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1. 发明申请

WO2012135039A3 LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES 审中-公开
标题翻译：激光直接与高脉冲重复频率下的PICOSECOND激光脉冲相关
公开(公告)号：WO2012135039A3
公开(公告)日：2013-01-03
申请号：PCT/US2012030375
申请日：2012-03-23
申请人： ELECTRO SCIENT IND INC , ALPAY MEHMET E , MATSUMOTO HISASHI , UNRATH MARK A , LI GUANGYU
发明人： ALPAY MEHMET E , MATSUMOTO HISASHI , UNRATH MARK A , LI GUANGYU
IPC分类号： H01L21/301 , H01L21/28
CPC分类号： B23K26/0648 , B23K26/0622 , B23K26/0652 , B23K26/082 , B23K26/0861 , B23K26/364 , B23K2201/42 , B23K2203/42 , B23K2203/50
摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
摘要翻译：激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率激光脉冲。脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。

2. 发明申请

WO2010036503A3 METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY 审中-公开
标题翻译：激光微加工高质量不锈钢的方法
公开(公告)号：WO2010036503A3
公开(公告)日：2010-06-10
申请号：PCT/US2009056016
申请日：2009-09-04
申请人： ELECTRO SCIENT IND INC , LEI WEISHENG , ALPAY MEHMET E , MATSUMOTO HISASHI , HOWERTON JEFFREY , LI GUANGYU , PIROGOVSKY PETER , LU WILSON , SIMENSON GLENN
发明人： LEI WEISHENG , ALPAY MEHMET E , MATSUMOTO HISASHI , HOWERTON JEFFREY , LI GUANGYU , PIROGOVSKY PETER , LU WILSON , SIMENSON GLENN
IPC分类号： B23K26/42 , B23K26/00 , B23K101/34 , B23K103/02
CPC分类号： B23K26/18 , B23K26/009 , B23K26/0622 , B23K26/36 , B23K26/382 , B23K26/40 , B23K2201/34 , B23K2203/05 , B23K2203/10
摘要： A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape.
摘要翻译：激光微加工具有高化妆品质量表面的金属部件的方法包括在用激光对部件进行微加工之前，在部件的至少一个表面上施加保护涂层。施加到高质量装饰表面上的保护涂层可以具有约5密耳至约10密耳（包括端值）的厚度，并且具有足够的粘附强度以在处理期间粘附至部件而不分层。施加到部件加工表面的保护涂层可以是金属材料，例如金属箔或带。

3. 发明申请

WO2012082930A3 REDUCING BACK-REFLECTION IN LASER MICROMACHINING SYSTEMS 审中-公开
标题翻译：减少激光微加工系统中的后向反射
公开(公告)号：WO2012082930A3
公开(公告)日：2012-10-11
申请号：PCT/US2011064959
申请日：2011-12-14
申请人： ELECTRO SCIENT IND INC , LI GUANGYU , ALPAY MEHMET E
发明人： LI GUANGYU , ALPAY MEHMET E
IPC分类号： B23K26/00 , B23K26/42 , H01S3/02
CPC分类号： B23K26/066 , H01S3/0064
摘要： Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.
摘要翻译：系统和方法减少或防止激光加工系统中的回射。一种系统包括产生入射激光束的激光源，将入射激光束沿光束路径引向工作表面的激光束输出，以及空间滤波器。该系统还包括用于扩大通过空间滤波器接收的入射激光束的直径的扩束器和用于将扩展的入射激光束聚焦在工作表面上的目标位置的扫描透镜。来自工作表面的反射激光束通过扫描透镜返回到扩束器，这减小了反射光束的直径并增加了反射激光束的发散角。空间滤波器阻止发散反射激光束的一部分穿过孔径并返回到激光束输出。

