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1. 发明专利

JPH1092781A METHOD AND EQUIPMENT FOR CARRYING SUBSTRATE 失效
公开(公告)号：JPH1092781A
公开(公告)日：1998-04-10
申请号：JP16059597
申请日：1997-06-03
申请人： EBARA CORP , TOSHIBA CORP
发明人： MAEKAWA TOSHIRO , HAMADA TOSHIMI , AOKI RIICHIRO , KODAMA SHOICHI , YAJIMA HIROMI
IPC分类号： B08B3/04 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To prevent treatment fluid of a substrate from dripping, while preventing the substrate from drying by adjusting the quantity of treatment fluid held on the substrate to be a specific target value, before the semiconductor substrate is carried between treatment processes. SOLUTION: Before carrying equipements 5A, 5B take out a semiconductor substrate 1 from a spin chuck and carry the substrate, the following is performed; a process wherein cleaning fluid on the semiconductor substrate 1 is eliminated by a physical method, and the quantity of the cleaning fluid held on the substrate is adjusted to be a specific target value. That is, after the supply of the cleaning fluid is stopped and rinsing is halted, the semiconductor substrate 1 is rotated at a number of revolutions lower than that of a cleaning process. Thereby the wet state of the semiconductor substrate 1 can be maintained during the waiting period, until the next cleaning treatment or during carriage, and the quantity of the treatment fluid of the semiconductor substrate 1 can be maintained in a state in which the fluid scarcely drips.

2. 发明专利

JPH0871511A CLEANING AND ITS DEVICE 失效
公开(公告)号：JPH0871511A
公开(公告)日：1996-03-19
申请号：JP12958895
申请日：1995-04-28
申请人： EBARA CORP , TOSHIBA CORP
发明人： MAEKAWA TOSHIRO , ONO KOJI , OKADA MOTOAKI , TAKAHASHI YOSHIMIZU , MISHIMA SHIRO , KODERA MASAKO , SHIGETA ATSUSHI , AOKI RIICHIRO , KONO YOSHISUKE
IPC分类号： B08B1/00 , B08B7/04 , H01L21/304
摘要： PURPOSE: To provide a method and a device for effectively cleaning submicron particles and also removing particles sticking stubbornly to the surface of a substrate or microscratches on the surface by slicing it off thinly, and holding the particles at the time of cleaning and making possible an easy self-cleaning after cleaning as well as a device using the method. CONSTITUTION: A cleaning member 3 consisting mainly of a polyurethane with micropores having an average pore size of 10 to 200μm provided on the contact face with an object to be cleaned, is caused to come into contact with the object for scrubbing.

3. 发明专利

DE69737926D1 未知
公开(公告)号：DE69737926D1
公开(公告)日：2007-08-30
申请号：DE69737926
申请日：1997-10-20
申请人： EBARA CORP
发明人： HAMADA SATOMI , MAEKAWA TOSHIRO , TAKEUCHI TOSHIYA
IPC分类号： H01L21/00
摘要： A cleaning apparatus is used for cleaning a thin disk-shaped workpiece such as a semiconductor wafer, a liquid crystal display or the like. The cleaning apparatus comprises a support mechanism for supporting a workpiece and rotating the workpiece about its own axis, and a cleaning member for being in sliding contact with at least one of opposite surfaces of the workpiece. The support mechanism comprises a plurality of spindles, and a plurality of rotatable holding portions provided on upper ends of the spindles and having respective circumferential edges engageable with a circumferential edge of the workpiece. The plurality of spindles are clustered into groups around the workpiece, and the adjacent two groups of the spindles are positioned to form a wide spacing between the adjacent two groups of the spindles, and a path along which the workpiece is supplied to and removed from the support mechanism is positioned in the wide spacing.

