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    • 2. 发明专利
    • Polyamide molding material and use of the material for producing led housing member
    • 聚酰胺模塑材料和用于生产LED外壳的材料的使用
    • JP2011241398A
    • 2011-12-01
    • JP2011110334
    • 2011-05-17
    • Ems-Patent Agエーエムエス−パテント アクチェンゲゼルシャフト
    • LAMBERTS NIKOLAIBAYER ANDREASHEWEL MANFREDHOFF HEINZ
    • C08L77/06C08K3/22C08K3/26C08K7/14C08K9/00
    • C08K3/26C08K3/22C08K7/14C08L77/06
    • PROBLEM TO BE SOLVED: To provide a molding material containing a semi-aromatic polyamide as a base material which is suitable for producing a white housing member for a light emitting diode (LED).SOLUTION: This polyamide molding material is a polyamide molding material containing as a base material, a semi-crystalline polyamide for producing an LED housing or housing member having high strength and high long period reflectance and hardly causing blistering, which contains (A) 40 to 80 mass% of at least one type of semi-aromatic polyamide (having a melting temperature (Tm) of 270°C to 340°C) containing as base materials, at least 70 mol% of an aromatic dicarboxylic acid and at least 70 mol% of an aliphatic diamine (having 4 to 18 carbon atoms), (B) 10 to 30 mass% of titanium dioxide particles, (C) 5 to 20 mass% of a glass fiber, and (D) 5 to 30 mass% of calcium carbonate.
    • 解决的问题:提供一种含有半芳族聚酰胺作为适合于制造用于发光二极管(LED)的白色壳体构件的基材的成型材料。 解决方案:该聚酰胺成型材料是含有作为基材的聚酰胺成型材料,用于制造LED壳体的半结晶性聚酰胺或具有高强度和高长周期反射率并且几乎不引起起泡的壳体构件,其含有(A )40〜80质量%的作为基材的至少一种半芳族聚酰胺(熔融温度(Tm)为270℃〜340℃),至少70摩尔%的芳香族二羧酸和 脂肪族二胺(碳原子数4〜18)至少70摩尔%,(B)10〜30质量%的二氧化钛粒子,(C)5〜20质量%的玻璃纤维,(D)5〜30 质量%的碳酸钙。 版权所有(C)2012,JPO&INPIT
    • 4. 发明专利
    • Polyamide molding compound and its use
    • 聚酰胺模塑料及其用途
    • JP2014043577A
    • 2014-03-13
    • JP2013175787
    • 2013-08-27
    • Ems-Patent Agエーエムエス−パテント アクチェンゲゼルシャフト
    • MARK PFLEGHARSTOEPPELMANN GEORGPHILIPP HARDERLAMBERTS NIKOLAI
    • C08L101/00C08K7/14C08L77/00
    • C08K7/14C08K3/22C08K3/26C08K3/30C08L77/00
    • PROBLEM TO BE SOLVED: To provide a reinforcing thermoplastic molding compound formed using a glass fiber and a granular filler material, and a component formed thereof.SOLUTION: The thermoplastic molding compound consists of: (A) 20-88 mass% of a thermoplastic compound, preferably, a polyamide; (B) 10-70 mass% of a fiber type aggregate; (B1) 10-70 mass% of a glass fiber mainly made of a silicon dioxide, an aluminium oxide and a magnesium oxide; (B2) 0-20 mass% of a glass fiber different from the fiber of (B1); (B3) 0-20 mass% of a fiber type aggregate to be added different from the fibers of (B1) and (B2), without using glass as a principal component and selected from the following group: a carbon fiber, a graphite fiber, an aramid fiber and a nanotube; (C) 2-40 mass% of a granular filler material; and (D) 0-2 mass% of an additive. The total amount of (A)-(D) is 100 mass%. An device according to the present invention uses the molding compound as a principal component.
    • 要解决的问题:提供一种使用玻璃纤维和粒状填充材料形成的增强热塑性模塑料及其形成的组分。热塑性模塑料由以下组成:(A)20-88质量%的热塑性化合物 ,优选聚酰胺; (B)10-70质量%的纤维型骨料; (B1)主要由二氧化硅,氧化铝和氧化镁构成的玻璃纤维的10-70质量% (B2)0-20质量%的与(B1)的纤维不同的玻璃纤维; (B3)不使用玻璃作为主要成分的(B1)和(B2)的纤维,添加0-20质量%的纤维型聚集体,并且选自以下组:碳纤维,石墨纤维 芳族聚酰胺纤维和纳米管; (C)2-40质量%的粒状填料; (D)0-2质量%的添加剂。 (A) - (D)的总量为100质量%。 根据本发明的装置使用模塑料作为主要成分。
    • 10. 发明专利
    • High-temperature polyamide molding compound reinforced with flat glass fiber
    • 用平板玻璃纤维增​​强的高温聚酰胺模塑复合材料
    • JP2009079212A
    • 2009-04-16
    • JP2008211180
    • 2008-08-19
    • Ems-Patent Agエムス−パテント アーゲー
    • HARDER PHILLIPPJELTSCH THOMASLAMBERTS NIKOLAI
    • C08L77/00B29C45/00B29K77/00C08K7/14
    • C08G69/26C08G69/265C08G69/36C08K7/14C08K2201/016C08L77/06C08L2205/16
    • PROBLEM TO BE SOLVED: To provide a new reinforced polyamide molding compound based on high-melting point polyamide, which has a high distortion temperature with excellent mechanical properties and processing characteristics. SOLUTION: In the reinforced polyamide molding compound containing a high-melting point polyamide and a flat glass fiber, the polyamide is a partial aromatic polyamide having at least DSC melting point of 270°C, and the flat glass fiber has particularly a rectangular cross section, i.e., a noncircular cross-sectional area, the dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis being 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compound and a molded article manufactured therefrom, i.e., in particular an injection-molded part. The inventive molded part has a high transverse stiffness and transverse strength. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种基于高熔点聚酰胺的新的增强聚酰胺模塑料,其具有高的变形温度和优异的机械性能和加工特性。 解决方案:在含有高熔点聚酰胺和平板玻璃纤维的增强聚酰胺模塑料中,聚酰胺是至少具有DSC熔点为270℃的部分芳族聚酰胺,并且平板玻璃纤维具有特别的 矩形截面,即非圆形横截面积,主横截面轴线与次横截面轴线的尺寸比为2至6,特别是3至6,最特别优选3.5至5.0。 本发明还涉及一种用于制造聚酰胺模塑料的方法和由其制造的模塑制品,特别是注模部件。 本发明的模制件具有高的横向刚度和横向强度。 版权所有(C)2009,JPO&INPIT