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1. 发明专利

JP2004068455A Building material made of fiber reinforced plastic 审中-公开
公开(公告)号：JP2004068455A
公开(公告)日：2004-03-04
申请号：JP2002230567
申请日：2002-08-07
申请人： Du Pont Toray Co Ltd , Faibekkusu Kk , Sakai Sangyo Kk , Toray Ind Inc , サカイ産業株式会社 , ファイベックス株式会社 , 東レ・デュポン株式会社 , 東レ株式会社
发明人： MATSUBARA SUMIYUKI , SAKAI ROKURO , NAKAMURA MINORU , TSUNODA ATSUSHI , UHARA KENJI , MORIYAMA HIDEKI
IPC分类号： E04C5/07 , B29C70/06 , B29K79/00 , B29K105/08 , C08J5/04
摘要： PROBLEM TO BE SOLVED: To provide a new building material excellent in heat resistance.
SOLUTION: The building material is characterized in that it is made of fiber reinforced plastics containing a polyimide resin and continuous fibers.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004083885A Polyamic acid mixture, polyimide, polyimide film and use of the same 审中-公开
公开(公告)号：JP2004083885A
公开(公告)日：2004-03-18
申请号：JP2003185118
申请日：2003-06-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： YAMASHITA SHINSUKE , MORIYAMA HIDEKI , UHARA KENJI
IPC分类号： C08L79/08 , C08G73/10 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyamic acid mixture as a precursor of a polyimide which can give a polyimide film having excellent punchability, to provide the polyimide formed out of the polyamic acid mixture, to provide the polyimide film having the excellent punchability, and to provide a flexible circuit board and a stiffener utilizing the same.
SOLUTION: This polyamic acid mixture contains 0.1-10 wt% of (B) a polyamic acid which is a heat-curable polyimide or a precursor of the heat-curable polyimide in (A) another polyamic acid which is a precursor of a non-thermoplastic polyimide.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2004083875A Polyamic acid mixture, polyimide film and use of the same 审中-公开
公开(公告)号：JP2004083875A
公开(公告)日：2004-03-18
申请号：JP2003180789
申请日：2003-06-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： YAMASHITA SHINSUKE , MORIYAMA HIDEKI , UHARA KENJI
IPC分类号： C08L79/08 , C08G73/10 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyamic acid used for obtaining a polyimide having high adhesive strength, to provide a polyimide formed out of the polyamic acid, and to provide a flexible circuit board obtained by using the polyimide.
SOLUTION: A polyamic acid mixture contains the polyamic acid and another polyamic acid which is a heat-curable polyimide or a precursor of the heat-curable polyimide in an amount of 0.1-10 wt% based on the above polyamic acid. The highly adhesive polyimide film is obtained by using the mixture, wherein the film has the adhesive strength of ≥19 N/cm. The flexible circuit board is obtained by using the polyimide film.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2004083896A Non-insulating polyimide film and method for production of the same 审中-公开
标题翻译：非绝缘聚酰亚胺膜及其制造方法
公开(公告)号：JP2004083896A
公开(公告)日：2004-03-18
申请号：JP2003191597
申请日：2003-07-04
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , MORIYAMA HIDEKI , UHARA KENJI
IPC分类号： C08J5/18 , C08G73/10 , C08K7/06 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film with controlled electrical conductivity without impairing mechanical properties and to provide a method for producing the same.
SOLUTION: The polyimide film comprises powdered carbon fibers and the polyimide as indispensable components and has ≤1.0×10
15 Ωcm of volume resistivity. The film is produced by dispersing the powdered carbon fibers in a solution of polyamic acid which is a precursor of the polyimide, and then imidizing after film forming the polyamic acid solution.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供具有受控导电性的聚酰亚胺膜而不损害机械性能并提供其制造方法。解决方案：聚酰亚胺膜包含粉状碳纤维和聚酰亚胺作为不可或缺的组分，具有体积电阻率≤1.0×10 15 Ωcm。通过将粉状碳纤维分散在作为聚酰亚胺前体的聚酰胺酸溶液中，然后在成膜聚酰胺酸溶液后进行酰亚胺化来制造膜。版权所有（C）2004，JPO

