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1. 发明授权

US11958163B2 Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane 有权
公开(公告)号：US11958163B2
公开(公告)日：2024-04-16
申请号：US17511340
申请日：2021-10-26
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Makoto Fukushima , Keisuke Namiki , Shingo Togashi , Satoru Yamaki , Masahiko Kishimoto , Tomoko Owada
IPC分类号： B24B37/30 , B24B37/04 , B24B37/32 , H01L21/304 , H01L21/687
CPC分类号： B24B37/30 , B24B37/04 , B24B37/32 , H01L21/304 , H01L21/68721
摘要： A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

2. 发明申请

US20220093409A1 INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, PROGRAM, AND SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20220093409A1
公开(公告)日：2022-03-24
申请号：US17425195
申请日：2019-12-04
申请人： EBARA CORPORATION
发明人： Keisuke Namiki , Makoto Fukushima , Osamu Nabeya
IPC分类号： H01L21/306 , G06N3/08 , B24B37/005 , G06N20/00 , G06F17/15
摘要： A system includes a first artificial intelligence unit that performs learning using a plurality of first learning datasets input values of which are sets of parameters different from each other in a combination of parameter types and output values of which are corresponding performance values of the substrate processing apparatus, and after the learning uses, as an input, each of a plurality of verification datasets including combinations of the parameter types that are same as the combinations of the parameter types at the time of learning, to predict a performance value; a selection unit that selects one set of parameter types from a plurality of sets of parameter types included in the plurality of verification datasets, by using at least one of a value indicating a percentage of correct answer of the predicted performance value, a time required for the learning, and a time required for predicting the performance value; and a second artificial intelligence unit that performs learning using a plurality of second learning datasets an input value of which is a set of past parameter values including the selected set of parameter types and an output value of which is a corresponding past performance value, and after the learning, predicts performance values of the target substrate processing apparatus obtained by changing variable parameters among the parameters including the selected set of parameter types with, as an input, a fixed parameter intrinsically determined for a target substrate processing apparatus among parameters including the selected set of parameter types, and outputs a combination of parameter values yielding a performance value, among the predicted performance values, satisfying an extraction criterion.

3. 发明授权

US10442056B2 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US10442056B2
公开(公告)日：2019-10-15
申请号：US13929295
申请日：2013-06-27
申请人： EBARA CORPORATION
发明人： Keisuke Namiki , Hozumi Yasuda , Osamu Nabeya , Makoto Fukushima
IPC分类号： B24B37/32 , B24B37/30
摘要： A substrate holding apparatus is used for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing and planarizing the substrate. The substrate holding apparatus includes an elastic membrane, a top ring body for holding the elastic membrane, and a plurality of pressure chambers partitioned by at least one partition wall of the elastic membrane. The substrate is held by a lower surface of the elastic membrane and pressed against the polishing surface with a fluid pressure by supplying a pressurized fluid to the pressure chambers. The substrate holding apparatus further include a stopper configured to limit the inflation of the elastic membrane by being brought into contact with a part of the partition wall of the elastic membrane or an extending member extending from a rear surface of the elastic membrane whose surface serves as a substrate holding surface.

4. 发明授权

US10213896B2 Elastic membrane, substrate holding apparatus, and polishing apparatus 有权
公开(公告)号：US10213896B2
公开(公告)日：2019-02-26
申请号：US15402703
申请日：2017-01-10
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki , Shintaro Isono
IPC分类号： B24B37/30
摘要： An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

5. 发明授权

US09815171B2 Substrate holder, polishing apparatus, polishing method, and retaining ring 有权
公开(公告)号：US09815171B2
公开(公告)日：2017-11-14
申请号：US14537809
申请日：2014-11-10
申请人： EBARA CORPORATION
发明人： Satoru Yamaki , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Makoto Fukushima , Shingo Togashi
IPC分类号： B24B37/32 , B24B37/10 , B24B37/04
CPC分类号： B24B37/32 , B24B37/04 , B24B37/107
摘要： A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.