4. 发明申请

WO2010111609A3 METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING 审中-公开
标题翻译：改进的脆性材料加工方法
公开(公告)号：WO2010111609A3
公开(公告)日：2011-02-03
申请号：PCT/US2010028856
申请日：2010-03-26
申请人： ELECTRO SCIENT IND INC , LEI WEISHENG , SIMENSON GLENN , MATSUMOTO HISASHI , LI GUANGYU , HOWERTON JEFFREY
发明人： LEI WEISHENG , SIMENSON GLENN , MATSUMOTO HISASHI , LI GUANGYU , HOWERTON JEFFREY
IPC分类号： B23K26/38 , B23K26/00 , B23K26/40 , H01S3/10
CPC分类号： B23K26/40 , B23K2203/50
摘要： An improved method for laser machining features in brittle materials such as glass 8 is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.
摘要翻译：提出了一种用于诸如玻璃8的脆性材料中的激光加工特征的改进方法，其中分析与特征有关的刀具路径10，以确定使用非相邻激光脉冲12激光加工特征所需的通过次数。激光脉冲在后续通过期间施加的12被定位成与先前的激光光斑位置重叠预定的重叠量。以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲12引起的过多的激光辐射。

5. 发明申请

WO2010077845A3 METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE 审中-公开
标题翻译：用于激光加工玻璃与渐变边缘的方法
公开(公告)号：WO2010077845A3
公开(公告)日：2010-09-30
申请号：PCT/US2009067988
申请日：2009-12-15
申请人： ELECTRO SCIENT IND INC , LEI WEISHENG , SIMENSON GLENN , MATSUMOTO HISASHI , LI GUANGYU , HOWERTON JEFFREY
发明人： LEI WEISHENG , SIMENSON GLENN , MATSUMOTO HISASHI , LI GUANGYU , HOWERTON JEFFREY
IPC分类号： B23K26/38 , B23K26/04 , C03B33/09
CPC分类号： B23K26/40 , B23K2203/50 , B28D1/22 , C03B33/0222 , C03B33/04 , C03B33/082
摘要： A laser machining process is described for laser 72 machining glass or glass-like materials 62. This process machines articles 60 with chamfered edges 96 in one manufacturing operation. Chamfered edges 96 are desirable in glass and glass-like materials 62 because they resist fracturing or chipping and eliminate sharp edges. Producing chamfered 96 articles 60 in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering 96 after laser 72 machining. Alternatively, it can permit use of less expensive equipment because the same laser 72 used for machining can be used to form the chamfer 96 instead of having a separate process perform the chamfering 96.
摘要翻译：对激光加工玻璃或玻璃状材料62的激光加工方法进行了描述。该方法在一个制造操作中对具有倒角边缘96的物件60进行加工。倒角边缘96在玻璃和玻璃状材料62中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。在一个制造操作中生产倒角96件60是理想的，因为通过在激光72加工之后不需要将物品转移到单独的机器进行倒角96来节省时间和费用。或者，它可以允许使用较便宜的设备，因为用于机加工的相同激光器72可用于形成倒角96，而不是具有单独的工艺来执行倒角96。

6. 发明专利

SG172237A1 METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE 未知
公开(公告)号：SG172237A1
公开(公告)日：2011-07-28
申请号：SG2011044591
申请日：2009-12-15
申请人： ELECTRO SCIENT IND INC
发明人： LEI WEISHENG , SIMENSON GLENN , MATSUMOTO HISASHI , LI GUANGYU , HOWERTON JEFFREY
摘要： A laser machining process is described for laser 72 machining glass or glass-like materials 62. This process machines articles 60 with chamfered edges 96 in one manufacturing operation. Chamfered edges 96 are desirable in glass and glass-like materials 62 because they resist fracturing or chipping and eliminate sharp edges. Producing chamfered 96 articles 60 in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering 96 after laser 72 machining. Alternatively, it can permit use of less expensive equipment because the same laser 72 used for machining can be used to form the chamfer 96 instead of having a separate process perform the chamfering 96.

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