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1. 发明授权

US07247080B1 Feedback controlled polishing processes 有权
标题翻译：反馈控制抛光工艺
公开(公告)号：US07247080B1
公开(公告)日：2007-07-24
申请号：US11397075
申请日：2006-04-03
申请人： Doyle E. Bennett , Boguslaw A. Swedek , Arulkumar Shanmugasundram
发明人： Doyle E. Bennett , Boguslaw A. Swedek , Arulkumar Shanmugasundram
IPC分类号： B24B49/00 , B24B49/12
CPC分类号： G05B19/41875 , G05B2219/45232 , Y02P90/22
摘要： Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishing cycle in which a first polishing process is performed on a substrate that includes a metal layer. The first polishing process clears the metal layer from the substrate during the current polishing cycle. The product includes instructions to calculate a representation of a clearing profile of the first polishing process. The calculation is based on the monitoring information received during the current polishing cycle. The product includes instructions to detect non-uniformity in the representation. The product includes instructions to generate, from the non-uniformity detected, feedback information for improving the uniformity of a clearing profile of the first polishing process for a subsequent polishing cycle.
摘要翻译：用于反馈控制抛光的方法和装置。一种用于产生化学机械抛光反馈的计算机程序产品。该产品包括可操作以使处理器在当前抛光循环期间接收监测信息的指令，其中在包括金属层的基板上执行第一抛光工艺。在当前的抛光循环期间，第一抛光工艺从衬底中清除金属层。该产品包括计算第一次抛光过程的清除轮廓的表示的说明。该计算基于在当前抛光周期期间接收到的监视信息。该产品包括检测表示中不均匀的指令。该产品包括从不均匀性检测到的反馈信息中产生用于改进随后抛光循环的第一抛光处理的清除轮廓的均匀性的指令。

2. 发明授权

US07024268B1 Feedback controlled polishing processes 有权
标题翻译：反馈控制抛光工艺
公开(公告)号：US07024268B1
公开(公告)日：2006-04-04
申请号：US10396299
申请日：2003-03-24
申请人： Doyle E. Bennett , Boguslaw A. Swedek , Arulkumar Shanmugasundram
发明人： Doyle E. Bennett , Boguslaw A. Swedek , Arulkumar Shanmugasundram
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/45232 , Y02P90/22
摘要： Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishing cycle in which a first polishing process is performed on a substrate that includes a metal layer. The first polishing process clears the metal layer from the substrate during the current polishing cycle. The product includes instructions to calculate a representation of a clearing profile of the first polishing process. The calculation is based on the monitoring information received during the current polishing cycle. The product includes instructions to detect non-uniformity in the representation. The product includes instructions to generate, from the non-uniformity detected, feedback information for improving the uniformity of a clearing profile of the first polishing process for a subsequent polishing cycle.
摘要翻译：用于反馈控制抛光的方法和装置。一种用于产生化学机械抛光反馈的计算机程序产品。该产品包括可操作以使处理器在当前抛光循环期间接收监测信息的指令，其中在包括金属层的基板上执行第一抛光工艺。在当前的抛光循环期间，第一抛光工艺从衬底中清除金属层。该产品包括计算第一次抛光过程的清除轮廓的表示的说明。该计算基于在当前抛光周期期间接收到的监视信息。该产品包括检测表示中不均匀的指令。该产品包括从不均匀性检测到的反馈信息中产生用于改进随后抛光循环的第一抛光处理的清除轮廓的均匀性的指令。

3. 发明申请

US20140113524A1 ENDPOINTING WITH SELECTIVE SPECTRAL MONITORING 有权
标题翻译：选择性光谱监测
公开(公告)号：US20140113524A1
公开(公告)日：2014-04-24
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。

