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1. 发明申请

WO2006005317A3 METHOD FOR THE PRODUCTION OF AN ELECTRIC COMPONENT AND COMPONENT 审中-公开
标题翻译：方法带有电气部件和部件
公开(公告)号：WO2006005317A3
公开(公告)日：2006-06-15
申请号：PCT/DE2005001200
申请日：2005-07-06
申请人： EPCOS AG , BRUNNER SEBASTIAN , FEICHTINGER THOMAS , PUDMICH GUENTER , SCHLICK HORST , SCHMIDT-WINKEL PATRICK
发明人： BRUNNER SEBASTIAN , FEICHTINGER THOMAS , PUDMICH GUENTER , SCHLICK HORST , SCHMIDT-WINKEL PATRICK
IPC分类号： H01L21/60 , H01L21/48 , H01L23/485 , H01L23/498 , H05K3/40
CPC分类号： H05K3/4061 , H01L2924/0002 , H05K3/248 , H05K3/28 , H05K2201/035 , Y10T29/49155 , H01L2924/00
摘要： The invention relates to a method for the production of an electric component (1). Said method consists of the following steps; A) a ceramic base body (5) which comprises a through-contact (10) and at least one metal surface (20C) which is connected in an electrically conductive manner to the through-contact, is prepared. In step B), one first electrically insulating material is arranged in a layered manner on the surface of the base body and at least over the through-contact, and subsequently in step C) an electrically conductive second material is applied over the through-contact (10). In step D) a soldering contact (30B) is formed by means of hardening, said soldering contact binding, in an electrically conductive manner, the through-contact (10) through the passivation layer (25B) which is formed from a first material by means of sintering.
摘要翻译：它提出了一种方法，用于经由导电连接的金属化制造（1），其中，在一个方法步骤A中的陶瓷基体）被提供（5）的电组件，其包括通过（10）和至少一个与所述（20℃），在基体的第一，在工艺步骤B的电绝缘材料）在方法步骤C的导电性的第二材料）的表面通过设置在层中的至少在所施加的，并且此后在通孔（10）。在方法步骤D）中，焊料接触（30B）然后通过中，（通过在钝化层25B），其由所述第一材料通过烧结而形成，通过上述通路孔（10）导电地连接的固化来形成。

2. 发明申请

WO2006002615A2 ELECTRICAL MULTI-LAYERED COMPONENT HAVING A RELIABLE SOLDERING CONTACT 审中-公开
标题翻译：电多层器件具有可靠的焊料接触
公开(公告)号：WO2006002615A2
公开(公告)日：2006-01-12
申请号：PCT/DE2005001155
申请日：2005-06-30
申请人： EPCOS AG , BLOCK CHRISTIAN , BRUNNER SEBASTIAN , FEICHTINGER THOMAS , PUDMICH GUENTER
发明人： BLOCK CHRISTIAN , BRUNNER SEBASTIAN , FEICHTINGER THOMAS , PUDMICH GUENTER
IPC分类号： H01C1/144 , H01C1/14 , H01C7/105 , H01C7/18 , H01G2/06 , H01G4/228 , H01G4/232 , H01L23/48 , H01L23/498 , H05K1/03 , H05K1/11
CPC分类号： H01G4/232 , H01C1/14 , H01C1/144 , H01C7/18 , H01G4/228 , H01L23/49816 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K1/113 , H05K2201/09827 , H05K2201/09845 , Y10T29/417 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： The invention relates to an electric multi-layered component comprising ceramic dielectric layers which are stacked on top of each other between which component structures are arranged. The aim of the invention is to increase the mechanical stability, in particular soldering contact, on the component. As a result, an improved transversal form for transversal contacts is provided. Said transversal contacts have a transversal cross section which expands towards the top, at least partially, from the soldering contact to the lower side of the component.
摘要翻译：具有用于电多层器件，层叠插入的部件的结构，以增加机械稳定性，特别的焊料接触的陶瓷介电层被设置在通孔的部件的改进的横截面形状。这些具有至少部分地从所述部件的下侧焊接触点延伸备份的横截面。

