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1. 发明申请

WO2018008343A1 SUBSTRATE-HOLDER INSPECTION APPARATUS, PLATING APPARATUS INCLUDING THE SAME, AND APPEARANCE INSPECTION APPARATUS 审中-公开
标题翻译：基板保持器检查装置，包括该装置的电镀装置和外观检查装置
公开(公告)号：WO2018008343A1
公开(公告)日：2018-01-11
申请号：PCT/JP2017/022028
申请日：2017-06-07
申请人： EBARA CORPORATION
发明人： MUKAIYAMA, Yoshitaka , YOKOYAMA, Toshio , OISHI, Kunio , KIMURA, Masaaki , FUJIKATA, Jumpei
IPC分类号： C25D17/06 , C25D21/12 , G01N21/84 , H01L21/677
摘要： An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to contact a substrate to allow current flow to the substrate and a sealing member configured to seal a surface of the substrate and that inspects a substrate holder holding the substrate is provided. The inspection apparatus includes a stocker installation part in which a stocker configured to house the substrate holder is installed, a cleaning device configured to cleanse the substrate holder, a substrate attaching/detaching device configured to open and close the substrate holder, an appearance inspection apparatus configured to acquire image data or shape data of appearance of at least one of the sealing member and the electric contact, and a conveyer configured to convey the substrate holder among the stocker, the cleaning device, and the appearance inspection apparatus.
摘要翻译：提供了能够自动检查基板支架的检查装置，电镀装置和外观检查装置。本发明提供一种检查装置，该检查装置具备与基板接触而使电流流向基板的电接点，以及对基板的表面进行密封并检查保持基板的基板支架的密封构件。检查装置包括：储料器安装部，配置为容纳基板保持器的储料器安装在该储料器安装部中;清洁装置，构造成清洁基板保持器;构造成打开和关闭基板保持器的基板附接/拆卸装置;外观检查装置其被构造为获取密封构件和电触头中的至少一个的外观的图像数据或形状数据;传送器，其构造成在储料器，清洁装置和外观检查装置之间传送基板保持器。

2. 发明公开

EP1113093A1 PLATING JIG AND DEVICE FOR SEMICONDUCTOR WAFER 有权
标题翻译： BESCHICHTUNGSTRÄGERUND -VORRICHTUNGFÜRHALBLEITERWAFER
公开(公告)号：EP1113093A1
公开(公告)日：2001-07-04
申请号：EP99919638.9
申请日：1999-05-18
申请人： EBARA CORPORATION
发明人： YOSHIOKA, Junichiro , MUKAIYAMA, Yoshitaka
IPC分类号： C25D17/06
CPC分类号： H01L21/68721 , C25D17/001 , C25D17/06 , H01L21/68785
摘要： A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
摘要翻译：半导体晶片保持器包括保持半导体晶片的第一和第二保持构件。第二保持构件包括与第一保持构件和半导体晶片的第一导电元件接触放置的第二导电元件。使用环形夹将第二保持构件压靠在第一保持构件上用于保持半导体晶片。

3. 发明授权

EP1113093B1 SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A SEMICONDUCTOR WAFER 有权
标题翻译：包被载和设备的半导体晶片等
公开(公告)号：EP1113093B1
公开(公告)日：2014-04-23
申请号：EP99919638.9
申请日：1999-05-18
申请人： EBARA CORPORATION
发明人： YOSHIOKA, Junichiro , MUKAIYAMA, Yoshitaka
IPC分类号： C25D17/06
CPC分类号： H01L21/68721 , C25D17/001 , C25D17/06 , H01L21/68785

