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    • 2. 发明申请
    • METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE BOND BETWEEN AN ELECTRICAL LINE AND AN ELECTRICALLY CONDUCTIVE COMPONENT AND ASSEMBLY PRODUCED USING THE METHOD
    • 在电气线路和电气导电部件之间生产电气导电键的方法和使用该方法生产的组件
    • US20150325930A1
    • 2015-11-12
    • US14804989
    • 2015-07-21
    • ElringKlinger AG
    • Udo HoenleMark LadererMoritz BertschUlrich Sauter
    • H01R4/18H01R43/048
    • To provide a method for producing an electrically conductive bond between an electrical line, which includes a plurality of individual conductors, and an electrically conductive component, including producing from a crimp element blank a crimp element enclosing portions of the individual conductors, the crimp element including a continuous side and a discontinuous side, at which edge regions of the crimp element lie opposite one another, and substance-to-substance bonding of the crimp element with a contact surface of the component, which is simple to carry out and nevertheless always results in a robust substance-to-substance bond between the crimp element and the component, it is proposed that the crimp element be produced in such a way that the continuous side of the crimp element includes two bearing surfaces which are spaced from one another, at which the crimp element is substance-to-substance bondable to the contact surface of the component.
    • 为了提供一种用于在包括多个单独导体的电线和导电部件之间制造导电接合的方法,包括由压接元件坯件产生封闭各个导体的部分的压接元件,所述压接元件包括 连续侧和不连续侧,压接元件的边缘区域彼此相对置,并且压接元件与部件的接触表面的物质到物质的接合,其易于执行,然而总是结果 在卷曲元件和部件之间的坚固的物质到物质之间的连接中,提出了压接元件的制造方式使得压接元件的连续侧包括彼此间隔开的两个支承表面, 所述卷曲元件与所述部件的接触表面粘合在一起。