4. 发明申请

US20120227903A1 Automatic Gain Control 审中-公开
标题翻译：自动增益控制
公开(公告)号：US20120227903A1
公开(公告)日：2012-09-13
申请号：US13481479
申请日：2012-05-25
申请人： Boguslaw A. Swedek , Doyle E. Bennett
发明人： Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： G06F19/00 , C23F1/08
CPC分类号： B24B37/013 , B24B49/00 , B24B51/00 , B24B55/00
摘要： Methods and apparatus for automatic gain control. A film on a substrate is polished by a chemical mechanical polisher that includes a polishing pad and an in-situ monitoring system. The polishing pad includes a first portion, and the in-situ monitoring system includes a light source and a light detector. The light source emits light, and light emitted from the light source is directed through the first portion and to a surface of the film being polished. Light reflecting from the surface of the film being polished and passing through the first portion is received at the light detector. An electronic signal is generated based on the light received at the light detector. When the electronic signal is evaluated not to satisfy one or more constraints, a gain for the light detector is adjusted so that the electronic signal would satisfy the one or more constraints.
摘要翻译：自动增益控制的方法和装置。通过包括抛光垫和原位监测系统的化学机械抛光机抛光衬底上的膜。抛光垫包括第一部分，并且原位监测系统包括光源和光检测器。光源发光，并且从光源发射的光被引导通过第一部分和被抛光的膜的表面。从被抛光并穿过第一部分的膜的表面反射的光被接收在光检测器处。基于在光检测器处接收的光产生电子信号。当评估电子信号不满足一个或多个约束时，调整光检测器的增益，使得电子信号将满足一个或多个约束。

5. 发明授权

US08187977B2 Automatic gain control 有权
标题翻译：自动增益控制
公开(公告)号：US08187977B2
公开(公告)日：2012-05-29
申请号：US12390979
申请日：2009-02-23
申请人： Boguslaw A. Swedek , Doyle E. Bennett
发明人： Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B49/00 , B24B51/00 , B24B55/00
摘要： Methods and apparatus for automatic gain control. A film on a substrate is polished by a chemical mechanical polisher that includes a polishing pad and an in-situ monitoring system. The polishing pad includes a first portion, and the in-situ monitoring system includes a light source and a light detector. The light source emits light, and light emitted from the light source is directed through the first portion and to a surface of the film being polished. Light reflecting from the surface of the film being polished and passing through the first portion is received at the light detector. An electronic signal is generated based on the light received at the light detector. When the electronic signal is evaluated not to satisfy one or more constraints, a gain for the light detector is adjusted so that the electronic signal would satisfy the one or more constraints.
摘要翻译：自动增益控制的方法和装置。通过包括抛光垫和原位监测系统的化学机械抛光机抛光衬底上的膜。抛光垫包括第一部分，并且原位监测系统包括光源和光检测器。光源发光，并且从光源发射的光被引导通过第一部分和被抛光的膜的表面。从被抛光并穿过第一部分的膜的表面反射的光被接收在光检测器处。基于在光检测器处接收的光产生电子信号。当评估电子信号不满足一个或多个约束时，调整光检测器的增益，使得电子信号将满足一个或多个约束。

6. 发明授权

US07494929B2 Automatic gain control 有权
标题翻译：自动增益控制
公开(公告)号：US07494929B2
公开(公告)日：2009-02-24
申请号：US11413495
申请日：2006-04-27
申请人： Boguslaw A. Swedek , Doyle E. Bennett
发明人： Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B49/00 , B24B51/00 , B24B55/00
摘要： Methods and apparatus for automatic gain control. A film on a substrate is polished by a chemical mechanical polisher that includes a polishing pad and an in-situ monitoring system. The polishing pad includes a first portion, and the in-situ monitoring system includes a light source and a light detector. The light source emits light, and light emitted from the light source is directed through the first portion and to a surface of the film being polished. Light reflecting from the surface of the film being polished and passing through the first portion is received at the light detector. An electronic signal is generated based on the light received at the light detector. When the electronic signal is evaluated not to satisfy one or more constraints, a gain for the light detector is adjusted so that the electronic signal would satisfy the one or more constraints.
摘要翻译：自动增益控制的方法和装置。通过包括抛光垫和原位监测系统的化学机械抛光机抛光衬底上的膜。抛光垫包括第一部分，并且原位监测系统包括光源和光检测器。光源发光，并且从光源发射的光被引导通过第一部分和被抛光的膜的表面。从被抛光并穿过第一部分的膜的表面反射的光被接收在光检测器处。基于在光检测器处接收的光产生电子信号。当评估电子信号不满足一个或多个约束时，调整光检测器的增益，使得电子信号将满足一个或多个约束。