3. 发明申请

WO2008009262A2 MODULE HAVING A FLAT STRUCTURE, AND EQUIPMENT METHOD 审中-公开
标题翻译：随着对组装扁平结构和方法MODULE
公开(公告)号：WO2008009262A2
公开(公告)日：2008-01-24
申请号：PCT/DE2007001155
申请日：2007-06-29
申请人： EPCOS AG , BLOCK CHRISTIAN , BRUNNER SEBASTIAN , HOFFMANN CHRISTIAN
发明人： BLOCK CHRISTIAN , BRUNNER SEBASTIAN , HOFFMANN CHRISTIAN
IPC分类号： H01L21/603 , H01L21/607 , H01L23/14 , H01L23/15 , H01L23/31 , H01L23/485
CPC分类号： H01L24/85 , H01L23/3121 , H01L23/3171 , H01L23/49822 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05644 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/4945 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85201 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15798 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要： Disclosed is a module for electrical components. In said module, a component chip is glued to the top of a multilayer substrate which comprises integrated wiring and on which bondable terminal faces are provided. The component chip is fitted with bond pads on the upward-facing surface thereof and is connected to the substrate by means of bond wires. The bond wires are guided such that one respective ball thereof is bonded to a terminal face while the wedge thereof is bonded directly to one of the bond pads.
摘要翻译：公开了一种用于电气部件，提供了关于上述元件芯片的可粘合垫综合布线的多层基板上，其中被接合的模块，具有在键合焊盘的其面向上的表面上，并通过接合线到衬底的装置接触。接合线的线引导件是这样的，它们分别结合用球上的连接表面，并与所述焊盘中的一个楔。

4. 发明专利

JP2011066439A Electric multilayer component 审中-公开
标题翻译：电动多层组件
公开(公告)号：JP2011066439A
公开(公告)日：2011-03-31
申请号：JP2010250256
申请日：2010-11-08
申请人： Epcos Ag , エプコスアクチエンゲゼルシャフトEpcos Ag
发明人： FEICHTINGER THOMAS , PUDMICH GUENTER , BRUNNER SEBASTIAN , KLEEWEIN ALOIS , KRUMPHALS ROBERT
IPC分类号： H01G4/30 , H01C1/144 , H01C7/04 , H01C7/10 , H01C7/112 , H01C7/18 , H01G4/12 , H01G4/232
CPC分类号： H01G4/232 , H01C1/144 , H01C7/112 , H01C7/18 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide an electric multilayer component having a higher integration density that has significantly reduced parasitic capacitances and inductances on one hand, and allows especially simple and space-saving mounting on a print board on the other hand.
SOLUTION: The electric multilayer component has a substrate constructed using stacked dielectric material layers, wherein multiple conductive electrode areas are arranged in the substrate at intervals between the dielectric layers, and electrodes are formed in the electrode areas. Furthermore, at least two solder balls (bumps) are arranged on the surface of the substrate for electrical contact of the component, each bump being connected in an electrically conductive way to at least one electrode via a through contact arranged in the substrate, so that first and second electrode stacks are formed, each of the electrode stacks contacting only one solder ball.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一方面具有显着降低的寄生电容和电感的较高集成密度的电气多层组件，另一方面在印刷电路板上安装尤其简单和节省空间。解决方案：电气多层组件具有使用堆叠的电介质层构成的衬底，其中在电介质层之间间隔地在衬底中布置多个导电电极区域，并且在电极区域中形成电极。此外，在基板的表面上设置至少两个焊球（凸块），用于部件的电接触，每个凸块通过布置在基板中的贯通触头以导电方式连接到至少一个电极，使得形成第一和第二电极堆叠，每个电极堆叠仅接触一个焊球。版权所有（C）2011，JPO＆INPIT

5. 发明专利

CZ3970U1 Coupling for sheet glass 未知
公开(公告)号：CZ3970U1
公开(公告)日：1995-12-13
申请号：CZ426095
申请日：1995-08-07
申请人： BRUNNER SEBASTIAN
发明人： BRUNNER SEBASTIAN
IPC分类号： F16B12/14 , F16B5/02 , F16B012/14 , F16B005/02

6. 发明专利

DE102011109007A1 Verfahren zum Herstellen eines elektrischen Bauelements und elektrisches Bauelement 未知
公开(公告)号：DE102011109007A1
公开(公告)日：2013-01-31
申请号：DE102011109007
申请日：2011-07-29
申请人： EPCOS AG
发明人： FEICHTINGER THOMAS , BRUNNER SEBASTIAN
IPC分类号： H01C7/00 , H01C1/14 , H01C7/04 , H01C7/10
摘要： Ein Verfahren zum Herstellen eines elektrischen Bauelements umfasst das Bereitstellen eines keramisch halbleitenden Grundkörpers (10) mit einer Oberfläche (O10) und einer der Oberfläche (O10) gegenüberliegenden ersten Seitenfläche (S10a), wobei innerhalb des Grundkörpers eine metallische Schicht (40) enthalten ist. Nachdem mindestens zwei weitere metallische Schichten (210) getrennt voneinander auf der Seitenfläche (S10a) des Grundkörpers angeordnet werden, erfolgt ein Sintern der Anordnung. Zwischen den mindestens zwei weiteren metallischen Schichten (210) wird eine elektrische isolierende Schicht (30) angeordnet. Mittels eines chemischen Prozesses wird jeweils eine Kontaktschicht (220) auf den metallischen Schichten (210) angeordnet. Dabei wird das Material des Grundkörpers (10) ausgehend von der Oberfläche (O10) des Grundkörpers (10) bis höchstens zu der innerhalb des Grundkörpers angeordneten metallischen Schicht (40) entfernt.

