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1. 发明申请

WO2011103538A3 POST-CMP CLEANING BRUSH 审中-公开
标题翻译：后CMP清洁刷
公开(公告)号：WO2011103538A3
公开(公告)日：2011-11-17
申请号：PCT/US2011025623
申请日：2011-02-21
申请人： ENTEGRIS INC , WARGO CHRISTOPHER , SINGH RAKESH , TRIO DAVID , MCNAMARA ERIC
发明人： WARGO CHRISTOPHER , SINGH RAKESH , TRIO DAVID , MCNAMARA ERIC
IPC分类号： H01L21/304 , H01L21/302
CPC分类号： H01L21/67046
摘要： Embodiments of the invention include a CMP brush that has a combination of central nodules at an inner region of the brush and one or more edge nodules at an end region of the brush where the central nodules and edge nodules are in a staggered or matched arrangement with each other and an upper surface of each edge nodule on the brush has the same or a greater contact area than an upper surface of a central nodule. The area of contact of the upper surface of each edge nodule with the substrate edge region is the same or greater than the area of contact of the upper surface of a central nodule with the substrate center region.
摘要翻译：本发明的实施例包括CMP刷，其具有在刷子的内部区域处的中心结节和在刷子的端部区域处的一个或多个边缘结节的组合，其中中心结节和边缘结节与交错或匹配的布置具有交错或匹配的布置，彼此和刷子上的每个边缘结节的上表面具有与中心结节的上表面相同或更大的接触面积。每个边缘结节的上表面与基底边缘区域的接触面积与中心结节的上表面与基底中心区域的接触面积相同或更大。

2. 发明申请

WO2012122186A4 CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER 审中-公开
标题翻译：化学机械平面板调节器
公开(公告)号：WO2012122186A4
公开(公告)日：2013-01-10
申请号：PCT/US2012027916
申请日：2012-03-06
申请人： ENTEGRIS INC , SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
发明人： SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
IPC分类号： H01L21/304
CPC分类号： B24B53/017
摘要： A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface, the first set of protrusions and the second set of protrusions have a layer of poly crystalline diamond on at least their top surfaces. The protrusion sets can be identified, for example, by their heights, or alternatively by their predetermined locations or their base dimensions. Various ways to measure the height of the protrusions are presented, including an average height as measured from the back face of the pad conditioner, a peak-to-valley height, or a prominence height.
摘要翻译：公开了一种用于CMP抛光垫的垫调节器，其包括具有第一组突起和第二组突起的基底，第一组突起具有第一平均高度，第二组突起具有第二平均高度，与第二平均高度不同的第一平均高度，第一组突起中的每个突起的顶部具有非平坦表面，并且第二组突起中的每个突起的顶部具有非平坦表面，第一组并且第二组突起在至少其顶表面上具有多晶金刚石层。突起组可以例如通过它们的高度来标识，或者通过它们的预定位置或它们的基本尺寸来识别。提供了各种测量突起高度的方法，包括从垫调节器的背面测量的平均高度，峰谷高度或突出高度。

3. 发明申请

WO2007067348A3 A MOLDED ROTATABLE BASE FOR A POROUS PAD 审中-公开
标题翻译：用于多孔垫的模制可旋转基座
公开(公告)号：WO2007067348A3
公开(公告)日：2007-08-09
申请号：PCT/US2006045090
申请日：2006-11-21
申请人： ENTEGRIS INC , WARGO CHRISTOPHER , LEBLANC THOMAS
发明人： WARGO CHRISTOPHER , LEBLANC THOMAS
IPC分类号： B08B11/00 , B08B1/00 , B29C49/00
CPC分类号： A46B13/001 , B08B1/002 , B29C33/0033 , B29C33/005 , B29C33/44 , B29C44/42 , B29C44/583 , B29C45/17 , B29L2023/00 , C08J9/06 , H01L21/67046
摘要： A rotatable base (100) for a porous pad (500) has openings (126, 130, 134) that provide for improved flow distribution of a liquid in the base (100) across a substrate. The rotatable base (100) can be molded from a two piece mold and the openings (126, 130, 134) can have draft angles to facilitate the molding process.
摘要翻译：用于多孔垫（500）的可旋转底座（100）具有开口（126,130,134），其提供改善基底（100）中的液体在衬底上的流动分布。可旋转基座（100）可以由两件式模具模制，并且开口（126,130,134）可以具有拔模以便于模制过程。

