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    • 7. 发明授权
    • Storage nodes, phase change memory devices, and methods of manufacturing the same
    • 存储节点,相变存储器件及其制造方法
    • US07696507B2
    • 2010-04-13
    • US11907844
    • 2007-10-18
    • Yoon-ho KhangKi-joon KimDong-seok Suh
    • Yoon-ho KhangKi-joon KimDong-seok Suh
    • H01L47/00
    • H01L27/2436H01L45/06H01L45/1233H01L45/1273H01L45/143H01L45/144H01L45/148H01L45/1666
    • A storage node may include a bottom electrode contact layer, a phase change layer connected to the bottom electrode contact layer, and a top electrode layer connected to the phase change layer. The bottom electrode contact layer may protrude toward the phase change layer. A phase change memory device may include a switching device and the storage node. The switching device may be connected to the bottom electrode contact layer. A method of manufacturing the storage node may include forming a via hole in an insulating interlayer, at least partially filling the via hole to form a bottom electrode contact layer, protruding the bottom electrode contact layer from the via hole, and forming a phase change layer that covers the bottom electrode contact layer. A method of manufacturing a phase change memory device may include forming the switching device on a substrate and manufacturing the storage node.
    • 存储节点可以包括底部电极接触层,连接到底部电极接触层的相变层和连接到相变层的顶部电极层。 底部电极接触层可以向相变层突出。 相变存储器件可以包括切换装置和存储节点。 开关器件可以连接到底部电极接触层。 制造存储节点的方法可以包括在绝缘中间层中形成通孔,至少部分地填充通孔以形成底电极接触层,从底孔电极接触层从通孔突出,并形成相变层 覆盖底部电极接触层。 相变存储器件的制造方法可以包括在基板上形成开关器件并制造存储节点。