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1. 发明申请

US20130323345A1 FIXTURE FOR SHAPING A LAMINATE SUBSTRATE 有权
标题翻译：用于形成层压基板的形状
公开(公告)号：US20130323345A1
公开(公告)日：2013-12-05
申请号：US13488693
申请日：2012-06-05
申请人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
发明人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC分类号： B29C53/18
CPC分类号： H01L24/75 , H01L23/562 , H01L24/81 , H01L2224/16 , H01L2224/75983 , H01L2224/75987 , H01L2224/81024 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81912 , H01L2224/83192 , H01L2924/10253 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要： A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.
摘要翻译：用于成型层压基板的固定装置包括捕获环，基板和中心按钮。基板包括适于接收层压基板的凹部。中心按钮设置在基板的开口中。可以调节中心按钮以使层压基板成形。

2. 发明授权

US09059240B2 Fixture for shaping a laminate substrate 有权
标题翻译：用于成型层压基板的夹具
公开(公告)号：US09059240B2
公开(公告)日：2015-06-16
申请号：US13488693
申请日：2012-06-05
申请人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
发明人： Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC分类号： B29C53/18 , H01L23/00
CPC分类号： H01L24/75 , H01L23/562 , H01L24/81 , H01L2224/16 , H01L2224/75983 , H01L2224/75987 , H01L2224/81024 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81912 , H01L2224/83192 , H01L2924/10253 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要： A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.
摘要翻译：用于成型层压基板的固定装置包括捕获环，基板和中心按钮。基板包括适于接收层压基板的凹部。中心按钮设置在基板的开口中。可以调节中心按钮以使层压基板成形。

3. 发明授权

US09048245B2 Method for shaping a laminate substrate 有权
标题翻译：层压基板成型方法
公开(公告)号：US09048245B2
公开(公告)日：2015-06-02
申请号：US13488678
申请日：2012-06-05
申请人： Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
发明人： Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC分类号： B23K31/00 , B23K31/02 , B23K1/00 , B23K1/008 , B23K1/19 , B23K37/00 , B23K37/04 , H01L23/00 , H01L21/673
CPC分类号： H01L23/562 , H01L21/67333 , H01L22/12 , H01L22/20 , H01L24/81 , H01L2224/16225 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H01L2924/3511 , Y02P80/30
摘要： A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.
摘要翻译：一种方法，包括提供包括陷阱环的固定装置，具有适于接收层压基板的凹部的基板，所述基板包括设置在所述开口中的开口和可调节的高度中心按钮，所述开口位于所述凹部内并且位于在层压基板的中心，通过使用室温技术和高温技术中的一种来表征层压基板的翘曲特性，基于翘曲特性确定水平面变形，并将层压基板放置到固定装置中，校正水平面失真，调节由可调高度中心按钮提供，其中可调节的高度中心按钮接触层压基板。该方法还包括使层压基板熔化，将芯片放置在层压基板上，并将固定装置放入回流炉中以连接芯片和层叠基板。

4. 发明申请

US20130320069A1 METHOD FOR SHAPING A LAMINATE SUBSTRATE 有权
标题翻译：形成层压基板的方法
公开(公告)号：US20130320069A1
公开(公告)日：2013-12-05
申请号：US13488678
申请日：2012-06-05
申请人： Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
发明人： Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC分类号： B23K31/12
CPC分类号： H01L23/562 , H01L21/67333 , H01L22/12 , H01L22/20 , H01L24/81 , H01L2224/16225 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H01L2924/3511 , Y02P80/30
摘要： A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics. The laminate substrate is placed into a fixture with a correction to shape the laminate substrate based on the warpage characteristics. The laminate substrate is fluxed. A chip is placed onto the laminate substrate. The fixture is placed into a reflow furnace to join the chip and the laminate substrate. The fixture is removed from the reflow furnace. A warpage measurement is performed on the joined chip and laminate substrate. The correction may be modified if shorts are observed at the chip site.
摘要翻译：用于成型层叠基板的方法包括表征层压基板的翘曲特性。基于翘曲特性，将层压基板放置在具有校正以校正层压基板的固定装置中。层压基板被熔化。将芯片放置在层压基板上。将夹具放入回流炉中以连接芯片和层压基板。夹具从回流炉中取出。在接合的芯片和层叠基板上进行翘曲测量。如果在芯片位置观察到短路，则可以修改校正。

5. 发明申请

US20130112006A1 DETERMINING MAGNITUDE OF COMPRESSIVE LOADING 有权
标题翻译：确定压缩载荷的大小
公开(公告)号：US20130112006A1
公开(公告)日：2013-05-09
申请号：US13289121
申请日：2011-11-04
申请人： PAUL F. BODENWEBER , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
发明人： PAUL F. BODENWEBER , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
IPC分类号： G01N3/08
CPC分类号： G01L5/0038 , G01L5/0057 , G01L5/0076 , G01N3/08 , G01N27/22 , G01N2203/0617 , G01N2203/0629 , G01N2203/0682
摘要： An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.
摘要翻译：提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

6. 发明授权

US08794079B2 Determining magnitude of compressive loading 有权
标题翻译：确定压缩载荷的大小
公开(公告)号：US08794079B2
公开(公告)日：2014-08-05
申请号：US13289121
申请日：2011-11-04
申请人： Paul F. Bodenweber , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
发明人： Paul F. Bodenweber , Virendra R. Jadhav , Steven P. Ostrander , Kamal Sikka , Jiantao Zheng , Jeffrey A. Zitz
IPC分类号： G01N3/08
CPC分类号： G01L5/0038 , G01L5/0057 , G01L5/0076 , G01N3/08 , G01N27/22 , G01N2203/0617 , G01N2203/0629 , G01N2203/0682
摘要： An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.
摘要翻译：提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

