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    • 3. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US08900401B2
    • 2014-12-02
    • US12846403
    • 2010-07-29
    • Eiji IkegamiShoji IkuharaTakeshi ShimadaKenichi KuwabaraTakao AraseTsuyoshi Matsumoto
    • Eiji IkegamiShoji IkuharaTakeshi ShimadaKenichi KuwabaraTakao AraseTsuyoshi Matsumoto
    • H01L21/306H01J37/32
    • H01J37/32963H01J37/32082H01J37/32091H01J37/321H01J37/3211H01J37/32192H01J37/32917H01J37/32926H01J37/32935H01J37/32981H01J37/3299H01J2237/1825H01J2237/327H01L21/67069H01L21/67242H05H1/46
    • Plasma processing of plural substrates is performed in a plasma processing apparatus, which is provided with a plasma processing chamber having an antenna electrode and a lower electrode for placing and retaining the plural substrates in turn within the plasma processing chamber, a gas feeder for feeding processing gas into the processing chamber, a vacuum pump for discharging gas from the processing chamber via a vacuum valve, and a solenoid coil for forming a magnetic field within the processing chamber. At least one of the plural substrates is placed on the lower electrode, and the processing gas is fed into the processing chamber. RF power is fed to the antenna electrode via a matching network to produce a plasma within the processing chamber in which a magnetic field has been formed by the solenoid coil. This placing of at least one substrate and this feeding of the processing gas are then repeated until the plasma processing of all of the plural substrates is completed. An end of seasoning is determined when a parameter including an internal pressure of the processing chamber has become stable to a steady value with plasma processing time.
    • 在具有等离子体处理室的等离子体处理装置中进行多个基板的等离子体处理,该等离子体处理室具有用于在等离子体处理室内依次放置和保持多个基板的天线电极和下部电极,供给处理用气体供给装置 气体进入处理室,用于经由真空阀从处理室排出气体的真空泵和用于在处理室内形成磁场的螺线管线圈。 多个基板中的至少一个被放置在下电极上,并且处理气体被馈送到处理室中。 RF功率经由匹配网络馈送到天线电极,以在处理室内产生等离子体,其中已经由螺线管线圈形成了磁场。 然后重复这种至少一个基板的放置和该处理气体的进料,直至完成所有多个基板的等离子体处理。 当包括处理室的内部压力的参数在具有等离子体处理时间的稳定值变得稳定时,确定调味品的结束。
    • 4. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US08038896B2
    • 2011-10-18
    • US11502416
    • 2006-08-11
    • Eiji IkegamiShoji IkuharaTakeshi ShimadaKenichi KuwabaraTakao AraseTsuyoshi Matsumoto
    • Eiji IkegamiShoji IkuharaTakeshi ShimadaKenichi KuwabaraTakao AraseTsuyoshi Matsumoto
    • G01L21/30C23F1/00
    • H01J37/32963H01J37/32082H01J37/32091H01J37/321H01J37/3211H01J37/32192H01J37/32917H01J37/32926H01J37/32935H01J37/32981H01J37/3299H01J2237/1825H01J2237/327H01L21/67069H01L21/67242H05H1/46
    • Plasma processing of plural substrates is performed in a plasma processing apparatus, which is provided with a plasma processing chamber having an antenna electrode and a lower electrode for placing and retaining the plural substrates in turn within the plasma processing chamber, a gas feeder for feeding processing gas into the processing chamber, a vacuum pump for discharging gas from the processing chamber via a vacuum valve, and a solenoid coil for forming a magnetic field within the processing chamber. At least one of the plural substrates is placed on the lower electrode, and the processing gas is fed into the processing chamber. RF power is fed to the antenna electrode via a matching network to produce a plasma within the processing chamber in which a magnetic field has been formed by the solenoid coil. This placing of at least one substrate and this feeding of the processing gas are then repeated until the plasma processing of all of the plural substrates is completed. An end of seasoning is determined when a parameter including an internal pressure of the processing chamber has become stable to a steady value with plasma processing time.