4. 发明专利

DE69522617T2 未知
公开(公告)号：DE69522617T2
公开(公告)日：2002-07-04
申请号：DE69522617
申请日：1995-05-15
申请人： EBARA CORP
发明人： MAEKAWA TOSHIRO , ONO KOJI , OKADA MOTOAKI , TAKAHASHI TAMAMI , MISHIMA SHIRO , KODERA MASAKO , SHIGETA ATSUSHI , AOKI RIICHIRO , KOUNO GISUKE
IPC分类号： B08B1/00 , B08B1/04 , B08B3/08 , B24B37/34 , B24D3/32 , H01L21/00 , H01L21/306 , B24B37/04
摘要： A semiconductor wafer (1) is scrubbed by a cleaning member (3) made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores has an average diameter ranging from 10 to 200 mu m. The cleaning member (3) may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. Particles that are strongly attached to the surface of a substrate such as a semiconductor wafer can easily be removed by scrubbing. At the same time a substrate is cleaned, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.

5. 发明专利

DE69218114T2 未知
公开(公告)号：DE69218114T2
公开(公告)日：1997-10-09
申请号：DE69218114
申请日：1992-09-29
申请人： EBARA CORP
发明人： HASHIMOTO HIROYUKI , HIYAMA HIROKUNI , MAEKAWA TOSHIRO , YAMAMOTO KAZUYOSHI
IPC分类号： F04F7/00
摘要： A vibrating column pump pumps liquid by making use of liquid vibration generated at the time when the vibrating pipe (1) is vibrated in a longitudinal direction thereof. The vibrating column pump comprises a vibrating pipe (1) for pumping liquid therethrough, flexible pipes (2A) for connecting both ends of the vibrating pipe (1) with a stationary suction pipe (3) and a stationary outlet pipe (5), vibrating means for vibrating the vibrating pipe (1) in a longitudinal direction thereof, and retainer means (8) for removably retaining the vibrating pipe (1) in such a manner that the vibrating pipe (1) is removably connected to the vibrating means. The liquid contacting unit including the vibrating pipe (1) and the flexible pipes (2A) is separated from the vibrating means so that the liquid contacting unit is disposable and can be easily replaced with a new one.

6. 发明专利

DE69522617D1 未知
公开(公告)号：DE69522617D1
公开(公告)日：2001-10-18
申请号：DE69522617
申请日：1995-05-15
申请人： EBARA CORP
发明人： MAEKAWA TOSHIRO , ONO KOJI , OKADA MOTOAKI , TAKAHASHI TAMAMI , MISHIMA SHIRO , KODERA MASAKO , SHIGETA ATSUSHI , AOKI RIICHIRO , KOUNO GISUKE
IPC分类号： B08B1/00 , B08B1/04 , B08B3/08 , B24B37/34 , B24D3/32 , H01L21/00 , H01L21/306 , B24B37/04
摘要： A semiconductor wafer (1) is scrubbed by a cleaning member (3) made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores has an average diameter ranging from 10 to 200 mu m. The cleaning member (3) may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. Particles that are strongly attached to the surface of a substrate such as a semiconductor wafer can easily be removed by scrubbing. At the same time a substrate is cleaned, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.

7. 发明专利

DE69737926T2 未知
公开(公告)号：DE69737926T2
公开(公告)日：2008-04-10
申请号：DE69737926
申请日：1997-10-20
申请人： EBARA CORP
发明人： HAMADA SATOMI , MAEKAWA TOSHIRO , TAKEUCHI TOSHIYA
IPC分类号： H01L21/00
摘要： A cleaning apparatus is used for cleaning a thin disk-shaped workpiece such as a semiconductor wafer, a liquid crystal display or the like. The cleaning apparatus comprises a support mechanism for supporting a workpiece and rotating the workpiece about its own axis, and a cleaning member for being in sliding contact with at least one of opposite surfaces of the workpiece. The support mechanism comprises a plurality of spindles, and a plurality of rotatable holding portions provided on upper ends of the spindles and having respective circumferential edges engageable with a circumferential edge of the workpiece. The plurality of spindles are clustered into groups around the workpiece, and the adjacent two groups of the spindles are positioned to form a wide spacing between the adjacent two groups of the spindles, and a path along which the workpiece is supplied to and removed from the support mechanism is positioned in the wide spacing.

