专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2006112670A1 CUTTING SEGMENT FOR DIAMOND TOOL AND DIAMOND TOOL HAVING THE SEGMENT 审中-公开
标题翻译：切割分段金刚石工具和金刚石工具
公开(公告)号：WO2006112670A1
公开(公告)日：2006-10-26
申请号：PCT/KR2006/001468
申请日：2006-04-20
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , PARK, Hee-Dong , KIM, Jong-Ho , CHANG, Joon-Ho
发明人： KIM, Soo-Kwang , PARK, Hee-Dong , KIM, Jong-Ho , CHANG, Joon-Ho
IPC分类号： B23D61/02
CPC分类号： C22C26/00 , B22F2005/001 , B23D61/18 , B24D5/123 , B24D18/00 , B24D99/005 , B28D1/121
摘要： The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
摘要翻译：本发明涉及用于切割或钻孔诸如石头，砖，混凝土和沥青的脆性工件的金刚石工具的切割部分和具有该切割部分的金刚石工具。本发明允许优异的切割速率和长的使用寿命，而不会在切割过程中磨损R。在切割段中，将多个金刚石颗粒布置在垂直于切割方向堆叠的多个板状层中。每个金刚石颗粒层在切割表面上具有多个颗粒行。此外，至少两个金刚石颗粒层在切割方向上从切割区段的前方看到的切割区段的至少一侧重叠。本发明通过显着减少切割时产生的R磨损，确保均匀切割，从而实现优异的切割速度和更长的使用寿命。

2. 发明申请

WO2006071073A1 CUTTING SEGMENT OF CUTTING TOOL AND CUTTING TOOL 审中-公开
标题翻译：切割工具切割工具切割工具
公开(公告)号：WO2006071073A1
公开(公告)日：2006-07-06
申请号：PCT/KR2005/004603
申请日：2005-12-28
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , CHANG, Joon-Ho , PARK, Hee-Dong , KIM, Jong-Ho
发明人： KIM, Soo-Kwang , CHANG, Joon-Ho , PARK, Hee-Dong , KIM, Jong-Ho
IPC分类号： B23D61/02
CPC分类号： B24D5/14 , B23D61/18 , B24D5/123 , Y10T83/9481 , Y10T407/235
摘要： The invention provides a cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The invention provides the cutting segment and the cutting tool capable of improving cutting rate and useful life.
摘要翻译：本发明提供了一种用于切割或钻孔诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分和切割工具。切割部分包括用于切割工件的切割表面和以多行排列的多个磨料颗粒。每个磨料列包括高浓度部件和低浓度部件。将高浓度部件分组在一起，在切割面上形成高浓度区域，将低浓度部分分组在一起，在切割面上形成低浓度区域。本发明提供了能够提高切割速度和使用寿命的切割部分和切割工具。

3. 发明申请

WO2005014243A3 DIAMOND TOOL 审中-公开
公开(公告)号：WO2005014243A3
公开(公告)日：2005-02-17
申请号：PCT/KR2004/002004
申请日：2004-08-10
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , KIM, Jong-Ho , PARK, Hee-Dong
发明人： KIM, Soo-Kwang , KIM, Jong-Ho , PARK, Hee-Dong
IPC分类号： B23D61/02
摘要： A segment type diamond tool has diamond particles appropriately distributed on segments of the diamond tool, thereby providing an excellent cutting rate and reducing fine debris generated during a cutting operation. The diamond tool comprises a plurality of segments, each of the segments having a single plate-shaped layer or a plurality of plate-shaped layers of diamond particles arranged thereon, and the layers of diamond particles being arranged on the segment such that cutting grooves formed on a workpiece by a trailing layer of diamond particles are arranged between cutting grooves formed thereon by a leading layer of diamond particles, respectively, during a cutting operation on the workpiece, wherein the diamond particles are arranged at a predetermined tilt angle to a line connecting upper vertices or a line connecting lower vertices of a cross section, cut parallel in a cutting direction and perpendicular to a cutting surface, so that the diamond particles are protruded and uniformly spaced from each other on the cutting surface of the segment during the cutting operation on the workpiece.

