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    • 5. 发明专利
    • METHOD FOR BONDING NAMEPLATE TO SURFACE OF ARTICLE OF CAST METAL
    • JPS62190278A
    • 1987-08-20
    • JP3064486
    • 1986-02-17
    • EBARA CORPEBARA RES CO LTD
    • KOGURE NAOAKITATEISHI KUNIO
    • C09J5/00G09F7/12
    • PURPOSE:To bond a nameplate to surface of an article of cast metal firmly for a long period without using a screw and a rivet, by selecting a pressure- sensitive adhesive depending upon a material of cushioning material, limiting its thickness and properties and laying the adhesive between the nameplate and the article of cast metal. CONSTITUTION:One of cushioning materials having 0.15-1.2mm thickness in the case of cloth or 0.8-2mm thickness in the case of expanded polyester is selected and a pressure-sensitive adhesive (having 10 -10 ps viscosity and 1.5-9.0kgf/cm bond strength) is selected from acrylic rubber, nitrile rubber, urethane rubber, silicone rubber and butyl rubber depending upon material of the cushioning material to bond the cushioning material to a nameplate. Surface of the cushioning material is bonded to surface of an article of cast metal by laying the pressure-sensitive adhesive in 10-50mu thickness between them. In the operation, compression deformation resistance value of the cushioning material and the pressure-sensitive adhesive is 5X10 -5X10 mm/(kgf/cm ) in the case when the cushioning material is cloth and 1.5X10 -1.5 mm/(kgf/cm ) in the case when the cushioning material is except the cloth.
    • 9. 发明专利
    • DRESSING METHOD AND DEVICE FOR ABRASIVE CLOTH IN POLISHING DEVICE
    • JPH09168961A
    • 1997-06-30
    • JP29442396
    • 1996-10-16
    • EBARA CORP
    • KIMURA NORIOAOKI KATSUYUKITATEISHI KUNIOYASUDA HOZUMI
    • B24B53/017B24B37/00
    • PROBLEM TO BE SOLVED: To provide a dressing method and a dressing device for an abrasive cloth in a polishing device, in which the moderate surface roughness of the abrasive cloth surface is secured and the abrasive cloth surface is linearly dressed by dressing. SOLUTION: In a dressing method for an abrasive cloth in a polishing device, the abrasive cloth surface is dressed by bringing the lower surface of a rotating dresser into contact with the abrasive cloth surface of a rotating surface plate of a polishing device for bringing a device pattern formed on the upper surface of a semiconductor wafer into contact with the abrasive cloth surface of the rotating surface plate, grinding it, and making it flat. The abrasive cloth stuck on the upper surface of the surface plate is a foamed polyurethane abrasive cloth, a dresser 10 has a structure in which a diamond electrodeposition ring 13 formed by electro depositing fine diamond grains on the lower surface of a dresser main body 11 by the prescribed width, and the abrasive cloth is dressed by bringing the diamond electrodeposition ring 13 on the lower surface of the dresser 10 into contact with the foamed polyurethane abrasive cloth surface.
    • 10. 发明专利
    • PRODUCTION OF SILICON DIOXIDE FILM
    • JPH07165412A
    • 1995-06-27
    • JP34182593
    • 1993-12-13
    • EBARA CORP
    • KOGURE NAOAKIKAWAMURA SATOSHITSUJIMURA MANABUTATEISHI KUNIO
    • C01B33/12C23C18/00H01L21/316
    • PURPOSE:To efficiently form a sound silicon dioxide film containing a small amount of sticking particles. CONSTITUTION:This method for producing a silicon dioxide film is to add aluminum to an aqueous solution containing silicon dioxide in a saturated state (a stock solution), produce an aqueous solution of hydrosilicofluoric acid (a treating liquid) in which silicon dioxide is converted into a supersaturated state, bring the resultant treating liquid into contact with a substrate and deposit the silicon dioxide film thereon. The amount of the added aluminum based on 1l stock solution is 0.05-0.4mol and the temperature obtained by subtracting the temperature for producing the treating liquid from the temperature of the treating liquid in producing the silicon dioxide film (a rise in temperature of the treating liquid) is 0-25 deg.C. The relationship between the amount of the added aluminum and the rise in temperature of the treating liquid is kept within a range so as to provide a prescribed value or above of the deposition rate of the silicon dioxide film and regulate the number of sticking particles of the silicon dioxide having >=0.2mum particle diameter to a prescribed value or below.