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    • 6. 发明授权
    • Method of fabricating photo mask
    • 制作光罩的方法
    • US07475383B2
    • 2009-01-06
    • US11589055
    • 2006-10-30
    • Sung-Soo SuhYoung-Seog KangIn-Sung Kim
    • Sung-Soo SuhYoung-Seog KangIn-Sung Kim
    • G06F17/50G06F19/00G03F1/00G21K5/00
    • G03F1/36
    • Provided is a method of fabricating a photo mask. The method includes preparing a model group including optical proximity correction (OPC) models and generating a preliminary mask layout using an integrated circuit (IC) layout. A contour image may be produced from the preliminary mask layout through a simulation using an optical model. Subsequently, the preliminary mask layout may be compared with the contour image and the comparison result may be analyzed to produce analysis data for providing criteria used in selecting an OPC model. An OPC model suitable for the preliminary mask layout may be selected from the model group based on the analysis data. An OPC process may be performed on the preliminary mask layout using the selected OPC model to generate a mask layout.
    • 提供一种制造光掩模的方法。 该方法包括准备包括光学邻近校正(OPC)模型的模型组,并使用集成电路(IC)布局产生初步掩模布局。 可以通过使用光学模型的模拟从初步掩模布局产生轮廓图像。 随后,可以将初步掩模布局与轮廓图像进行比较,并且可以分析比较结果以产生用于提供在选择OPC模型中使用的标准的分析数据。 可以基于分析数据从模型组中选择适合初步掩模布局的OPC模型。 可以使用选择的OPC模型在初步掩模布局上执行OPC处理以生成掩模布局。
    • 7. 发明申请
    • Global matching methods used to fabricate semiconductor devices
    • 用于制造半导体器件的全局匹配方法
    • US20080187211A1
    • 2008-08-07
    • US11880495
    • 2007-07-23
    • Chan-Kyeong HyonYoung-Seog KangSang-Ho Lee
    • Chan-Kyeong HyonYoung-Seog KangSang-Ho Lee
    • G06K9/00
    • G06T7/001G06K9/64G06T7/13G06T2207/10056G06T2207/30148
    • A global matching method for semiconductor memory device fabrication may include extracting a graphic data system (GDS) image and a scanning electron microscope (SEM) image of patterns in a region on a wafer. First directional edges extending in a first direction and second directional edges extending in a second direction may be separately extracted from each of the GDS image and the SEM image with the first and second directions being different. The GDS image and the SEM image may be matched with respect to either the first directional edges or the second directional edges which are relatively shorter. After the relatively shorter edges of the GDS image and the SEM image are matched, the GDS image and the SEM image may be matched with respect to relatively longer edges, based on a result of the matching with respect to the relatively shorter edges, thereby completing pattern matching of the GDS image and the SEM image.
    • 用于半导体存储器件制造的全局匹配方法可以包括提取晶片上的区域中的图案的图形数据系统(GDS)图像和扫描电子显微镜(SEM)图像。 可以从第一和第二方向不同的每个GDS图像和SEM图像分别提取沿第一方向延伸的第一方向边缘和沿第二方向延伸的第二方向边缘。 GDS图像和SEM图像可以相对于相对较短的第一方向边缘或第二方向边缘匹配。 在GDS图像和SEM图像的相对较短边缘匹配之后,基于相对于较短边缘的匹配结果,GDS图像和SEM图像可以相对于相对较长的边缘匹配,由此完成 GDS图像和SEM图像的图案匹配。
    • 9. 发明授权
    • System and method correcting optical proximity effect using pattern configuration dependent OPC models
    • 使用模式配置依赖OPC模型的系统和方法校正光学邻近效应
    • US07900170B2
    • 2011-03-01
    • US11585086
    • 2006-10-24
    • Sung-Soo SuhYoung-Seog KangHan-Ku ChoSang-Gyun Woo
    • Sung-Soo SuhYoung-Seog KangHan-Ku ChoSang-Gyun Woo
    • G06F17/50
    • G03F1/36
    • An optical proximity correction (OPC) system and methods thereof are provided. The example OPC system may include an integrated circuit (IC) layout generation unit generating an IC layout, a database unit storing a first plurality of OPC models, each of the first plurality of OPC models associated with one of a plurality of target specific characteristics and a mask layout generation unit including a model selector selecting a second plurality of OPC models based on a comparison between the target specific characteristics associated with the plurality of OPC models and the generated IC layout, the mask layout generation unit generating a mask layout based on the IC layout and the selected second plurality of OPC models. A first example method may include storing a first plurality OPC models, each of the first plurality of OPC models associated with one of a plurality of target specific characteristics, generating an IC layout, selecting a second plurality of OPC models based on a comparison between the target specific characteristics associated with the first plurality of OPC models and the generated IC layout and generating a mask layout based on the generated IC layout and the selected second plurality of OPC models. A second example method may include applying a first OPC model to a first portion of a generated integrated circuit (IC) layout, applying a second OPC model to a second portion of the generated IC layout and generating a mask layout based on the generated IC layout after the application of the first and second OPC models.
    • 提供光学邻近校正(OPC)系统及其方法。 示例性OPC系统可以包括产生IC布局的集成电路(IC)布局生成单元,存储第一多个OPC模型的数据库单元,与多个目标特定特征之一相关联的第一多个OPC模型中的每一个,以及 掩模布局生成单元,其包括基于与所述多个OPC模型相关联的目标特定特性与所生成的IC布局之间的比较来选择第二多个OPC模型的模型选择器,所述掩模布局生成单元基于所述多个OPC模型生成掩模布局 IC布局和所选择的第二批OPC模型。 第一示例性方法可以包括存储第一多个OPC模型,所述第一多个OPC模型中的每一个与多个目标特定特征中的一个相关联,生成IC布局,基于所述多个OPC模型之间的比较来选择第二多个OPC模型 与第一多个OPC模型相关联的目标特定特征和所生成的IC布局,并且基于所生成的IC布局和所选择的第二多个OPC模型生成掩模布局。 第二示例性方法可以包括将第一OPC模型应用于所生成的集成电路(IC)布局的第一部分,将第二OPC模型应用于所生成的IC布局的第二部分,并且基于所生成的IC布局生成掩模布局 之后应用了第一个和第二个OPC模型。