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1. 发明申请

WO2003057948A1 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2003057948A1
公开(公告)日：2003-07-17
申请号：PCT/JP2003/000038
申请日：2003-01-07
申请人： EBARA CORPORATION , MORI, Yuzo , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , TOMA, Yasushi
发明人： MORI, Yuzo , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , TOMA, Yasushi
IPC分类号： C25F3/00
CPC分类号： B23H3/08 , B23H3/00 , B23H5/08 , C25F3/00 , C25F7/00
摘要： There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolytic processing apparatus includes: a holder (30) for holding a substrate (W); a processing electrode (32) that can come close to the substrate; a feeding electrode (34) for feeding electricity to the substrate; an ion exchanger (40) disposed in the space between the substrate and the processing electrode, or the substrate and the feeding electrode; a fluid supply section (70) for supplying a fluid into the space; a power source (68) for applying a voltage between the processing electrode and the feeding electrode; a drive sections (44, 56 and 60) for allowing the substrate and the processing electrode, facing each other, to make a relative movement; and a numerical controller (72) for effecting a numerical control of the drive sections.
摘要翻译：提供了可以以高加工精度对基板进行加工的电解处理装置和方法，并且可以以高精度的形式产生预期形式的处理基板。电解处理装置包括：用于保持基板（W）的保持器（30）。可以靠近所述基板的处理电极（32）; 用于向基板供电的供电电极（34）; 设置在基板和处理电极之间的空间中的离子交换器（40），或基板和馈电电极; 用于将流体供应到所述空间中的流体供应部分（70）用于在所述处理电极和所述馈电电极之间施加电压的电源（68）; 用于允许基板和处理电极彼此面对的驱动部分（44,56和60）进行相对运动; 以及用于对驱动部进行数值控制的数值控制器（72）。

2. 发明申请

WO2003030223A3 SUBSTRATE PROCESSING APPARATUS AND METHOD 审中-公开
公开(公告)号：WO2003030223A3
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009255
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
IPC分类号： C25D17/10
摘要： There is a provided a substrate processing apparatus that can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

3. 发明申请

WO2003046263A1 METHOD AND DEVICE FOR REGENERATING ION EXCHANGER, AND ELECTROLYTIC PROCESSING APPARATUS 审中-公开
标题翻译：用于再生离子交换器的方法和装置，以及电解处理装置
公开(公告)号：WO2003046263A1
公开(公告)日：2003-06-05
申请号：PCT/JP2002/012519
申请日：2002-11-29
申请人： EBARA CORPORATION , SAITO, Takayuki , SUZUKI, Tsukuru , MAKITA, Yuji , YAMADA, Kaoru , SHIRAKASHI, Mitsuhiko , TOMA, Yasushi , KOBATA, Itsuki , KUMEKAWA, Masayuki , YASUDA, Hozumi , NABEYA, Osamu , HIROKAWA, Kazuto
发明人： SAITO, Takayuki , SUZUKI, Tsukuru , MAKITA, Yuji , YAMADA, Kaoru , SHIRAKASHI, Mitsuhiko , TOMA, Yasushi , KOBATA, Itsuki , KUMEKAWA, Masayuki , YASUDA, Hozumi , NABEYA, Osamu , HIROKAWA, Kazuto
IPC分类号： C25F3/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： There is provided a method and device for regenerating an ion exchanger which can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an electrode to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the coutner electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：提供了一种再生离子交换器的方法和装置，其可以容易且快速地再生离子交换器，并且可以最小化清洁再生离子交换器时的负载和废液的处理。再生污染离子交换器的方法包括：提供一对再生电极和对电极，设置在电极之间的隔板和设置在对电极和隔板之间的待再生电极; 并在再生电极和辅助电极之间施加电压，同时在隔板和再生电极之间供应液体，并且还在分隔件和对电极之间供应液体。