    • 在具有等离子体处理室的等离子体处理装置中进行多个基板的等离子体处理,该等离子体处理室具有用于在等离子体处理室内依次放置和保持多个基板的天线电极和下部电极,供给处理用气体供给装置 气体进入处理室,用于经由真空阀从处理室排出气体的真空泵和用于在处理室内形成磁场的螺线管线圈。 多个基板中的至少一个被放置在下电极上,并且处理气体被馈送到处理室中。 RF功率经由匹配网络馈送到天线电极,以在处理室内产生等离子体,其中已经由螺线管线圈形成了磁场。 然后重复这种至少一个基板的放置和该处理气体的进料,直至完成所有多个基板的等离子体处理。 当包括处理室的内部压力的参数在具有等离子体处理时间的稳定值变得稳定时,确定调味品的结束。
    • 5. 发明授权
    • Vacuum processing apparatus and vacuum processing method
    • 真空加工设备和真空加工方法
    • US07112805B2
    • 2006-09-26
    • US10875231
    • 2004-06-25
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • G01F23/00G01K5/08
    • H01L21/67207H01L21/67167
    • The invention provides a semiconductor fabrication apparatus capable of preventing increase of carriage time of samples, deterioration of sample output, increase of footprint and increase of investment costs. The vacuum processing apparatus comprises a plurality of vacuum processing chambers for subjecting a sample to vacuum processing; a vacuum carriage for carrying the sample into and out of the vacuum processing chamber; a switchable chamber capable of being switched between atmosphere and vacuum for carrying the sample into and out of the vacuum processing chamber; a cassette support for supporting a plurality of cassettes and a controller for controlling carrying of the sample from a cassette through the switchable chambers, the vacuum carriage means into and out of the vacuum processing chamber. The vacuum processing chamber is equipped with an etching chamber and a critical dimension measurement chamber for critical dimension inspection of the sample.
    • 本发明提供一种半导体制造装置,其能够防止样品的携带时间增加,样品输出的劣化,占地面积的增加和投资成本的增加。 真空处理装置包括用于对样品进行真空处理的多个真空处理室; 用于将样品进入和离开真空处理室的真空托架; 能够在大气和真空之间切换以将样品进出真空处理室的可切换室; 用于支撑多个盒的盒支撑件和控制器,用于控制样品从盒通过可切换室的携带,真空托架装置进入和离开真空处理室。 真空处理室配有蚀刻室和临界尺寸测量室,用于对样品进行临界尺寸检验。
    • 7. 发明申请
    • Vacuum processing apparatus and vacuum processing method
    • 真空加工设备和真空加工方法
    • US20050218337A1
    • 2005-10-06
    • US10875231
    • 2004-06-25
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • H01L21/66H01J37/20H01L21/00H01L21/02H01L21/677H01L21/68
    • H01L21/67207H01L21/67167
    • The invention provides a semiconductor fabrication apparatus capable of preventing increase of carriage time of samples, deterioration of sample output, increase of footprint and increase of investment costs. The vacuum processing apparatus comprises a plurality of vacuum processing chambers 3, 4 for subjecting a sample 8 to vacuum processing; a vacuum carriage means 2 for carrying the sample into and out of the vacuum processing chamber; a switchable chamber 5 capable of being switched between atmosphere and vacuum for carrying the sample into and out of the vacuum processing chamber; a cassette supporting means 9 for supporting a plurality of cassettes 7 capable of housing samples; a carriage means 6 capable of moving vertically for taking out a sample from a given cassette on the cassette supporting means; and a control means performing carriage control for carrying the sample taken out of the given cassette via the carriage means, the switchable chamber and the vacuum carriage means into the vacuum processing chamber, and for carrying the processed sample out of the vacuum processing chamber; wherein the vacuum processing chamber is equipped with an etching chamber 3 and a defect inspection chamber or CD measurement chamber 4 for inspecting the sample for defects.
    • 本发明提供一种半导体制造装置,其能够防止样品的携带时间增加,样品输出的劣化,占地面积的增加和投资成本的增加。 真空处理装置包括用于对样品8进行真空处理的多个真空处理室3,4; 用于将样品进出真空处理室的真空托架装置2; 能够在大气和真空之间切换的可切换室5,用于将样品进出真空处理室; 用于支撑能够容纳样品的多个盒带7的盒支撑装置9; 能够垂直移动以从盒支撑装置上的给定盒带取出样品的托架装置6; 以及控制装置,执行托架控制,用于将从所述给定盒中取出的样品经由所述滑架装置,所述可切换室和所述真空托架装置运送到所述真空处理室中,并将所述经处理的样品运送出所述真空处理室; 其中真空处理室配备有用于检查样品缺陷的蚀刻室3和缺陷检查室或CD测量室4。