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1. 发明公开

EP1029954A1 SUBSTRATE PLATING DEVICE 审中-公开
标题翻译：基材涂层设备
公开(公告)号：EP1029954A1
公开(公告)日：2000-08-23
申请号：EP99943206.5
申请日：1999-09-08
申请人： EBARA CORPORATION
发明人： HONGO, Akihisa , OGURE, Naoaki , UEYAMA, Hiroyuki , YAMAKAWA, Junitsu , NAGAI, Mizuki , SUZUKI, Kenichi , CHONO, Atsushi , SENDAI, Satoshi , MISHIMA, Koji
IPC分类号： C25D17/00
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02
摘要： An object of the present invention is to provide a substrate plating apparatus employing an insoluble anode, and particularly a substrate plating apparatus capable of easily and automatically supplying metal ions.
It is another object of the present invention to provide a substrate plating apparatus capable of supplying a uniform primary current distribution between the cathode and anode and facilitating reduction of the size of the plating apparatus.
It is further another object of the present invention to provide a plating apparatus capable of preventing the substrate from being contaminated by particles produced from black film, even when using a soluble anode.
The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution, an insoluble anode being disposed in the plating bath opposite the substrate, the substrate plating apparatus comprising: a circulating vessel or dummy vessel provided separate from the plating bath, a soluble anode and a cathode being disposed in the circulating vessel or dummy vessel, an anion exchange film or selective cation exchange film being disposed between the anode and cathode and isolating the same; wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and generated metal ions are supplied to the plating bath.
A substrate plating apparatus comprises an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath; wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.

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