7. 发明授权

US07354334B1 Reducing polishing pad deformation 有权
标题翻译：减少抛光垫变形
公开(公告)号：US07354334B1
公开(公告)日：2008-04-08
申请号：US11124420
申请日：2005-05-06
申请人： Manoocher Birang , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Manoocher Birang , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： B24B1/00
CPC分类号： B24B37/013 , B24B37/16 , B24B37/20 , B24B37/26 , B24B49/12 , B24B55/12 , B24D7/12
摘要： A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path is provided with an opening to the cavity.
摘要翻译：抛光系统可以具有抛光垫，抛光垫具有抛光表面和底表面，该底表面包括厚度小于抛光垫厚度的凹槽。原位监测模块可以定位在由凹部部分形成的空腔中。排气通道设有通向空腔的开口。

8. 发明授权

US09221147B2 Endpointing with selective spectral monitoring 有权
标题翻译：以选择性光谱监测为终点
公开(公告)号：US09221147B2
公开(公告)日：2015-12-29
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： G06F19/00 , B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。

9. 发明授权

US07621798B1 Reducing polishing pad deformation 有权
标题翻译：减少抛光垫变形
公开(公告)号：US07621798B1
公开(公告)日：2009-11-24
申请号：US11683392
申请日：2007-03-07
申请人： Doyle E. Bennett , Boguslaw A. Swedek , David J. Lischka
发明人： Doyle E. Bennett , Boguslaw A. Swedek , David J. Lischka
IPC分类号： B24B49/12
CPC分类号： B24B37/205
摘要： A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.
摘要翻译：描述了化学机械抛光垫。化学机械抛光垫具有包括抛光表面的外层，由垫的底表面上的凹部限定的第一变薄区域，围绕第一稀化区域的第一厚区域，围绕第一厚区域的第二变薄区域以及围绕第二变薄区域的第二厚区域。第一厚区域不是可垂直延伸的。第二变薄区域限定一个或多个弯曲机构，其被配置为使得第一变薄区域和第一厚区域能够在平行于或基本上平行于抛光表面的方向上相对于第二厚区域移动。

10. 发明授权

US06991516B1 Chemical mechanical polishing with multi-stage monitoring of metal clearing 有权
标题翻译：化学机械抛光多级监控金属清理
公开(公告)号：US06991516B1
公开(公告)日：2006-01-31
申请号：US10920726
申请日：2004-08-17
申请人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
发明人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B49/105 , B24B37/04 , B24B49/12
摘要： A plurality of portions of a substrate are monitored during polishing at a first polishing station with an in-situ monitoring system. A plurality of thicknesses are determined based on measurements by the in-situ monitoring system, and the plurality of pressures to apply to the plurality of regions of the substrate are calculated in a closed-loop control system. However, if a representative thickness of the layer is less than a threshold thickness, calculation of the plurality of pressures by the closed-loop control system is halted and a plurality of predetermined pressures are applied to the plurality of regions of the substrate.
摘要翻译：在具有原位监测系统的第一抛光站的抛光期间，监测基板的多个部分。基于通过原位监测系统的测量确定多个厚度，并且在闭环控制系统中计算应用于衬底的多个区域的多个压力。然而，如果层的代表性厚度小于阈值厚度，则闭环控制系统的多个压力的计算被停止，并且多个预定压力施加到基板的多个区域。

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