4. 发明申请

WO2003030223A2 SUBSTRATE PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：基板加工装置和方法
公开(公告)号：WO2003030223A2
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009255
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
IPC分类号： H01L21/00
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： There is a provided a substrate processing apparatus that can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.
摘要翻译：提供了一种基板处理装置，其能够执行与普通的常规蚀刻不同的电解处理，以去除（清除）形成在或附着在斜面部分上的导电材料（膜）等通过电化学作用衬底或处理衬底的外围部分。基板处理装置包括：具有多个电极的电极部，该多个电极层叠有绝缘体，并且具有与基板的周边部相对的保持部; 设置在电极部的保持部中的离子交换部; 液体供应部分，用于将液体供应到电极部分的保持位置; 以及用于向电极部分的电极施加电压使得电极交替具有不同极性的电源。

5. 发明申请

WO2003029531A3 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
公开(公告)号：WO2003029531A3
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009256
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
IPC分类号： C25F1/00
摘要： There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having a pair of electrodes disposed at a given distance with an ion exchanger being interposed; and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.

6. 发明申请

WO2003029531A2 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2003029531A2
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009256
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
IPC分类号： C25F1/00
CPC分类号： B23H5/08 , C23F3/00 , C25F1/00 , C25F3/00 , C25F7/00 , H01L21/32115 , H01L21/32125 , H01L21/32134
摘要： There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having a pair of electrodes disposed at a given distance with an ion exchanger being interposed; and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.
摘要翻译：提供了一种电解处理装置和方法，其可以在完全省略CMP处理或尽可能减少CMP处理时的负载的同时，处理形成在基板表面上的导电材料以使材料变平，或者可以去除（清洁）附着在诸如基板的工件的表面上的外来物质。电解处理装置包括：以一定距离设置的一对电极; 设置在所述一对电极之间的离子交换器; 以及用于在一对电极之间提供液体的液体供应部分。电解处理方法包括：提供具有一对电极的电极部分，所述电极部分设置在与离子交换器相隔一定距离处; 并且使电极与工件接触或接近工件，同时向离子交换器供应流体，从而处理工件的表面。

7. 发明申请

WO2003064734A1 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2003064734A1
公开(公告)日：2003-08-07
申请号：PCT/JP2003/001011
申请日：2003-01-31
申请人： EBARA CORPORATION , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , NABEYA, Osamu
发明人： SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , NABEYA, Osamu
IPC分类号： C25F3/00
CPC分类号： C25F3/00 , C25F7/00 , H01L21/3063 , H01L21/32134
摘要： This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source, wherein the processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.
摘要翻译：本发明涉及一种电解处理装置和方法，其用于处理形成在基板表面上的导电材料，或用于去除附着在基板表面上的杂质。一种电解处理装置，包括可以靠近工件的处理电极，用于向工件供电的供给电极，设置在工件和处理之间的空间中的离子交换器和供电电极，流体供应部分用于在工件和离子交换器之间供应流体，以及电源，其中处理电极和/或馈电电极被电分为多个部分，并且电源向每个分开的电极部分施加电压并且可以分别对每个分割电极部分分别控制电压和/或电流。

8. 发明申请

WO2003054255A1 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2003054255A1
公开(公告)日：2003-07-03
申请号：PCT/JP2002/012973
申请日：2002-12-11
申请人： EBARA CORPORATION , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki
发明人： SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki
IPC分类号： C25F3/00
CPC分类号： C25F7/00 , B23H3/02 , B23H5/08 , C25F3/00 , H01L21/32125
摘要： There is provided an electrolytic processing apparatus and method that can effect processing of a workpiece with high processing precision and can produce an intended form of processed workpiece with high accuracy of form.The electrolytic processing apparatus includes: a processing electrode which can come close to a workpiece; a feeding electrode for feeding electricity to the workpiece; an ion exchanger disposed in at least one of the space between the workpiece and the processing electrode and the space between the workpiece and the feeding electrode; a fluid supply section for supplying a fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode; and a power source for supplying an electric power between the processing electrode and the feeding electrode while arbitrarily controlling at least one of a voltage and an electric current.
摘要翻译：本发明提供一种能够以高加工精度对工件进行加工的电解处理装置和方法，能够以高精度的形式生产加工工件的预期形式。电解处理装置包括：处理电极，可接近于工件; 用于向工件供电的供电电极; 离子交换器，其设置在所述工件和所述处理电极之间的空间中的至少一个和所述工件与所述馈电电极之间的空间中; 流体供应部分，用于将流体供应到工件与处理电极和馈电电极中的至少一个之间的空间; 以及用于在任意地控制电压和电流中的至少一个的同时在所述处理电极和所述馈电电极之间提供电力的电源。