4. 发明申请

WO2006112654A1 CUTTING SEGMENT FOR CUTTING TOOL AND CUTTING TOOLS 审中-公开
标题翻译：切割工具切割工具切割工具
公开(公告)号：WO2006112654A1
公开(公告)日：2006-10-26
申请号：PCT/KR2006/001442
申请日：2006-04-19
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , PARK, Hee-Dong , CHANG, Joon-Ho , KIM, Jong-Ho
发明人： KIM, Soo-Kwang , PARK, Hee-Dong , CHANG, Joon-Ho , KIM, Jong-Ho
IPC分类号： B23D61/02
CPC分类号： B23D61/18 , B24D5/123 , B24D99/005 , B28D1/121
摘要： The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
摘要翻译：本发明提供了一种用于切割或钻削诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分和具有切割部分的切割工具。切割段包括用于切割工件和多个磨料颗粒层的切割表面。研磨颗粒层垂直于切割方向设置。每个研磨层在切割段的宽度方向上具有多个研磨颗粒行。每个磨料列具有排列成一行的多个磨料颗粒。此外，磨料层之间具有多个坯料部分。在坯料部分中，磨料颗粒不存在或者相对于磨料行的浓度为70％以下。另外，空白部分包括相对较厚的空白部分和相对较薄的空白部分。

5. 发明申请

WO2007100214A1 CUTTING TIP OF FRAME SAW AND FRAME SAW WITH THE CUTTING TIP 审中-公开
标题翻译：切割尖端的框架和框架的切割尖端
公开(公告)号：WO2007100214A1
公开(公告)日：2007-09-07
申请号：PCT/KR2007/001031
申请日：2007-02-28
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , PARK, Hee-Dong , KIM, Nam-Kwang
发明人： KIM, Soo-Kwang , PARK, Hee-Dong , KIM, Nam-Kwang
IPC分类号： B28D1/06
CPC分类号： B28D1/127 , B24D99/005
摘要： A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.
摘要翻译：公开了一种用于切割或钻出诸如石头，砖，混凝土或沥青的脆性工件的切削工具的切削刀片和设置有切削刀片的框架锯。包括磨料颗粒的摆动式切割尖端具有能够提高磨料颗粒的切割效率的特定布置，从而实现切割性能的提高和寿命的增加。切割尖端包括多个磨料颗粒，以在摆动时切割工件。研磨颗粒的至少一部分以磨料颗粒组的形式排列。每个磨料颗粒组由至少两个磨料颗粒构成。研磨颗粒组的磨料颗粒的至少一部分在切割方向上重叠。

6. 发明申请

WO2006110010A1 CUTTING SEGMENT, METHOD FOR MANUFACTURING CUTTING SEGMENT, AND CUTTING TOOL COMPRISING THE SAME 审中-公开
标题翻译：切割部分，切割部分的制造方法以及包含切割部分的切割工具
公开(公告)号：WO2006110010A1
公开(公告)日：2006-10-19
申请号：PCT/KR2006/001382
申请日：2006-04-14
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , PARK, Hee-Dong
发明人： KIM, Soo-Kwang , PARK, Hee-Dong
IPC分类号： B23D61/02
CPC分类号： B24D5/123 , B23D61/18 , B23P15/28 , B24D99/005 , B28D1/121
摘要： A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
摘要翻译：公开了一种用于切割或钻削诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分，该部分的制造方法以及包括该部分的切割工具。该段包括金刚石颗粒层和包含具有不同延展性的软和硬金属基质层的两种板状金属基质层。板状金属基体层与切割面垂直配置，同时平行于切割方向，并且交替地垂直于切割方向堆叠。金刚石颗粒层适当地布置在板状软和硬金属基质层中。包括该切片的切割工具具有优良的切割能力，并且可以简化其制造工艺，从而显着提高生产率。