6. 发明授权

US09676076B2 Polishing method and polishing apparatus 有权
公开(公告)号：US09676076B2
公开(公告)日：2017-06-13
申请号：US13916432
申请日：2013-06-12
申请人： EBARA CORPORATION
发明人： Keisuke Namiki , Hozumi Yasuda , Shingo Togashi
IPC分类号： B24B37/013
CPC分类号： B24B37/013
摘要： A polishing method is used for polishing a film formed on a substrate by pressing the substrate against a polishing pad. The polishing method includes preparing, in advance, an algorithm for correction of polishing time from a relationship between a known amount of wear of the polishing pad or a known thickness of the polishing pad, and a polishing time and a polishing amount; setting a polishing target value for the film; and measuring an amount of wear of the polishing pad or a thickness of the polishing pad. The polishing method further includes determining an optimal polishing time for the polishing target value from the measured amount of wear of the polishing pad or the measured thickness of the polishing pad and from the algorithm; and polishing the film for the determined optimal polishing time.

7. 发明授权

US08859070B2 Elastic membrane 有权
标题翻译：弹性膜
公开(公告)号：US08859070B2
公开(公告)日：2014-10-14
申请号：US13687263
申请日：2012-11-28
申请人： Ebara Corporation
发明人： Hozumi Yasuda , Katsuhide Watanabe , Keisuke Namiki , Osamu Nabeya , Makoto Fukushima , Satoru Yamaki , Shingo Togashi
IPC分类号： B32B3/00 , B32B3/08 , B32B3/18 , B24B37/30 , B32B27/12
CPC分类号： B32B3/08 , B24B37/30 , B32B3/18 , B32B27/12 , Y10T428/21 , Y10T428/24174 , Y10T428/24851
摘要： An elastic member for use in a substrate holding apparatus includes an elastic member and a first reinforcing member. The first reinforcing member has a higher rigidity than the elastic membrane and reinforces substantially an entire area of the contact portion of the elastic membrane. The contact portion of the elastic member has a contact portion for contact with the substrate. The first peripheral wall portion of the elastic membrane is coupled to a peripheral end of the contact portion and extends upwardly. The second peripheral wall portion of the elastic member defines a first chamber on an outer side thereof and a second chamber on an inner side thereof. The first reinforcing member is embedded in substantially the entire area of the contact portion of the elastic membrane.
摘要翻译：用于基板保持装置的弹性构件包括弹性构件和第一加强构件。第一加强构件具有比弹性膜更高的刚性，并且基本上加强弹性膜的接触部分的整个区域。弹性构件的接触部分具有用于与衬底接触的接触部分。弹性膜的第一周壁连接到接触部分的外周端并向上延伸。弹性构件的第二周壁部分在其外侧上限定第一室，在其内侧限定第二室。第一加强构件嵌入在弹性膜的接触部分的大致整个区域中。

8. 发明授权

US11179823B2 Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane 有权
公开(公告)号：US11179823B2
公开(公告)日：2021-11-23
申请号：US15790733
申请日：2017-10-23
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Makoto Fukushima , Keisuke Namiki , Shingo Togashi , Satoru Yamaki , Masahiko Kishimoto , Tomoko Owada
IPC分类号： B24B37/30 , B24B37/32
摘要： A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

9. 外观设计

USD918161S1 Elastic membrane 有权
公开(公告)号：USD918161S1
公开(公告)日：2021-05-04
申请号：US35506238
申请日：2018-06-18
申请人： EBARA CORPORATION
设计人： Shingo Togashi , Makoto Fukushima , Keisuke Namiki , Osamu Nabeya , Satoru Yamaki , Tomoko Owada , Yoshikazu Kato

10. 外观设计

USD913977S1 Elastic membrane for semiconductor wafer polishing 有权
公开(公告)号：USD913977S1
公开(公告)日：2021-03-23
申请号：US29672852
申请日：2018-12-10
申请人： EBARA CORPORATION
设计人： Satoru Yamaki , Makoto Fukushima , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Tomoko Owada , Masahiko Kishimoto

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