4. 发明申请

WO2012122186A2 CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER 审中-公开
标题翻译：化学机械平面板调节器
公开(公告)号：WO2012122186A2
公开(公告)日：2012-09-13
申请号：PCT/US2012027916
申请日：2012-03-06
申请人： ENTEGRIS INC , SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
发明人： SMITH JOSEPH , GALPIN ANDREW , WARGO CHRISTOPHER
IPC分类号： H01L21/304
CPC分类号： B24B53/017
摘要： A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface, the first set of protrusions and the second set of protrusions have a layer of poly crystalline diamond on at least their top surfaces. The protrusion sets can be identified, for example, by their heights, or alternatively by their predetermined locations or their base dimensions. Various ways to measure the height of the protrusions are presented, including an average height as measured from the back face of the pad conditioner, a peak-to-valley height, or a prominence height.
摘要翻译：公开了一种用于CMP抛光垫的垫调节器，其包括具有第一组突起和第二组突起的基底，第一组突起具有第一平均高度，第二组突起具有第二平均高度，与第二平均高度不同的第一平均高度，第一组突起中的每个突起的顶部具有非平坦表面，并且第二组突起中的每个突起的顶部具有非平坦表面，第一组并且第二组突起在至少其顶表面上具有多晶金刚石层。突出组可以例如通过它们的高度来标识，或者通过它们的预定位置或它们的基本尺寸来识别。提供了各种测量突起高度的方法，包括从垫调节器的背面测量的平均高度，峰谷高度或突出高度。

5. 发明申请

WO2010009041A3 METALLIC NANOPARTICLE SHIELDING STRUCTURE AND METHODS THEREOF 审中-公开
标题翻译：金属纳米晶体屏蔽结构及其方法
公开(公告)号：WO2010009041A3
公开(公告)日：2010-05-14
申请号：PCT/US2009050389
申请日：2009-07-13
申请人： PCHEM ASSOCIATES INC , JABLONSKI GREGORY , MASTROPIETRO MICHAEL , WARGO CHRISTOPHER
发明人： JABLONSKI GREGORY , MASTROPIETRO MICHAEL , WARGO CHRISTOPHER
IPC分类号： H05K9/00 , B05D5/12 , C09D5/24 , C09D129/04
CPC分类号： H05K9/0086 , B22F7/04 , B22F2998/00 , Y10T428/12063 , Y10T428/24909 , B22F1/0018
摘要： A metallic nanoparticle shielding structure derived from a substrate having metallic nanoparticles deposited thereon in either a pattern or a coating. The pattern can comprise one or more marks that have a width of 20 to 40 micrometers and that can overlap one another. The metallic nanoparticles can be heated at a temperature less than 110 degrees Celsius for a period of time less than 90 seconds. In some embodiments, the metallic nanoparticle shielding structure can be applied to liquid crystal displays, polyester substrates, polycarbonate substrates, or any other suitable substrate.
摘要翻译：金属纳米颗粒屏蔽结构衍生自具有沉积在图案或涂层上的金属纳米颗粒的基底。图案可以包括一个或多个具有20至40微米的宽度并且可以彼此重叠的标记。金属纳米颗粒可以在低于110摄氏度的温度下加热一段时间小于90秒。在一些实施例中，金属纳米颗粒屏蔽结构可以应用于液晶显示器，聚酯基板，聚碳酸酯基板或任何其它合适的基板。

6. 发明申请

WO2005118106A2 FLUID TREATING APPARATUS 审中-公开
标题翻译：流体处理设备
公开(公告)号：WO2005118106A2
公开(公告)日：2005-12-15
申请号：PCT/US2005019679
申请日：2005-06-03
申请人： MYKROLIS CORP , WARGO CHRISTOPHER , SUZUKI YASUJI , FROMETA ARIEL , ZAHAKA JOSEPH
发明人： WARGO CHRISTOPHER , SUZUKI YASUJI , FROMETA ARIEL , ZAHAKA JOSEPH
IPC分类号： B01D19/00 , B01D36/00 , B01D61/00 , B01D61/10 , B01D61/20 , B01D61/30 , B01D65/00 , B01D69/02
CPC分类号： B01D61/00 , B01D19/0031 , B01D69/02 , B01D2325/12 , B01D2325/38
摘要： Embodiments of the present invention are directed to an apparatus that can be used to treat fluids. The apparatus can include a housing with an inlet for receiving a process fluid to be treated, a surface within the housing for treating the process fluid that can be wet by the process fluid, and an outlet for removing treated process fluid. The housing includes a vent that aids in the removal of fluid components that separate from the process fluid. Removal of these separated fluids improves the efficiency and contact of the process fluid with the surfaces in the housing for treating the process fluid.
摘要翻译：本发明的实施例涉及可用于处理流体的装置。该装置可以包括具有用于接收待处理的处理流体的入口的壳体，用于处理可被过程流体润湿的过程流体的壳体内的表面，以及用于去除处理过的流体的出口。壳体包括有助于去除与工艺流体分离的流体组分的排气口。去除这些分离的流体提高了处理流体与壳体中用于处理工艺流体的表面的效率和接触。

