会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • VAPORIZATION SOURCE WITH BAFFLE
    • 蒸汽源与BAFFLE
    • WO2006076287A1
    • 2006-07-20
    • PCT/US2006/000665
    • 2006-01-06
    • EASTMAN KODAK COMPANYFREEMAN, Dennis, RayREDDEN, Neil, Peter
    • FREEMAN, Dennis, RayREDDEN, Neil, Peter
    • C23C14/24C23C14/12
    • C23C14/243C23C14/12
    • A vapor deposition (10) source for depositing organic material (25) includes a boat (30) having a cavity (15) for holding organic material and an aperture plate (40) , having a plurality of spaced apertures (45) , for enclosing the boat. The vapor deposition source also includes a heating element (50) provided in the cavity between the aperture plate and the organic material, and a baffle member (70) in contact with the heating element and having at least three surfaces (75, 80, 85, 120, 125) which absorb energy from the heating element, the first surface redirecting energy to the aperture plate and the second and third surfaces (80, 85) redirecting energy to the boat walls and the organic material.
    • 用于沉积有机材料(25)的气相沉积(10)源包括具有用于保持有机材料的空腔(15)的船(30)和具有多个间隔开的孔(45)的孔板(40),用于封闭 小舟。 气相沉积源还包括设置在孔板和有机材料之间的空腔中的加热元件(50)和与加热元件接触并具有至少三个表面(75,80,85)的挡板构件 ,120,125),其从所述加热元件吸收能量,所述第一表面将能量重定向到所述孔板,并且所述第二和第三表面(80,85)将能量重定向到所述舟壁和所述有机材料。
    • 4. 发明申请
    • HIGH THICKNESS UNIFORMITY VAPORIZATION SOURCE
    • 高浓度均匀蒸发源
    • WO2005098079A1
    • 2005-10-20
    • PCT/US2005/008252
    • 2005-03-11
    • EASTMAN KODAK COMPANYLONG, MichaelGRACE, Jeremy, MatthewKOPPE, Bruce, EdwardFREEMAN, Dennis, RayREDDEN, Neil, PeterZWAAP, Robert, Ferdinand
    • LONG, MichaelGRACE, Jeremy, MatthewKOPPE, Bruce, EdwardFREEMAN, Dennis, RayREDDEN, Neil, PeterZWAAP, Robert, Ferdinand
    • C23C14/24
    • C23C14/24C23C14/12C23C14/243C23C14/26
    • A vapor deposition source for use in vacuum chamber for coating an organic layer on a substrate of an OLED device, includes a manifold(60) including side and bo ttom walls defining a chamber for receiving organic material, and an aperture pl ate(40) disposed between the side walls, the aperture plate having a plurality of spaced apart apertures(90) for emitting vaporized organic material; the apertu re plate including conductive material which in response to an electrical current produces heat; means for heating the organic material to a temperature which c auses its vaporization, and heating the side walls of the manifold; and an elect rical insulator(120) coupling the aperture plate to the side walls for concentra ting heat in the unsupported region of the aperture plate adjacent to the apertu res, whereby the distance between the aperture plate and the substrate can be re duced to provide high coatA vapor deposition source for use in vacuum chamber for coating an organic layer on a substrate of an OLED device, includes a manifoldincluding side and bottom walls defining a chamber for receiving organic materi al, and an aperture plate disposed between the side walls, the aperture plate ving a plurality of spaced apart apertures for emitting vaporized organic materi al; the aperture plate including conductive material which in response to an ele ctrical current produces heat; means for heating the organic material to a tempe rature which causes its vaporization, and heating the side walls of the manifold and an electrical insulator coupling the aperture plate to the side walls for concentrating heat in the unsupported region of the aperture plate adjacent to t he apertures, whereby the distance between the aperture plate and the substrate can be reduced to provide high coating thickness uniformity on the substrate.
    • 一种用于在OLED器件的衬底上涂覆有机层的真空室中的气相沉积源,包括歧管(60),其包括限定用于接收有机材料的室的侧壁和底壁,以及孔(40) 设置在所述侧壁之间,所述孔板具有用于发射蒸发的有机材料的多个间隔开的孔(90) 包括响应于电流的导电材料的印模板产生热量; 用于将有机材料加热到使其蒸发的温度并加热歧管的侧壁的装置; 以及将孔板连接到侧壁上的电绝缘体(120),用于在孔板的邻近孔径区域的未支撑区域内集中热量,由此可以减小孔板和衬底之间的距离以提供 高涂层用于在OLED器件的衬底上涂覆有机层的真空室中的气相沉积源包括限定用于接收有机物的室的侧面和底壁以及设置在侧壁之间的孔板, 孔板,其具有多个间隔开的孔,用于发射蒸发的有机物质; 包括响应于电流电流的导电材料的孔板产生热量; 用于将有机材料加热到导致其蒸发的温度的装置,以及加热歧管的侧壁和将孔板耦合到侧壁的电绝缘体,用于将热量集中在邻近的孔板的未支撑区域 孔,从而可以减小孔板和基底之间的距离,以在基底上提供高的涂层厚度均匀性。
    • 10. 发明公开
    • HIGH THICKNESS UNIFORMITY VAPORIZATION SOURCE
    • 具有高DICK UNITY蒸发源
    • EP1727922A1
    • 2006-12-06
    • EP05725436.9
    • 2005-03-11
    • EASTMAN KODAK COMPANY (a New Jersey corporation)
    • LONG, MichaelGRACE, Jeremy, MatthewKOPPE, Bruce, EdwardFREEMAN, Dennis, RayREDDEN, Neil, PeterZWAAP, Robert, Ferdinand
    • C23C14/24C23C14/26C23C14/12
    • C23C14/24C23C14/12C23C14/243C23C14/26
    • A vapor deposition source for use in vacuum chamber for coating an organic layer on a substrate of an OLED device, includes a manifold(60) including side and bo ttom walls defining a chamber for receiving organic material, and an aperture pl ate(40) disposed between the side walls, the aperture plate having a plurality of spaced apart apertures(90) for emitting vaporized organic material; the apertu re plate including conductive material which in response to an electrical current produces heat; means for heating the organic material to a temperature which c auses its vaporization, and heating the side walls of the manifold; and an elect rical insulator(120) coupling the aperture plate to the side walls for concentra ting heat in the unsupported region of the aperture plate adjacent to the apertu res, whereby the distance between the aperture plate and the substrate can be re duced to provide high coatA vapor deposition source for use in vacuum chamber for coating an organic layer on a substrate of an OLED device, includes a manifoldincluding side and bottom walls defining a chamber for receiving organic materi al, and an aperture plate disposed between the side walls, the aperture plate ving a plurality of spaced apart apertures for emitting vaporized organic materi al; the aperture plate including conductive material which in response to an ele ctrical current produces heat; means for heating the organic material to a tempe rature which causes its vaporization, and heating the side walls of the manifold and an electrical insulator coupling the aperture plate to the side walls for concentrating heat in the unsupported region of the aperture plate adjacent to t he apertures, whereby the distance between the aperture plate and the substrate can be reduced to provide high coating thickness uniformity on the substrate.