7. 发明申请

US20120007229A1 ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING 有权
标题翻译： 3-D堆叠式包装的增强热管理
公开(公告)号：US20120007229A1
公开(公告)日：2012-01-12
申请号：US12832732
申请日：2010-07-08
申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
发明人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/14 , H01L23/147 , H01L23/3677 , H01L23/42 , H01L23/433 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/3003 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3303 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10271 , H01L2924/16195 , H01L2924/163 , H01L2924/167 , H01L2924/00 , H01L2224/0401
摘要： A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
摘要翻译：提供了一个管芯堆叠封装，包括一个基板，一堆计算部件，至少一个与该堆叠热交换的热板，以及一个支撑在基板上的盖子，以围绕堆叠和至少一个热板，从而限定从所述计算部件之一经由所述至少一个热板和联接到所述盖的表面和所述至少一个热板的翅片延伸到所述盖的第一热传递路径，以及从所述至少一个热板延伸的第二传热路径计算组件之一到盖表面而不通过至少一个热板。

8. 发明授权

US08299608B2 Enhanced thermal management of 3-D stacked die packaging 有权
标题翻译： 3-D堆叠模具封装的增强热管理
公开(公告)号：US08299608B2
公开(公告)日：2012-10-30
申请号：US12832732
申请日：2010-07-08
申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
发明人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
IPC分类号： H01L23/36 , H01L21/58
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/14 , H01L23/147 , H01L23/3677 , H01L23/42 , H01L23/433 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/3003 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3303 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10271 , H01L2924/16195 , H01L2924/163 , H01L2924/167 , H01L2924/00 , H01L2224/0401
摘要： A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
摘要翻译：提供了一个管芯堆叠封装，包括一个基板，一堆计算部件，至少一个与该堆叠热交换的热板，以及一个支撑在基板上的盖子，以围绕堆叠和至少一个热板，从而限定从所述计算部件之一经由所述至少一个热板和联接到所述盖的表面和所述至少一个热板的翅片延伸到所述盖的第一热传递路径，以及从所述至少一个热板延伸的第二传热路径计算组件之一到盖表面而不通过至少一个热板。

9. 发明申请

US20130027063A1 DETERMINING THERMAL INTERFACE MATERIAL (TIM) THICKNESS CHANGE 失效
标题翻译：确定热界面材料（TIM）厚度变化
公开(公告)号：US20130027063A1
公开(公告)日：2013-01-31
申请号：US13191729
申请日：2011-07-27
申请人： PAUL F. BODENWEBER , Virendra R. Jadhav , Kamal K. Sikka , Jiantao Zheng , Jeffrey A. Zitz
发明人： PAUL F. BODENWEBER , Virendra R. Jadhav , Kamal K. Sikka , Jiantao Zheng , Jeffrey A. Zitz
IPC分类号： G01R27/26
CPC分类号： G01B7/08 , G01N27/22 , H01L22/12
摘要： An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change.
摘要翻译：提供一种用于确定设置在第一和第二元件之间的热界面材料（TIM）的厚度变化的装置。该装置包括：第一部件，沿第一部件可沿着移动方向移动，TIM移动方向上沿着移动方向确定TIM厚度;第二部件，其沿着移动方向与第二部件移动;以及传感器，用于测量第一部件和第二部件之间的距离在移动方向上，测量的距离与TIM厚度变化有关。

10. 发明授权

US07875972B2 Semiconductor device assembly having a stress-relieving buffer layer 有权
标题翻译：具有应力消除缓冲层的半导体器件组件
公开(公告)号：US07875972B2
公开(公告)日：2011-01-25
申请号：US12491517
申请日：2009-06-25
申请人： Virendra R. Jadhav , Kamal K. Sikka , Jiantao Zheng
发明人： Virendra R. Jadhav , Kamal K. Sikka , Jiantao Zheng
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L2224/73204 , H01L2224/73253 , H01L2224/83951
摘要： Disclosed is a multilayer thermal interface material which includes a first layer of metallic thermal interface material, a buffer layer and preferably a second layer of thermal interface material which may be metallic or nonmetallic. The multilayer thermal interface material is used in conjunction with a semiconductor device assembly of a chip carrier substrate, a heat spreader for attaching to the substrate, a semiconductor device mounted on the substrate and underneath the heat spreader and the multilayer thermal interface material interposed between the heat spreader and the semiconductor device. The heat spreader has a first coefficient of thermal expansion (CTE), CTE1, the buffer layer has a second CTE, CTE2, and the semiconductor device has a third CTE, CTE3, wherein CTE1>CTE2>CTE3.
摘要翻译：公开了一种多层热界面材料，其包括金属热界面材料的第一层，缓冲层，优选为第二层热界面材料，其可以是金属或非金属的。多层热界面材料与芯片载体衬底的半导体器件组件，用于附接到衬底的散热器，安装在衬底上的散热器和放置在散热器下方的多层热界面材料结合使用散热器和半导体器件。散热器具有第一热膨胀系数（CTE），CTE1，缓冲层具有第二CTE，CTE2，半导体器件具有第三个CTE CTE3，其中CTE1> CTE2> CTE3。

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