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    • 1. 发明申请
    • DEVICE AND METHOD FOR MEASURING A SUBSTRATE
    • US20220390356A1
    • 2022-12-08
    • US17774612
    • 2019-11-28
    • EV Group E. Thallner GmbH
    • Jacek GASIOROWSKIMarkus WIMPLINGER
    • G01N21/21G01N21/95G06F30/20
    • The invention relates to a method for measuring a multilayered substrate (1, 1′, 1″), particularly with at least one structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, particularly with a surface structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, characterized in that the method has at least the following steps, particularly the following procedure:
      producing (110) the substrate (1, 1′, 1″) with a plurality of layers (2, 3, 4, 5, 6, 6′, 6″), particularly with a structure (7, 7′, 7″, 7′″, 7IV, 7V), particularly with a structure (7, 7′, 7″, 7″′, 7IV, 7V) on a surface (6o, 6′o, 6″o) of an uppermost layer (6, 6′, 6″), wherein the dimensions of the layers and in particular the structures are known,
      measuring (120) the substrate (1, 1′, 1″), and in particular the structure (7, 7′, 7″, 7′″, 71IV, 7V)) using at least one measuring technology,
      creating (130) a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″),
      comparing (140) the measurement results with simulation results from the simulation of the substrate (1, 1′, 1″),
      optimizing the simulation (130) and renewed creation (130) of a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″), in the event that there is a deviation of the measurement results from the simulation results, or calculating (150) parameters of further substrates, in the event that the measurement results correspond to the simulation results.