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    • 1. 发明授权
    • Dendrite growth control circuit
    • 树枝生长控制电路
    • US07807562B2
    • 2010-10-05
    • US12256221
    • 2008-10-22
    • Douglas B. HershbergerSteven H. VoldmanMichael J. Zierak
    • Douglas B. HershbergerSteven H. VoldmanMichael J. Zierak
    • H01L21/4763
    • H01L21/76838
    • A circuit is provided which prevents dendrite formation on interconnects during semiconductor device processing due to a dendrite-forming current. The circuit includes a switch located in at least one of the dendrite-forming current paths. The switch is configured to be open or in the “off” state during processing, and is configured to be closed or in the “on” state after processing to allow proper functioning of the semiconductor device. The switch may include an nFET or pFET, depending on the environment in which it is used to control or prevent dendrite formation. The switch may be configured to change to the “closed” state when an input signal is provided during operation of the fabricated semiconductor device.
    • 提供了一种电路,其防止由于树突形成电流而在半导体器件处理期间互连上的枝晶形成。 电路包括位于至少一个枝晶形成电流路径中的开关。 该开关被配置为在处理期间处于打开状态或处于“关闭”状态,并且在处理之后被配置为闭合或处于“接通”状态以允许半导体器件正常工作。 开关可以包括nFET或pFET,这取决于其用于控制​​或防止枝晶形成的环境。 当在制造的半导体器件的操作期间提供输入信号时,开关可以被配置为改变为“闭合”状态。
    • 2. 发明授权
    • Dendrite growth control circuit
    • 树枝生长控制电路
    • US07473643B2
    • 2009-01-06
    • US11461623
    • 2006-08-01
    • Douglas B. HershbergerSteven H. VoldmanMichael J. Zierak
    • Douglas B. HershbergerSteven H. VoldmanMichael J. Zierak
    • H01L21/44
    • H01L21/76838
    • A circuit is provided which prevents dendrite formation on interconnects during semiconductor device processing due to a dendrite-forming current. The circuit includes a switch located in at least one of the dendrite-forming current paths. The switch is configured to be open or in the “off” state during processing, and is configured to be closed or in the “on” state after processing to allow proper functioning of the semiconductor device. The switch may include an nFET or pFET, depending on the environment in which it is used to control or prevent dendrite formation. The switch may be configured to change to the “closed” state when an input signal is provided during operation of the fabricated semiconductor device.
    • 提供一种电路,其防止由于树突形成电流而在半导体器件处理期间互连上的枝晶形成。 电路包括位于至少一个枝晶形成电流路径中的开关。 该开关被配置为在处理期间处于打开状态或处于“关闭”状态,并且在处理之后被配置为闭合或处于“接通”状态以允许半导体器件正常工作。 开关可以包括nFET或pFET,这取决于其用于控制​​或防止枝晶形成的环境。 当在制造的半导体器件的操作期间提供输入信号时,开关可以被配置为改变为“闭合”状态。
    • 4. 发明申请
    • DENDRITE GROWTH CONTROL CIRCUIT
    • 浸润生长控制电路
    • US20090035933A1
    • 2009-02-05
    • US12256221
    • 2008-10-22
    • Douglas B. HershbergerSteven H. VoldmanMichael J. Zierak
    • Douglas B. HershbergerSteven H. VoldmanMichael J. Zierak
    • H01L21/4763
    • H01L21/76838
    • A circuit is provided which prevents dendrite formation on interconnects during semiconductor device processing due to a dendrite-forming current. The circuit includes a switch located in at least one of the dendrite-forming current paths. The switch is configured to be open or in the “off” state during processing, and is configured to be closed or in the “on” state after processing to allow proper functioning of the semiconductor device. The switch may include an nFET or pFET, depending on the environment in which it is used to control or prevent dendrite formation. The switch may be configured to change to the “closed” state when an input signal is provided during operation of the fabricated semiconductor device.
    • 提供一种电路,其防止由于树突形成电流而在半导体器件处理期间互连上的枝晶形成。 电路包括位于至少一个枝晶形成电流路径中的开关。 该开关被配置为在处理期间处于打开状态或处于“关闭”状态,并且在处理之后被配置为闭合或处于“接通”状态以允许半导体器件正常工作。 开关可以包括nFET或pFET,这取决于其用于控制​​或防止枝晶形成的环境。 当在制造的半导体器件的操作期间提供输入信号时,开关可以被配置为改变为“闭合”状态。
    • 5. 发明授权
    • Trench-defined silicon germanium ESD diode network
    • 沟槽定义的硅锗ESD二极管网络
    • US06396107B1
    • 2002-05-28
    • US09716749
    • 2000-11-20
    • Ciaran J. BrennanDouglas B. HershbergerMankoo LeeNicholas T. SchmidtSteven H. Voldman
    • Ciaran J. BrennanDouglas B. HershbergerMankoo LeeNicholas T. SchmidtSteven H. Voldman
    • H01L2362
    • H01L27/0259H01L27/0255H01L2924/0002H01L2924/00
    • A silicon-germanium ESD element comprises a substrate of a first dopant type coupled to a first voltage terminal and a first diode-configured element. The first diode-configured element has a collector region of a second dopant type in the substrate, a SiGe base layer of the first dopant type on the collector region, with the SiGe base layer including a base contact region, and an emitter of the second dopant type on the SiGe base layer. Preferably, the SiGe base layer ion the collector region is an epitaxial SiGe layer and the second dopant type of the emitter is diffused in to the SiGe base layer. The ESD element of the present invention may further include a second diode-configured element of the same structure as the first diode-configured element, with an isolation region in the substrate separating the first and second diode-configured elements. The first and second diode-configured elements form a diode network. In each of the embodiments, the isolation regions may be disposed adjacent the collector regions of the diode elements and below a portion of the SiGe base layer of the diode elements. The SiGe base layer in the diode elements preferably comprises an active, single crystal layer in a portion directly over the collector region and a polycrystalline layer in portions directly over the isolation regions. The isolation regions may be shallow or deep trench isolations.
    • 硅锗ESD元件包括耦合到第一电压端子和第一二极管配置元件的第一掺杂剂类型的衬底。 第一二极管配置元件在衬底中具有第二掺杂剂类型的集电极区域,在集电极区域上具有第一掺杂剂类型的SiGe基极层,SiGe基极层包括基极接触区域,第二掺杂剂的发射极 掺杂剂类型在SiGe基层上。 优选地,SiGe基极层离子集电极区域是外延SiGe层,并且第二掺杂剂类型的发射极扩散到SiGe基极层中。 本发明的ESD元件还可以包括与第一二极管配置元件相同结构的第二二极管配置元件,衬底中的隔离区域分隔第一和第二二极管配置元件。 第一和第二二极管配置元件形成二极管网络。 在每个实施例中,隔离区可以邻近二极管元件的集电极区域并且位于二极管元件的SiGe基极层的一部分附近。 二极管元件中的SiGe基极层优选地包括直接在集电极区域上的部分中的有源单晶层和直接在隔离区上的部分的多晶层。 隔离区可以是浅沟或深沟隔离。