7. 发明申请

WO2004010086A3 FLUID FLOW MEASURING AND PROPORTIONAL FLUID FLOW CONTROL DEVICE 审中-公开
标题翻译：流体流量测量和比例流体流量控制装置
公开(公告)号：WO2004010086A3
公开(公告)日：2004-10-07
申请号：PCT/US0322533
申请日：2003-07-18
申请人： MYKROLIS CORP , WARGO CHRISTOPHER , NIERMEYER KARL J , SHYU JIEH-HWA , BRODEUR CRAIG L , BASSER WILLIAM
发明人： WARGO CHRISTOPHER , NIERMEYER KARL J , SHYU JIEH-HWA , BRODEUR CRAIG L , BASSER WILLIAM
IPC分类号： G01P5/14 , G01F1/44 , G05D7/06 , G06F19/00 , G01F1/12 , G01F1/50 , G01F17/00
CPC分类号： G01F1/44 , G01F1/363 , G01F1/50 , G01F25/0007 , G05D7/0635 , G06N7/02
摘要： A fluid flow measuring and control device for measuring a flow rate based on a pressure drop created by a restrictive flow element (15). The device includes a proportional flow valve (10) having a fluid inlet and a fluid outlet and an actuator (17) for modulating the proportional flow valve (10). The restrictive flow element (15) includes a fluid inlet and a fluid outlet in communication with the proportional flow valve (10) and creates a pressure drop between the restrictive flow element fluid inlet and outlet. The device also includes means (24, 25) for measuring the pressure drop, means (16) for calculating the flow rate based on the pressure drop, and control means (not shown) that communicates with the pressure drop measuring means (24, 25) and the actuator (17) for controlling the flow of fluid through a proportional flow valve (10) in response to the measured pressure drop.
摘要翻译：一种流体流量测量和控制装置，用于基于由限制流量元件（15）产生的压降来测量流量。该装置包括具有流体入口和流体出口的比例流量阀（10）和用于调节比例流量阀（10）的致动器（17）。限制流动元件（15）包括与比例流量阀（10）连通的流体入口和流体出口，并且在限流元件流体入口和出口之间产生压降。装置还包括用于测量压降的装置（24,25），用于计算基于压降的流量的装置（16）和与压降测量装置（24,25）连通的控制装置（未示出））和致动器（17），用于响应于测量的压降而控制通过比例流量阀（10）的流体流动。

