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    • 5. 发明申请
    • ELECTROLESS PLATING METHOD USING BLEACHING
    • 使用漂白的电镀方法
    • US20150125787A1
    • 2015-05-07
    • US14071951
    • 2013-11-05
    • EASTMAN KODAK COMPANY
    • Mark Edward IrvingThomas B. Brust
    • G03F7/16
    • G03F7/16C23C18/1603C23C18/1608C23C18/1612C23C18/166C23C18/204C23C18/2086G03F7/038G03F7/0392G03F7/265G03F7/405
    • A conductive pattern can be formed a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, (c) a crosslinking agent that is capable of reacting in the presence of the acid, and (d) optionally, a photosensitizer. The polymeric layer is patternwise exposed to provide non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. Both the non-exposed regions and the exposed regions of the polymeric layer are contacted with a reducing agent, bleached to remove surface amounts of the reducing agent in both non-exposed and exposed regions of the polymeric layer, and contacted with electroless seed metal ions to oxidize the reducing agent and to form corresponding electroless seed metal nuclei in the exposed regions. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.
    • 可以形成导电图案,该反应性聚合物包括叔烷基酯基团,(b)暴露于辐射时提供酸的化合物,(c)能够在酸存在下反应的交联剂和( d)任选的光敏剂。 聚合物层被图案化地暴露以提供非暴露区域和包含包含羧酸基团的聚合物的暴露区域。 未曝光区域和聚合物层的暴露区域与还原剂接触,漂白以除去聚合物层的未曝光和暴露区域中的表面量的还原剂,并与无电晶种金属离子 以在曝光区域中氧化还原剂并形成相应的无电子种子金属核。 然后将相应的无电子种子金属核用导电金属无电镀。