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1. 发明申请

US20080164054A1 PRINTED CIRCUIT BOARD CAPABLE OF VOID CONTROL DURING SURFACE MOUNTING PROCESS 审中-公开
标题翻译：印刷电路板在表面安装过程中能够进行无声控制
公开(公告)号：US20080164054A1
公开(公告)日：2008-07-10
申请号：US11971854
申请日：2008-01-09
申请人： Dong-Woo SHIN , Dong-Chun LEE , Seong-Chan HAN , Hyo-Jae BANG , Si-Suk KIM , Su-Jin JUNG
发明人： Dong-Woo SHIN , Dong-Chun LEE , Seong-Chan HAN , Hyo-Jae BANG , Si-Suk KIM , Su-Jin JUNG
IPC分类号： H05K1/00 , B23K31/00
CPC分类号： B23K1/0016 , B23K1/20 , H05K3/3436 , H05K3/3452 , H05K2201/099 , H05K2201/2081 , Y02P70/613
摘要： Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.
摘要翻译：本发明的示例性实施例包括能够在表面安装处理期间控制空隙的尺寸和位置的印刷电路板（PCB）。为此，PCB包括：由绝缘材料制成的绝缘板; 形成在绝缘板上的印刷电路图案; 多个焊盘以支撑多个焊点，每个焊盘连接到每个印刷电路图案的一端; 以及安装在每个焊盘的表面上的防润湿层，用于焊接接头。抗潮湿层允许在表面安装过程期间产生的空隙移动到焊盘上的中心表面，使得焊球和焊盘之间的焊点可靠性增加。结果，提高了半导体器件的可靠性。

2. 发明申请

US20080130254A1 ELECTRONIC DEVICE WITH REWORKABLE ELECTRONIC COMPONENT, METHOD OF FABRICATING THE ELECTRONIC DEVICE AND METHOD OF REWORKING THE ELECTRONIC COMPONENT 失效
标题翻译：具有可复制电子元件的电子设备，电子设备的制造方法和电子元器件的制作方法
公开(公告)号：US20080130254A1
公开(公告)日：2008-06-05
申请号：US11950280
申请日：2007-12-04
申请人： Seong-Chan HAN , Dong-Woo SHIN , Young-Soo LEE , Hyo-Jae BANG , Hun HAN
发明人： Seong-Chan HAN , Dong-Woo SHIN , Young-Soo LEE , Hyo-Jae BANG , Hun HAN
IPC分类号： B23P19/00 , H05K3/34 , H05K1/18
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/98 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24227 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K3/225 , H05K3/3442 , H05K2201/10636 , H05K2201/10674 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49144 , Y10T29/53274 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.
摘要翻译：公开了一种具有可再加工电子部件的电子装置，电子装置的制造方法以及电子部件的再加工方法。电子设备包括设置在板体中的第一腔。第一金属图案设置在板体上并与第一腔相邻。第一电子部件设置在第一腔中。第一连接图案被设置成与第一电子部件的上边缘部分相邻并且延伸到第一金属图案，使得第一金属图案电连接到第一电子部件。

3. 发明申请

US20080076231A1 METHOD FOR FABRICATING CAPACITOR OF SEMICONDUCTOR DEVICE 失效
标题翻译：用于制造半导体器件电容器的方法
公开(公告)号：US20080076231A1
公开(公告)日：2008-03-27
申请号：US11952767
申请日：2007-12-07
申请人： Dong-Woo SHIN , Hyung-Bok Choi , Jong-Min Lee , Jin-Woong Kim
发明人： Dong-Woo SHIN , Hyung-Bok Choi , Jong-Min Lee , Jin-Woong Kim
IPC分类号： H01L21/22
CPC分类号： H01L28/84 , H01L21/32155 , H01L28/91
摘要： The present invention relates to a method for fabricating a capacitor of a semiconductor device. The method includes the steps of: forming a first amorphous silicon layer doped with an impurity in a predetermined first doping concentration suppressing dopants from locally agglomerating; forming an impurity undoped second amorphous silicon layer on the first amorphous silicon layer in an in-situ condition; forming a storage node by patterning the first amorphous silicon layer and the second amorphous silicon layer; forming silicon grains on a surface of the storage node; and doping the impurity to the storage node and the silicon grains until reaching a second predetermined concentration for providing conductivity required by the storage node.
摘要翻译：本发明涉及半导体器件的电容器的制造方法。该方法包括以下步骤：在预定的第一掺杂浓度抑制掺杂剂中形成掺杂有杂质的第一非晶硅层局部凝聚; 在原位条件下在第一非晶硅层上形成杂质未掺杂的第二非晶硅层; 通过图案化所述第一非晶硅层和所述第二非晶硅层来形成存储节点; 在所述存储节点的表面上形成硅晶粒; 以及将杂质掺杂到存储节点和硅晶粒直到达到第二预定浓度以提供存储节点所需的导电性。

