会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Apparatus for loading shape memory gripper mechanisms
    • 装载形状记忆夹持机构的装置
    • US06240630B1
    • 2001-06-05
    • US08984624
    • 1997-12-03
    • Abraham P. LeeWilliam J. BenettDaniel L. SchumannPeter A. KrulevitchJoseph P. Fitch
    • Abraham P. LeeWilliam J. BenettDaniel L. SchumannPeter A. KrulevitchJoseph P. Fitch
    • B21D3904
    • A61B17/221A61B17/1219A61B2017/00345A61B2017/00867A61B2017/00871A61B2017/1205A61B2017/12068A61B2017/12072Y10T29/49865Y10T29/49929Y10T29/53439Y10T29/53987
    • A method and apparatus for loading deposit material, such as an embolic coil, into a shape memory polymer (SMP) gripping/release mechanism. The apparatus enables the application of uniform pressure to secure a grip by the SMP mechanism on the deposit material via differential pressure between, for example, vacuum within the SMP mechanism and hydrostatic water pressure on the exterior of the SMP mechanism. The SMP tubing material of the mechanism is heated to above the glass transformation temperature (Tg) while reshaping, and subsequently cooled to below Tg to freeze the shape. The heating and/or cooling may, for example, be provided by the same water applied for pressurization or the heating can be applied by optical fibers packaged to the SMP mechanism for directing a laser beam, for example, thereunto. At a point of use, the deposit material is released from the SMP mechanism by reheating the SMP material to above the temperature Tg whereby it returns to its initial shape. The reheating of the SM material may be carried out by injecting heated fluid (water) through an associated catheter or by optical fibers and an associated beam of laser light, for example.
    • 一种用于将诸如栓塞线圈的沉积材料装载到形状记忆聚合物(SMP)夹持/释放机构中的方法和装置。 该装置能够通过例如SMP机构中的真空和SMP机构的外部上的静水压力之间的压差来施加均匀的压力,以通过SMP机构来确保在沉积材料上的握持。 将机构的SMP管材料加热至高于玻璃化转变温度(Tg),同时重塑,随后冷却至Tg以下以冻结形状。 加热和/或冷却可以例如由施加加压的相同的水提供,或者可以通过包封在SMP机构中的光纤施加加热,以引导例如激光束。 在使用时,通过将SMP材料再加热到高于Tg的温度Tg,沉积材料从SMP机制释放,由此其恢复到初始形状。 SM材料的再加热可以通过例如通过相关联的导管或通过光纤和相关的激光束注入加热的流体(水)来进行。