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    • 4. 发明申请
    • LIGHT EXPOSURE MASK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    • 光曝光掩模及使用其制造半导体器件的方法
    • US20110170084A1
    • 2011-07-14
    • US13069491
    • 2011-03-23
    • Hideto OhnumaMasaharu Nagai
    • Hideto OhnumaMasaharu Nagai
    • G03B27/72
    • H01L27/1288G03F1/50H01L27/1214H01L27/124H01L27/127H01L29/42384H01L29/66757H01L29/78621
    • The present invention provides a light exposure mask which can form a photoresist layer in a semi-transmissive portion with uniform thickness, and a method for manufacturing a semiconductor device in which the number of photolithography steps (the number of masks) necessary for manufacturing a TFT substrate is reduced by using the light exposure mask. A light exposure mask is used, which includes a transmissive portion, a light shielding portion, and a semi-transmissive portion having a light intensity reduction function where lines and spaces are repeatedly formed, wherein the sum of a line width L of a light shielding material and a space width S between light shielding materials in the semi-transmissive portion satisfies a conditional expression (2n/3)×m≦L+S≦(6n/5)×m when a resolution of a light exposure apparatus is represented by n and a projection magnification is represented by 1/m (m≧1).
    • 本发明提供一种能够在均匀厚度的半透射部分中形成光致抗蚀剂层的曝光掩模,以及制造半导体器件的方法,其中制造TFT所需的光刻步骤数(掩模数) 通过使用曝光掩模来减少衬底。 使用曝光掩模,其包括透射部分,遮光部分和具有重复形成线和间隔的光强降低功能的半透射部分,其中遮光层的线宽L之和 材料和半透射部分的遮光材料之间的空间宽度S满足条件表达式(2n / 3)×m≦̸ L + S≦̸(6n / 5)×m,当曝光装置的分辨率由 n,投影倍率由1 / m(m≥1)表示。
    • 10. 发明授权
    • Semiconductor device, method for manufacturing semiconductor device, and electronic appliance
    • 半导体装置,半导体装置的制造方法以及电子设备
    • US08426945B2
    • 2013-04-23
    • US13225752
    • 2011-09-06
    • Masaharu NagaiTakafumi Mizoguchi
    • Masaharu NagaiTakafumi Mizoguchi
    • H01L29/06
    • H01L29/78648H01L29/6675H01L29/66757H01L29/66765H01L29/78621
    • To provide a semiconductor device in which a channel formation region can be thinned without adversely affecting a source region and a drain region through a simple process and a method for manufacturing the semiconductor device. In the method for manufacturing a semiconductor device, a semiconductor film, having a thickness smaller than a height of a projection of a substrate, is formed over a surface of the substrate having the projections; the semiconductor film is etched to have an island shape with a resist used as a mask; the resist is etched to expose a portion of the semiconductor film which covers a top surface of the projection; and the exposed portion of the semiconductor film is etched to be thin, while the adjacent portions of the semiconductor film on both sides of the projection remain covered with the resist.
    • 为了提供一种半导体器件,其中可以通过简单的工艺减少沟道形成区域而不会不利地影响源极区域和漏极区域,以及制造半导体器件的方法。 在半导体装置的制造方法中,在具有突起的基板的表面上形成厚度小于基板突起的高度的半导体膜, 蚀刻半导体膜以具有岛状,其中抗蚀剂用作掩模; 蚀刻抗蚀剂以暴露覆盖突起的顶表面的半导体膜的一部分; 并且半导体膜的暴露部分被蚀刻为薄,同时半导体膜在投影两侧的相邻部分保持被抗蚀剂覆盖。