8. 发明专利

DE69218114D1 未知
公开(公告)号：DE69218114D1
公开(公告)日：1997-04-17
申请号：DE69218114
申请日：1992-09-29
申请人： EBARA CORP
发明人： HASHIMOTO HIROYUKI , HIYAMA HIROKUNI , MAEKAWA TOSHIRO , YAMAMOTO KAZUYOSHI
IPC分类号： F04F7/00
摘要： A vibrating column pump pumps liquid by making use of liquid vibration generated at the time when the vibrating pipe (1) is vibrated in a longitudinal direction thereof. The vibrating column pump comprises a vibrating pipe (1) for pumping liquid therethrough, flexible pipes (2A) for connecting both ends of the vibrating pipe (1) with a stationary suction pipe (3) and a stationary outlet pipe (5), vibrating means for vibrating the vibrating pipe (1) in a longitudinal direction thereof, and retainer means (8) for removably retaining the vibrating pipe (1) in such a manner that the vibrating pipe (1) is removably connected to the vibrating means. The liquid contacting unit including the vibrating pipe (1) and the flexible pipes (2A) is separated from the vibrating means so that the liquid contacting unit is disposable and can be easily replaced with a new one.

9. 发明专利

JPH10335283A CLEANING EQUIPMENT AND METHOD 失效
公开(公告)号：JPH10335283A
公开(公告)日：1998-12-18
申请号：JP8887698
申请日：1998-04-01
申请人： EBARA CORP
发明人： MAEKAWA TOSHIRO
IPC分类号： B08B1/04 , B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To enable a cleaned object to be effectively cleaned, by a method wherein a roll-type brush member which rotates around a rotating shaft nearly parallel to the cleaned surface of the cleaned object coming into contact with either the surface or rear of the cleaned object and a holding member which holds the cleaned object are provided. SOLUTION: Two roll-type brush members 13 and 15 are each provided above and below a semiconductor wafer W as a cleaned object, and the peripheral edge of the semiconductor wafer W is supported with spindles 11 as supporting members. The rotating shafts 13b and 15b of the brush members 13 and 15 are made to approximate to or recede from the semiconductor wafer W and rotated in the direction of arrows F1 and F2 by brush drive mechanisms 17 and 18 respectively, cleaning liquid is fed to the surface of the semiconductor wafer W through a cleaning liquid feed nozzle 19, and the surfaces of the wafer are cleaned with brush members 13 and 15. By this setup, the semiconductor wafer W can be improved in cleanness.

10. 发明专利

JPH10308374A METHOD AND EQUIPMENT FOR CLEANING 失效
公开(公告)号：JPH10308374A
公开(公告)日：1998-11-17
申请号：JP7325598
申请日：1998-03-06
申请人： EBARA CORP
发明人： HAMADA TOSHIMI , MAEKAWA TOSHIRO
IPC分类号： B08B1/04 , B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and an equipment for cleaning wherein the surface of the central portion of an object to be cleaned is protected from damage, and specially electrostatic breakdown is prevented in an electronic circuit on the surface of the central portion of a wafer when the object is the wafer, and also because an appropriate mount of cleaning liquid is put on the center of rotation of the object to put the cleaning liquid on the whole of the object, the object can be excellently cleaned. SOLUTION: A cleaning method includes a liquid injection cleaning process wherein a cleaning liquid injected from a nozzle 25 moving opposite to the surface to be cleaned of a rotary object W to be cleaned of thin plate is sprayed on the object W to remove dusts adhering to the surface, thus cleaning the object. In the liquid injection cleaning process, a trail of the center of flow of the cleaning liquid sprayed on the surface is at a specified distance d from the center when the trail most closely approaches the center of rotation of the object.

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