7. 发明申请

WO2006088302A1 DIAMOND TOOL 审中-公开
标题翻译：钻石工具
公开(公告)号：WO2006088302A1
公开(公告)日：2006-08-24
申请号：PCT/KR2006/000507
申请日：2006-02-13
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC. , KIM, Soo-Kwang , KIM, Jong-Ho , PARK, Hee-Dong
发明人： KIM, Soo-Kwang , KIM, Jong-Ho , PARK, Hee-Dong
IPC分类号： B23D61/02
CPC分类号： B24D18/00 , B23D61/18 , B24D5/123 , B28D1/121
摘要： The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high- concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
摘要翻译：本发明提供一种段式金刚石工具，其能够通过在金刚石工具的切割部分中适当地布置金刚石颗粒来提高切割速率并减少在切割期间产生的细碎屑的量。在本发明中，金刚石颗粒层被布置成使得在切割工件时分别通过金刚石颗粒的引导层分别在其上形成有金刚石颗粒的后续层的工件上形成的切割槽布置在其上形成的切割槽之间。切割段具有高浓度和低浓度区域。高浓度区域的浓度高于平均浓度，低浓度区域的浓度低于平均浓度。此外，在切割段的前部和/或后部形成至少一个低浓度区域。本发明的金刚石工具确保切割时产生的切割速度和精细碎屑的数量减少。

8. 发明申请

WO2005102576A1 CUTTING SEGMENT, METHOD OF MANUFACTURING CUTTING SEGMENT, AND CUTTING TOOL 审中-公开
标题翻译：切割部分，切割部分的制造方法和切割工具
公开(公告)号：WO2005102576A1
公开(公告)日：2005-11-03
申请号：PCT/KR2005/000370
申请日：2005-02-07
申请人： EHWA DIAMOND INDUSTRIAL CO., LTD. , GENERAL TOOL, INC , KIM, Soo-Kwang , PARK, Hee-Dong
发明人： KIM, Soo-Kwang , PARK, Hee-Dong
IPC分类号： B23D61/02
CPC分类号： B23D61/18 , B24D99/005 , B28D1/121
摘要： A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.
摘要翻译：公开了一种用于切割或钻孔诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分，制造所述部分的方法和设置有所述片段的切割工具。所述片段包括垂直于所述片段的切割表面层叠的多个平板状金属基质层，同时平行于所述片段的切割方向，所述板状金属基质层彼此一体地组合并由亚铁制成或有色金属材料; 以及布置在板状金属基质层之间的金刚石颗粒层，使得可以在切割表面上以阵列形式提供金刚石颗粒。该片段具有优异的切割能力，并且可以通过简化的制造工艺制造，从而显着降低制造成本。

9. 发明申请

WO2003066275A1 CUTTING TIP FOR DIAMOND TOOL AND DIAMOND TOOL 审中-公开
标题翻译：钻石工具和钻石工具切割技巧
公开(公告)号：WO2003066275A1
公开(公告)日：2003-08-14
申请号：PCT/KR2003/000268
申请日：2003-02-07
申请人： EHWA DIAMOND INDUSTRIAL CO. LTD. , GENERAL TOOL INC. , KIM, Soo-Kwang , KIM, Jong-Ho , PARK, Hee-Dong
发明人： KIM, Soo-Kwang , KIM, Jong-Ho , PARK, Hee-Dong
IPC分类号： B23P5/00
CPC分类号： B28D1/041 , B23D61/18 , B24D5/123 , B28D1/121
摘要： The present invention relates to a cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. The present invention provides a cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
摘要翻译：本发明涉及一种用于金刚石工具的切割尖端和具有该切割尖端的金刚石工具，其用于切割或穿孔各种脆性材料，例如石头，砖，混凝土和沥青。特别地，用于金刚石工具和金刚石工具的切割尖端具有适当排列以提高切割速率的金刚石颗粒。本发明提供了一种用于金刚石工具的切割尖端，其具有分布在切割尖端中的金刚石颗粒，其中金刚石颗粒在平行于切割表面的平面中相对于切割方向倾斜，并且排列成形成沟槽通道在切割操作中依次重叠在脆性物质上。

10. 发明授权

EP2377661B1 METHOD OF CUTTING A STONE USING A RECIPROCATING FRAME GANG SAW 有权
公开(公告)号：EP2377661B1
公开(公告)日：2018-10-10
申请号：EP09835279.2
申请日：2009-12-23
申请人： EHWA Diamond Industrial Co., Ltd.
发明人： PARK, Hee-Dong , KIM, Nam-Kwang
IPC分类号： B28D1/06
CPC分类号： B28D1/06 , Y10T428/2457
摘要： There is provided a method or cutting or drilling a brittle workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式