4. 发明公开

EP1048755A1 PLATING DEVICE AND METHOD OF CONFIRMING CURRENT FEED 审中-公开
标题翻译：平顶山庄VERFHREN ZURBESTÄTIGUNGDER STROMZUFUHR
公开(公告)号：EP1048755A1
公开(公告)日：2000-11-02
申请号：EP98961353.4
申请日：1998-12-16
申请人： Ebara Corporation
发明人： YOSHIOKA, Junichiro , SENDAI, Satoshi , CHONO, Atsushi , TADA, Mitsuo , HONGO, Akihisa , MUKAIYAMA, Yoshitaka , TOMIOKA, Kenya , OGATA, Akira , SUZUKI, Kenichi , OZAWA, Naomitsu
IPC分类号： C25D17/08 , C25D5/08 , C25D21/12 , G01R27/02
CPC分类号： G01R31/026 , C25D21/12
摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.
In the plating apparatus, an anode 13 is disposed in a plating bath; a substrate 12 is mounted in a jig and disposed in the plating bath opposite the anode 13; and a plurality of feeder contacts 15 is contacting the conductive region formed on the surface of the substrate 12. A predetermined voltage is applied between the anode 13 and feeder contacts 15 to supply a plating current through the feeder contacts 15 for plating the substrate 12. The plating apparatus also includes a conductivity sensor 22 for detecting the state of conductivity between each of the feeder contacts 15 and the conductive region on the substrate 12.
摘要翻译：本发明提供一种电导率检测装置，其能够检测与基板的导电区域接触的多个馈电触头的导电性（接触状态），以及能够通过提供均匀电镀电流形成均匀厚度的镀膜的电镀装置通过多个馈线接触。在电镀装置中，阳极13设置在镀浴中; 基板12安装在夹具中并且设置在与阳极13相对的电镀槽中; 并且多个馈电触头15与形成在基板12的表面上的导电区域接触。在阳极13和馈电触头15之间施加预定电压，以通过馈电触头15提供电镀电流，以电镀基板12。电镀装置还包括用于检测馈电触头15和基板12上的导电区域之间的导电性状态的电导率传感器22。

5. 发明公开

EP4230414A1 BUFFER CHAMBER AND AM SYSTEM EQUIPPED WITH BUFFER CHAMBER 审中-实审
公开(公告)号：EP4230414A1
公开(公告)日：2023-08-23
申请号：EP21879806.4
申请日：2021-09-14
申请人： EBARA CORPORATION
发明人： SHINOZAKI, Hiroyuki , ASAI, Junki , MUKAIYAMA, Yoshitaka
IPC分类号： B33Y10/00 , B33Y30/00 , B29C64/153 , B29C64/25 , B29C64/35 , B29C64/364 , B29C64/371 , B22F10/322 , B22F12/00 , B22F12/70 , B22F12/80
摘要： The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area.
According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.

6. 发明授权

EP3029180B1 PLATING APPARATUS AND PLATING METHOD 有权
标题翻译：电镀和电镀
公开(公告)号：EP3029180B1
公开(公告)日：2017-03-15
申请号：EP15195214.0
申请日：2015-11-18
申请人： Ebara Corporation
发明人： FUJIKATA, Jumpei , SHIMOYAMA, Masashi , NAKAGAWA, Yoichi , MUKAIYAMA, Yoshitaka , MINAMI, Yoshio
IPC分类号： C25D17/00 , C25D17/06 , H01L21/67 , C25D17/12 , C25D17/10
CPC分类号： C25D17/008 , C25D5/022 , C25D17/001 , C25D17/06 , C25D17/10

7. 发明公开

EP3029180A1 PLATING APPARATUS AND PLATING METHOD 有权
标题翻译： PLATTIERUNGSVORRICHTUNG UND PLATTIERUNGSVERFAHREN
公开(公告)号：EP3029180A1
公开(公告)日：2016-06-08
申请号：EP15195214.0
申请日：2015-11-18
申请人： Ebara Corporation
发明人： FUJIKATA, Jumpei , SHIMOYAMA, Masashi , NAKAGAWA, Yoichi , MUKAIYAMA, Yoshitaka , MINAMI, Yoshio
IPC分类号： C25D17/00 , C25D17/06 , H01L21/67 , C25D17/12 , C25D17/10
CPC分类号： C25D17/008 , C25D5/022 , C25D17/001 , C25D17/06 , C25D17/10
摘要： A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
摘要翻译：根据本公开的电镀设备包括：阳极保持器，其构造成保持阳极; 衬底保持器，其与所述阳极保持器相对放置并且构造成保持衬底; 以及阳极掩模，其安装在所述阳极保持器的前表面上并且设置有适于允许在阳极和所述基板之间流动的电流通过的第一开口。阳极掩模中的第一开口的直径被配置为可调节的。当第一基板被镀覆时，将第一开口的直径调节到第一直径。当第二基板被镀覆时，将第一开口的直径调节到小于第一直径的第二直径。

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