4. 发明申请

US20100148158A1 ORGANIC COMPOUND AND ORGANIC LIGHT EMITTING DEVICE CONTAINING THE SAME 有权
标题翻译：有机化合物和有机发光装置
公开(公告)号：US20100148158A1
公开(公告)日：2010-06-17
申请号：US12557047
申请日：2009-09-10
申请人： Myeong-Suk KIM , Byoung-Ki CHOI , Dong-Woo SHIN , O-Hyun KWON , Haa-Jin YANG , Bong-Jin MOON , Myoung-Soo HAM
发明人： Myeong-Suk KIM , Byoung-Ki CHOI , Dong-Woo SHIN , O-Hyun KWON , Haa-Jin YANG , Bong-Jin MOON , Myoung-Soo HAM
IPC分类号： H01L51/54 , C07C13/465 , C07C2/86
CPC分类号： C07C13/567 , C07C2/86 , H01L51/5012 , Y10S428/917
摘要： Disclosed is a compound represented by the following Formula 1: The compound exhibits improved solubility and thermal stability in an organic light emitting device. An organic light emitting device including the compound, improves the driving voltage, the emission efficiency, and the color purity of an organic light emitting display.
摘要翻译：公开了由下式1表示的化合物：该化合物在有机发光装置中表现出改进的溶解性和热稳定性。包括该化合物的有机发光器件改善了有机发光显示器的驱动电压，发光效率和色纯度。

5. 发明申请

US20140353624A1 ORGANIC LIGHT-EMITTING DIODE 审中-公开
标题翻译：有机发光二极管
公开(公告)号：US20140353624A1
公开(公告)日：2014-12-04
申请号：US14102810
申请日：2013-12-11
申请人： Seul-Ong KIM , Dong-Woo SHIN
发明人： Seul-Ong KIM , Dong-Woo SHIN
IPC分类号： H01L51/50 , H01L51/00
CPC分类号： H01L51/5016 , H01L51/0052 , H01L51/006 , H01L51/0072 , H01L51/0085 , H01L51/0087 , H01L51/0088 , H01L51/506 , H01L51/5064
摘要： An organic light-emitting diode including a first electrode; a second electrode facing the first electrode; an emission layer between the first electrode and the second electrode, the emission layer including a host and a dopant; a first hole transport layer between the first electrode and the emission layer; and a second hole transport layer between the first hole transport layer and the emission layer, wherein the first hole transport layer includes a first carbazole-based compound and a p-dopant, the second hole transport layer includes a second carbazole-based compound and does not comprise the p-dopant, the host of the emission layer includes a third carbazole-based compound, the dopant of the emission layer includes a phosphorescent metal complex, and the first carbazole-based compound, the second carbazole-based compound, and the third carbazole-based compound are all different from each other.
摘要翻译：一种包括第一电极的有机发光二极管; 面对所述第一电极的第二电极; 在第一电极和第二电极之间的发射层，发射层包括主体和掺杂剂; 在所述第一电极和所述发射层之间的第一空穴传输层; 以及在所述第一空穴传输层和所述发光层之间的第二空穴传输层，其中，所述第一空穴传输层包含第一咔唑类化合物和p-掺杂剂，所述第二空穴传输层包含第二咔唑类化合物，不包括p掺杂剂，发射层的主体包括第三咔唑类化合物，发光层的掺杂剂包括磷光金属络合物，第一咔唑类化合物，第二咔唑类化合物和第三咔唑类化合物各自不同。

6. 发明申请

US20090116195A1 HEAT SINK FOR DISSIPATING HEAT AND APPARATUS HAVING THE SAME 有权
标题翻译：用于散热的散热器和装置
公开(公告)号：US20090116195A1
公开(公告)日：2009-05-07
申请号：US12265101
申请日：2008-11-05
申请人： Jin-Kyu YANG , Dong-Woo SHIN , Hyun-Jong OH
发明人： Jin-Kyu YANG , Dong-Woo SHIN , Hyun-Jong OH
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/3675 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support member and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.
摘要翻译：散热器包括分别与热源的第一和第二表面接触的第一和第二基板。第一基板包括从第一表面突出的支撑单元和第一散热单元，以从热源散发热量。第二基板包括与边缘部分间隔开以保持支撑单元的穿透孔和用于消散来自热源的热量的第二消散单元。联接构件定位在支撑构件的上表面上并且向第一和第二基板施加力，从而将第一和第二基板组合到热源。将基板组合到存储器模块中，而不会损耗散热片的表面积，从而提高散热器的散热效率。

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