the first wafer of the second lot of wafers while maintaining a first constant wafer history for each wafer within the first lot and maintaining a second constant wafer history for each wafer in the second lot.
    • 提供了通过集群工具增加多批半导体晶片的处理能力的方法和装置,同时保持每批的恒定的晶片历史。 包含一个至第n个晶片的第一批晶片被引入到包含一个或多个处理室的簇工具中。 第一批晶圆首次处理。 在第一时间段完成之前,将包含一个至第n个晶片的第二批晶片引入到该簇工具中,其中引入第二批以最小化第一批第n个晶片之间的时间间隔 的晶片和第二批晶片的第一晶片,同时保持第一批内的每个晶片的第一恒定晶片历史,并为第二批中的每个晶片保持第二恒定的晶片历史。