8. 发明专利

JP2010072008A Fluid flow measuring and proportional fluid flow control device 审中-公开
标题翻译：流体流量测量和比例流体流量控制装置
公开(公告)号：JP2010072008A
公开(公告)日：2010-04-02
申请号：JP2010002382
申请日：2010-01-07
申请人： Entegris Inc , エンテグリース,インコーポレイテッド
发明人： WARGO CHRISTOPHER , NIERMEYER J KARL , SHYU JIEH-HWA , BRODEUR CRAIG L , BASSER WILLIAM
IPC分类号： G01F1/50 , G01P5/14 , G01F1/44 , G05D7/06
CPC分类号： G01F1/44 , G01F1/363 , G01F1/50 , G01F25/0007 , G05D7/0635 , G06N7/02
摘要： PROBLEM TO BE SOLVED: To provide a fluid flow measuring and control device for measuring a flow rate based on a pressure drop created by a restrictive flow constitutive elements (15). SOLUTION: The device includes a proportional flow valve (10) having a fluid inlet and a fluid outlet and an actuator (17) for modulating the proportional flow valve (10). The restrictive flow element (15) includes a fluid inlet and a fluid outlet in communication with the proportional flow valve (10) and creates a pressure drop between the fluid inlet and outlet of the restrictive flow constitutive elements. The device also includes means (24, 25) for measuring the pressure drop, means (16) for calculating the flow rate based on the pressure drop, and control means (not shown) that makes communicates with the pressure drop measuring means (24, 25) and the actuator (17) for controlling the flow of fluid through a proportional flow valve (10) in response to the measured pressure drop. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于基于由限制流构成元件（15）产生的压降来测量流量的流体流量测量和控制装置。解决方案：该装置包括具有流体入口和流体出口的比例流量阀（10）和用于调节比例流量阀（10）的致动器（17）。限制流动元件（15）包括与比例流量阀（10）连通的流体入口和流体出口，并且在限制流构成元件的流体入口和出口之间产生压降。该装置还包括用于测量压降的装置（24,25），用于计算基于压降的流量的装置（16）以及与压降测量装置（24,24）进行通信的控制装置（未示出） 25）和致动器（17），用于响应于测量的压降来控制通过比例流量阀（10）的流体流动。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2011138496A Fluid flow measuring and proportional fluid flow control device 有权
标题翻译：流体流量测量和比例流体流量控制装置
公开(公告)号：JP2011138496A
公开(公告)日：2011-07-14
申请号：JP2010270957
申请日：2010-12-03
申请人： Entegris Inc , エンテグリース,インコーポレイテッド
发明人： WARGO CHRISTOPHER , NIERMEYER J KARL , SHYU JIEH-HWA , BRODEUR CRAIG L , BASSER WILLIAM
IPC分类号： G01P5/14 , G05D7/06 , G01F1/00 , G01F1/44 , G05B13/02
CPC分类号： G01F1/44 , G01F1/363 , G01F1/50 , G01F25/0007 , G05D7/0635 , G06N7/02
摘要： PROBLEM TO BE SOLVED: To provide a fluid flow measuring and control device for measuring a flow speed based on a pressure reduction generated by a restrictive flow element.
SOLUTION: The device includes a proportional flow valve 10 having a fluid inlet and a fluid outlet, and an actuator 17 for modulating the proportional flow valve 10. The restrictive flow element 15 includes a fluid inlet and a fluid outlet in communication with the proportional flow valve 10, and generates a pressure reduction between the fluid inlet and the fluid outlet of the restrictive flow element 15. The device further includes means 24, 25 for measuring the pressure reduction; a means 16 for calculating the flow rate based on the pressure reduction; pressure reduction measurement means 24, 25 for controlling the fluid flow through the proportional flow valve 10 in response to the measured pressure reduction; and a control means (not shown) in communication with the actuator 17.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于基于由限流元件产生的压力降低来测量流速的流体流量测量和控制装置。解决方案：该装置包括具有流体入口和流体出口的比例流量阀10和用于调节比例流量阀10的致动器17.限制流动元件15包括流体入口和与比例流量阀10，并且在限流元件15的流体入口和流体出口之间产生压力降低。该装置还包括用于测量减压的装置24,25; 用于基于减压计算流量的装置16; 减压测量装置24,25，用于响应于测量的压力降低来控制通过比例流量阀10的流体流量; 以及与致动器17连通的控制装置（未示出）。版权所有（C）2011，JPO＆INPIT

10. 发明专利

SG144762A1 FLUID FLOW MEASURING AND PROPORTIONAL FLUID FLOW CONTROL DEVICE 未知
公开(公告)号：SG144762A1
公开(公告)日：2008-08-28
申请号：SG2007003882
申请日：2003-07-18
申请人： ENTEGRIS INC
发明人： WARGO CHRISTOPHER , NIERMEYER KARL J , SHYU JIEH-HWA , BRODEUR CRAIG L , BASSER WILLIAM
IPC分类号： G01F1/44 , G01P5/14 , G05D7/06 , G06F19/00
摘要： FLUID FLOW MEASURING AND PROPORTIONAL FLUID FLOW CONTROL DEVICE A fluid flow measuring and control device for measuring a flow rate based on a pressure drop created by a restrictive flow element (15). The device includes a proportional flow valve (10) having a fluid inlet and a fluid outlet and an actuator (17) for modulating the proportional flow valve (10). The restrictive flow element (15) includes a fluid inlet and a fluid outlet in communication with the proportional flow valve (10) and creates a pressure drop between the restrictive flow element fluid inlet and outlet. The device also includes means (24, 25) for measuring the pressure drop, means (16) for calculating the flow rate based on the pressure drop, and control means (not shown) that communicates with the pressure drop measuring means (24, 25) and the actuator (17) for controlling the flow of fluid through a proportional flow valve (10) in response to the measured pressure drop.

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