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    • 4. 发明专利
    • Method of forming fine pattern of semiconductor device
    • 形成半导体器件精细图案的方法
    • JP2010212656A
    • 2010-09-24
    • JP2009254938
    • 2009-11-06
    • Dongjin Semichem Co Ltdドンジン セミケム カンパニー リミテッド
    • LEE JUN-GYEONGLEE JUNG-YOULKIM JEONG-SIKJANG EU-JEANLEE JAE-WOOKIM DEOG-BAEKIM JAE-HYUN
    • H01L21/027G03F7/039G03F7/11G03F7/40
    • G03F7/40G03F7/0035G03F7/0752G03F7/70466H01L21/0273
    • PROBLEM TO BE SOLVED: To provide a method of forming a fine pattern of a semiconductor device.
      SOLUTION: The method of manufacturing the fine pattern of the semiconductor device using a double exposure patterning process capable of forming a secondary photoresist pattern by simple exposure without using an exposure mask is disclosed. The method includes: a step of forming a first photoresist pattern on a semiconductor substrate on which a layer to be etched is formed; a step of coating a composition of a mirror-interlayer film on the first photoresist pattern to form the mirror-interlayer film; a step of forming a second photoresist film on the resultant film; and a step of forming a second photoresist pattern which is made by irregular reflection of the mirror-interlayer film between the first photoresist patterns, by exposing the second photoresist film to light having energy lower than the threshold energy E
      th of the second photoresist film without using an exposure mask, and then developing the second photoresist film.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种形成半导体器件的精细图案的方法。 公开了使用能够通过简单曝光而不使用曝光掩模形成二次光致抗蚀剂图案的双曝光图案形成工艺来制造半导体器件的精细图案的方法。 该方法包括:在其上形成有被蚀刻层的半导体衬底上形成第一光致抗蚀剂图案的步骤; 在第一光致抗蚀剂图案上涂布镜面 - 中间膜的组合物以形成镜面 - 中间膜的步骤; 在所得膜上形成第二光致抗蚀剂膜的步骤; 以及通过将第二光致抗蚀剂膜暴露于具有低于阈值能量E SB的能量的光而形成第二光致抗蚀剂图案的步骤,该第二光致抗蚀剂图案通过在第一光致抗蚀剂图案之间的镜面 - 中间膜的不规则反射而制成 不使用曝光掩模,然后显影第二光致抗蚀剂膜。 版权所有(C)2010,JPO&INPIT