9. 发明申请

WO2003098676A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：WO2003098676A1
公开(公告)日：2003-11-27
申请号：PCT/JP2003/006130
申请日：2003-05-16
申请人： EBARA CORPORATION , SHIRAKASHI, Mitsuhiko , YASUDA, Hozumi , KUMEKAWA, Masayuki , KOBATA, Itsuki
发明人： SHIRAKASHI, Mitsuhiko , YASUDA, Hozumi , KUMEKAWA, Masayuki , KOBATA, Itsuki
IPC分类号： H01L21/3063
CPC分类号： H01L21/02087 , B23H5/04 , B23H5/08 , B24B37/345 , C25F3/00 , C25F7/00 , H01L21/0209 , H01L21/32115 , H01L21/6708 , H01L21/6715 , H01L21/67173 , H01L21/67219 , H01L21/6723 , H01L21/7684 , H01L21/76843 , H01L21/76846 , H01L21/76849 , H01L21/76873
摘要： There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.
摘要翻译：提供了一种基板处理装置，其可以通过使用电解处理方法来处理基板，同时尽可能减少CMP处理时的负载。本发明的基板处理装置包括：电解处理单元，用于电解去除在所述表面上形成的待处理膜的基板W的表面，所述单元包括来自的进料部分（373）与基板W的所述表面接触; 斜面蚀刻单元（48），用于在电解处理单元（36）中与已经与供电部分（373）接触的部分处去除未处理的被处理膜; 化学机械抛光单元（34），用于化学和机械地抛光衬底的表面。

10. 发明申请

WO2003065432A1 ELECTROLYTIC PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理装置和基板处理装置及方法
公开(公告)号：WO2003065432A1
公开(公告)日：2003-08-07
申请号：PCT/JP2003/001024
申请日：2003-01-31
申请人： EBARA CORPORATION , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , NOJI, Ikutaro , YOSHIDA, Kaori
发明人： SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , NOJI, Ikutaro , YOSHIDA, Kaori
IPC分类号： H01L21/304
CPC分类号： C25F7/00 , B23H3/00 , B23H3/04 , B23H3/08 , B23H5/08 , B24B37/04 , C25F3/00 , C25F5/00 , H01L21/32115 , H01L21/3212
摘要： The present invention alleviates workloads in chemical-mechanical polishing (CMP) by replacing all or a portion of the substrate processing by means of chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like and enables processing insuring the higher flatness with the higher efficiency. The electrolytic processing apparatus according to the present invention comprises a chemical-mechanical polishing section 24 for chemically-mechanically polishing a surface of a substrate of a substrate, an electrolytic processing section 26 having a processing electrode and a feeding electrode and also having an ion exchanger 48 provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode for electrolytically processing a surface of a workpiece under the existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring 74 capable of freely moving between the chemical-mechanical polishing section 24 and the processing electrode section 26.
摘要翻译：本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光替换基板处理的全部或一部分来减轻化学机械抛光（CMP）的工作量，并且能够加工确保较高的平坦度与效率更高。根据本发明的电解处理装置包括：化学机械抛光基板表面的化学机械抛光部分24;具有处理电极和馈电电极并且还具有离子交换器的电解处理部分26 48设置在所述基板和所述处理电极之间，或者所述基板和所述馈电电极之间，至少在所述处理电极和所述馈电电极之间施加电压，以在溶液存在下电解处理所述工件的表面; 以及能够在化学机械抛光部24和处理电极部26之间自由移动的顶环74。

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