5. 发明专利

JP2004001510A Laminated plate and polyimide film used in the plate 审中-公开
公开(公告)号：JP2004001510A
公开(公告)日：2004-01-08
申请号：JP2003133265
申请日：2003-05-12
申请人： Du Pont Toray Co Ltd , E I Du Pont De Nemours & Co , イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company , 東レ・デュポン株式会社
发明人： MORIYAMA HIDEKI , YAMASHITA SHINSUKE , UHARA KENJI , DUNBAR MEREDITH L , EDMAN JAMES R
IPC分类号： B32B15/088 , B32B15/08 , B32B27/34 , C08G73/10 , H05K1/03
CPC分类号： B32B27/34 , C08G73/101 , C08G73/1014 , H05K1/0346 , Y10S428/91 , Y10T428/31681 , Y10T428/31721
摘要： PROBLEM TO BE SOLVED: To provide a laminated plate which is improved in resistance to a defect by stripping and in blanking properties when incorporated into a flexible circuit structure.
SOLUTION: The laminated plate is made of a highly bondable polyimide and preferably formed from a tetracarboxylic acid component, a diamine component, and a polyamide acid made from dicarboxylic acid component in an amount of 0.1-5.0 mole % of the tetracarboxylic acid component. The adhesive strength of the laminated plate is above 10 N/cm.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2004002799A Polyamic acid, polyimide film, method for producing the same and flexible circuit board 审中-公开
公开(公告)号：JP2004002799A
公开(公告)日：2004-01-08
申请号：JP2003105270
申请日：2003-04-09
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , UHARA KENJI , MORIYAMA HIDEKI
IPC分类号： B32B15/08 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having a high peeling strength with a metal foil even without being mediated by an adhesive, a method for easily producing the film and a circuit board by using the film.
SOLUTION: This polyimide film is obtained by incorporating copper acetylacetonate and/or iron acetylacetonate in polyamic acid and performing an imide-forming reaction thermally and/or chemically. On forming a metal layer on the surface of the polyimide film, the film is characterized by having properties of exhibiting ≥2.5 N/cm initial peeling strength between the metal layer and the film and also ≥1.5 N/cm after its heat treatment at 150°C for 240 hrs.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2014139296A Aromatic polyamide, aromatic polyamide film and laminate 审中-公开
标题翻译：芳族聚酰胺，芳香族聚酰胺薄膜和层压板
公开(公告)号：JP2014139296A
公开(公告)日：2014-07-31
申请号：JP2013245718
申请日：2013-11-28
申请人： Toray Ind Inc , 東レ株式会社
发明人： MATSUI KAZUNAO , MORIYAMA HIDEKI
IPC分类号： C08G69/32 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an aromatic polyamide polymer achieving both of colorless transparency and solvent resistance to acetone, and to provide a molded article having high transparency, solvent resistance, low thermal expansion coefficient, high heat resistance and toughness.SOLUTION: There is provided an aromatic polyamide containing a structural unit expressed by the chemical formula (I) to (III), and a structural unit consisting of an aromatic dicarboxylic acid residue. There is also provided an aromatic polyamide film containing the aromatic polyamide, having resistance to acetone, light transmittance of a light with wavelength of 400 nm at a thickness 10 μm of 50% or more, a glass-transition temperature (Tg) of 230°C or higher, a Young modulus in at least one direction of 4 GPa or more, heat expansion coefficient in at least one direction at 100°C to 200°C of 50 ppm/°C or less.
摘要翻译：要解决的问题：提供一种对丙酮具有无色透明性和耐溶剂性的芳族聚酰胺聚合物的制造方法，并提供具有高透明性，耐溶剂性，低热膨胀系数，高耐热性和韧性的成型体。解决方案：提供含有由化学式（I）至（III）表示的结构单元的芳族聚酰胺和由芳族二羧酸残基组成的结构单元。还提供了含有芳香族聚酰胺的芳香族聚酰胺膜，耐丙酮性，厚度10μm为50μm以上的波长400nm的光的透光率为50％以上，玻璃化转变温度（Tg）为230° 以上，至少一个方向的杨氏模量为4GPa以上，100℃〜200℃下的至少一个方向的热膨胀系数为50ppm /℃以下。

