专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120300398A1 MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER 有权
标题翻译：多机架，门安装热交换器
公开(公告)号：US20120300398A1
公开(公告)日：2012-11-29
申请号：US13115404
申请日：2011-05-25
申请人： Eric A. ECKBERG , David P. GRAYBILL , Madhusudan K. IYENGAR , Howard V. MAHANEY, JR. , Roger R. SCHMIDT , Kenneth R. SCHNEEBELI
发明人： Eric A. ECKBERG , David P. GRAYBILL , Madhusudan K. IYENGAR , Howard V. MAHANEY, JR. , Roger R. SCHMIDT , Kenneth R. SCHNEEBELI
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： B23P15/26 , H05K7/20718 , H05K7/2079 , H05K7/20818 , Y10T29/4935
摘要： An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.
摘要翻译：提供了一种空气冷却装置，其包括用于保持两个或更多个彼此相邻的固定关系的独立电子机架的固定机构，以及尺寸设计成跨越机架的空气入口侧或空气出口侧的多齿条门。固定机构使电子机架与其空气入口侧面对第一方向固定，并且空气出口侧面向第二方向。门包括具有气流开口的门框。气流开口有助于通过电子机架进入或流出气流，并且门还包括由门框架支撑的空气对液体热交换器，并且设置成使流过气流开口的空气穿过热交换器。在操作中，热交换器从通过分离的电子机架的空气中提取热量。

2. 发明申请

US20120298335A1 AIR-COOLING WALL WITH SLIDABLE HEAT EXCHANGERS 有权
标题翻译：空气冷却壁与可滑动的热交换器
公开(公告)号：US20120298335A1
公开(公告)日：2012-11-29
申请号：US13115390
申请日：2011-05-25
申请人： Eric A. ECKBERG , David P. GRAYBILL , Madhusudan K. IYENGAR , Howard V. MAHANEY, JR. , Roger R. SCHMIDT , Kenneth R. SCHNEEBELI
发明人： Eric A. ECKBERG , David P. GRAYBILL , Madhusudan K. IYENGAR , Howard V. MAHANEY, JR. , Roger R. SCHMIDT , Kenneth R. SCHNEEBELI
IPC分类号： F28D15/00
CPC分类号： H05K7/2079
摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).
摘要翻译：提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构，支撑一个或多个可滑动的墙板。可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。通过支撑结构的热交换器的可滑动支撑件便于进入电子机架的空气出口或空气入口侧。

3. 发明申请

US20130264030A1 STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK 有权
标题翻译：用于电子机架的热交换器门的结构构造
公开(公告)号：US20130264030A1
公开(公告)日：2013-10-10
申请号：US13443084
申请日：2012-04-10
申请人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
发明人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
IPC分类号： H05K5/02 , H05K7/20
CPC分类号： H05K7/20536 , H05K7/20781
摘要： A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.
摘要翻译：提供了一种热交换器门，其包括横跨电子机架的空气入口或出口侧的至少一部分的门组件。门组件包括气流开口，其有助于空气进入或流出通过电子机架的气流。门组件还包括空气 - 冷却剂热交换器和结构支撑件。热交换器设置成使得通过气流开口的气流穿过热交换器。热交换器包括热交换器芯和耦合到芯的热交换器壳体。该芯包括至少一个循环穿过壳体的冷却剂传送通道。结构支撑件附接到热交换器壳体以与壳体一起限定管状门支撑结构。通过热交换器壳体的冷却剂输送通道的循环位于管状门支撑结构内。

4. 发明申请

US20130264026A1 HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK 有权
标题翻译：热交换器门用于电子机架
公开(公告)号：US20130264026A1
公开(公告)日：2013-10-10
申请号：US13443070
申请日：2012-04-10
申请人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
发明人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
IPC分类号： F28F9/007
CPC分类号： B23P15/26 , H05K7/2079 , Y10T29/4935 , Y10T70/5761 , Y10T292/0917
摘要： An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.
摘要翻译：提供一种空气冷却装置，其包括热交换器门和收纳支架。门被铰接地安装到电子机架的空气入口或出口侧，并且包括：跨越架子的空气入口或出口侧的至少一部分的门框，其中框架包括气流开口，其有助于气流通过架子由所述门框架支撑并布置成使得通过所述气流开口的气流通过所述空气至冷却剂热交换器; 以及门闩机构，用于选择性地将热交换器门闩锁到机架上。捕获支架附接到支架上并且尺寸设计成通过卡合开口从支架延伸到热交换器门中，并且门闩锁机构构造并安装在热交换器门内以物理地接合热交换器门内的卡扣支架。

5. 发明申请

US20130264027A1 PROCESS FOR OPTIMIZING A HEAT EXCHANGER CONFIGURATION 有权
标题翻译：优化热交换器配置的过程
公开(公告)号：US20130264027A1
公开(公告)日：2013-10-10
申请号：US13443094
申请日：2012-04-10
申请人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
发明人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
IPC分类号： F28F9/007 , G06F15/00
CPC分类号： F28F27/00 , F28F2200/00 , H05K7/20836
摘要： A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.
摘要翻译：提供了一种换热器门和热交换器芯优化方法。门位于电子机架的空气入口或出口侧，并且包括具有热交换器芯的空气 - 冷却剂热交换器。该芯包括与第二冷却剂通道下游的冷却剂入口歧管相连的第一冷却剂通道，并且第一通道具有比第二通道更短的通道长度。此外，芯的冷却剂通道被联接以提供穿过芯的气流的逆流冷却。核心优化方法确定为特定应用优化热交换器的至少两个性能度量的参数的至少一个组合。该方法包括获得具有不同可变参数的可能热交换器配置的边界条件的性能指标，以确定优化热交换器的性能指标的参数的组合。

6. 发明申请

US20120160019A1 MICRO-FLUIDIC TEST APPARATUS AND METHOD 有权
标题翻译：微流体测试装置和方法
公开(公告)号：US20120160019A1
公开(公告)日：2012-06-28
申请号：US13410910
申请日：2012-03-02
申请人： Govindarajan NATARAJAN , Emmanuel DELAMARCHE , Eric A. ECKBERG , James N. HUMENIK , Kathleen A. MCGRODDY-GOETZ , Scott PARTINGTON , Christopher F. PERRERA , Marco G. TRIVELLA , Timothy M. WIWEL
发明人： Govindarajan NATARAJAN , Emmanuel DELAMARCHE , Eric A. ECKBERG , James N. HUMENIK , Kathleen A. MCGRODDY-GOETZ , Scott PARTINGTON , Christopher F. PERRERA , Marco G. TRIVELLA , Timothy M. WIWEL
IPC分类号： G01N13/04
CPC分类号： G01N33/487 , A61B5/685 , B01L3/0268 , B01L3/5025 , B01L3/502715 , B01L2300/0645 , B01L2300/0887 , B01L2400/0406 , B01L2400/0481 , G01N27/07 , Y10T436/2575
摘要： An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.
摘要翻译：用于测定流体渗透压的装置，系统和方法。该装置包括至少一个微流体回路和与微流体回路连通的至少一个电路，用于确定包含在至少一个微流体回路内的流体的性质。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式