7. 发明专利

DE102004032706A1 未知
公开(公告)号：DE102004032706A1
公开(公告)日：2006-02-02
申请号：DE102004032706
申请日：2004-07-06
申请人： EPCOS AG
发明人： FEICHTINGER THOMAS , SCHLICK HORST , BRUNNER SEBASTIAN , PUDMICH GUENTER , SCHMIDT-WINKEL PATRICK
IPC分类号： H01C1/146 , H01G4/242 , H01L21/312 , H01L21/60 , H01L41/04 , H05K3/40
摘要： A method for producing an electrical component (1) is proposed, in which a ceramic base body (5) that contains a through-hole contact (10) and at least one metallization surface (20C) electroconductively connected to the through-hole contact is provided in a method step A). On the surface of the base body, an electrically insulating first material is arranged in layer form at least above the through-hole contact in method step B), and thereafter an electrically conductive second material is applied above through-hole contact (10) in method step C). Then a solder contact (30B) that electroconductively connects through-hole contact (10) through passivation layer (25B), which is formed from the first material by sintering, is formed by hardening in method step D).

8. 发明专利

DE10313891A1 未知
公开(公告)号：DE10313891A1
公开(公告)日：2004-10-14
申请号：DE10313891
申请日：2003-03-27
申请人： EPCOS AG
发明人： FEICHTINGER THOMAS , KLEEWEIN ALOIS , KRUMPHALS ROBERT , BRUNNER SEBASTIAN , PUDMICH GUENTHER
IPC分类号： H01C1/144 , H01C7/112 , H01C7/18 , H01G4/232 , H01G4/30 , H01C7/105 , H01G2/06 , H01G4/228
摘要： An electrical component having multiple layers includes dielectric layers that are stacked to form a main body, electrodes positioned at intervals between at least some of the dielectric layers, and at least two bumps configured to act as electrical contacts for the electrical component. The bumps are on a surface of the main body. The electrical component also includes contacts in the main body that electrically connect bumps and electrodes. The electrodes define first and second electrode stacks, each of which contacts one of the bumps.

9. 发明专利

DE102016100585A1 Bauelementsubstrat mit Schutzfunktion und Verfahren zur Herstellung 未知
公开(公告)号：DE102016100585A1
公开(公告)日：2017-07-20
申请号：DE102016100585
申请日：2016-01-14
申请人： EPCOS AG
发明人： FAISTAUER CHRISTIAN , AICHHOLZER KLAUS-DIETER , BRUNNER SEBASTIAN , PAYR EDMUND , PUDMICH GÜNTHER
IPC分类号： H01L21/58 , H01L23/13 , H01L23/053 , H01L23/485 , H01L23/60
摘要： Ein mechanisch stabiler Grundkörper weist eine Ausnehmung auf, in die ein ESD Schutzelement zumindest teilweise eingebettet und mittels eines Verbindungsmittels mechanisch fixiert ist. Elektrische Anschlüsse des Schutzelements sind über eine auf Grundkörper und Schutzelement aufliegende strukturierte metallische Schicht mit Anschlussflächen auf der Oberseite des Grundkörpers verbunden.

10. 发明专利

DE102012110397A1 Leuchtdiodenanordnung, Modul und Verfahren zur Herstellung einer Leuchtdiodenanordnung 未知
公开(公告)号：DE102012110397A1
公开(公告)日：2014-04-30
申请号：DE102012110397
申请日：2012-10-30
申请人： EPCOS AG
发明人： FAISTAUER CHRISTIAN , HATZL STEFAN LEOPOLD , BRUNNER SEBASTIAN
IPC分类号： H05B37/00 , H05B44/00 , H05K1/16
摘要： Es wird eine Leuchtdiodenanordnung (1) aufweisend eine Leuchtdiode (2) und einen Kodierwiderstand (RC) zur Kodierung der Leuchtdiode (2) angegeben. Ferner wird ein Modul aufweisend mehrere Leuchtdiodenanordnungen (2) angegeben. Weiterhin wird ein Verfahren zur Herstellung einer Leuchtdiodenanordnung (1) angegeben, wobei die Kodierung eines Kodierwiderstandes (RC) abhängig von einer ermittelten Charakteristik der Leuchtdiode (2) erfolgt.

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