8. 发明专利

JP2013129852A Fully aromatic polyamide film 有权
标题翻译：全芳香聚酰胺薄膜
公开(公告)号：JP2013129852A
公开(公告)日：2013-07-04
申请号：JP2013078328
申请日：2013-04-04
申请人： Toray Ind Inc , 東レ株式会社
发明人： MORIYAMA HIDEKI
IPC分类号： C08J5/18 , C08G69/32
摘要： PROBLEM TO BE SOLVED: To obtain a fully aromatic polyamide film having a low thermal expansion coefficient and a high transparency using a material containing no chlorine atom in its polymer structure.SOLUTION: The fully aromatic polyamide film contains no chlorine atom in its polymer structure, wherein there is at least one pair of directions in which an average thermal expansion coefficient at 100-200 °C is 0 to 10 ppm/°C in both of one direction in a film surface and a direction perpendicular thereto, and wherein light transmittances of lights at all wavelengths from 400 to 500 nm are 80% or higher.
摘要翻译：要解决的问题：为了在其聚合物结构中使用不含氯原子的材料获得具有低热膨胀系数和高透明度的全芳族聚酰胺薄膜。解决方案：完全芳族聚酰胺薄膜在其聚合物结构中不含氯原子，其中存在至少一对方向，其中在膜表面中的一个方向和垂直于其的方向上，100-200℃下的平均热膨胀系数为0至10ppm /℃，并且其中光透射率 400〜500nm波长的光均为80％以上。

9. 发明专利

JP2011162775A Aromatic polyamide and aromatic polyamide film 有权
标题翻译：芳香族聚酰胺和芳香族聚酰胺薄膜
公开(公告)号：JP2011162775A
公开(公告)日：2011-08-25
申请号：JP2011003682
申请日：2011-01-12
申请人： Toray Ind Inc , 東レ株式会社
发明人： MORIYAMA HIDEKI , MATSUI KAZUNAO , TSUKUDA AKIMITSU
IPC分类号： C08G69/42 , C08G69/32 , C08J5/18 , G02F1/1335 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain an aromatic polyamide that contains no chlorine and bromine atom, has excellent solubility, and also exhibits high mechanical physicalities when made into a film, and also to obtain an aromatic polyamide film. SOLUTION: The aromatic polyamide includes a structural unit represented by chemical formula (I) (wherein R 1 is a para-oriented aromatic group to which a fluorine atom is directly bonded), and satisfies the following formula (5): 5≤a≤50 when the molar fraction of the structural unit represented by chemical formula (I) is defined as a. COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2011074106A Aromatic polyamide and aromatic polyamide film 有权
标题翻译：芳香族聚酰胺和芳香族聚酰胺薄膜
公开(公告)号：JP2011074106A
公开(公告)日：2011-04-14
申请号：JP2009223900
申请日：2009-09-29
申请人： Toray Ind Inc , 東レ株式会社
发明人： MATSUI KAZUNAO , MORIYAMA HIDEKI
IPC分类号： C08G69/32 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide an aromatic polyamide not containing a chlorine atom in a polymer structure, and keeping polymer soluble in a nonprotonic polar solvent without adding an inorganic salt in a polymerization step, and to provide an aromatic polyamide film containing the aromatic polyamide.
SOLUTION: The aromatic polyamide film contains at least ≥1 mol% of an acid chloride component having a specific flexible structure in the polymer structure.
COPYRIGHT: (C)2011,JPO&INPIT

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