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1. 发明授权

US09251943B2 Multilayer type inductor and method of manufacturing the same 有权
标题翻译：多层型电感器及其制造方法
公开(公告)号：US09251943B2
公开(公告)日：2016-02-02
申请号：US13620676
申请日：2012-09-14
申请人： Dong Jin Jeong , Hyeog Soo Shin , Jae Wook Lee
发明人： Dong Jin Jeong , Hyeog Soo Shin , Jae Wook Lee
IPC分类号： H01F5/00 , H01F27/24 , H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H01F17/0013 , H01F17/0033 , H01F27/292 , H01F41/046 , Y10T29/4902
摘要： There is provided a multilayer type inductor, including: an inductor main body; a coil part having conductive circuits and conductive vias formed in the inductor main body; and external electrodes formed on both ends of the inductor main body, wherein in the inductor main body, at least parts around the conductive circuits and the conductive vias are formed of a ferrite material or a non-magnetic material.
摘要翻译：提供了一种多层型电感器，包括：电感器主体; 具有导体电路和形成在电感器主体的导电通孔的线圈部分; 和形成在所述电感器主体，其中在所述电感器主体，在所述导电电路和所述导电过孔周围至少部分由铁氧体材料或非磁性材料形成的两端的外部电极。

2. 发明授权

US08482371B2 Chip-type coil component 有权
标题翻译：片式线圈组件
公开(公告)号：US08482371B2
公开(公告)日：2013-07-09
申请号：US13331673
申请日：2011-12-20
申请人： Dong Jin Jeong , Jae Wook Lee
发明人： Dong Jin Jeong , Jae Wook Lee
IPC分类号： H01F5/00 , H01F27/29 , H01F27/28
CPC分类号： H01F27/2804 , H01F17/0033 , H01F27/292
摘要： The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.
摘要翻译：芯片型线圈部件包括：主体; 导电图案彼此连接以具有线圈结构; 以及形成在底表面上的两个表面和长度方向上的两个表面的外部电极; 其中，所述外部电极在所述主体的厚度方向上的高度大于所述导电图案中从所述底面到最远的导电图案的高度，并且小于从所述主体的底面到所述顶面的高度其中。根据本发明的实施例，即使在芯片型线圈组件与金属罐接触的情况下，也不会发生短路等干扰，结果是具有优异的可靠性的芯片型线圈部件可以获得。

3. 发明申请

US20120274432A1 CHIP-TYPE COIL COMPONENT 有权
标题翻译：芯片型线圈组件
公开(公告)号：US20120274432A1
公开(公告)日：2012-11-01
申请号：US13331673
申请日：2011-12-20
申请人： Dong Jin Jeong , Jae Wook Lee
发明人： Dong Jin Jeong , Jae Wook Lee
IPC分类号： H01F27/29
CPC分类号： H01F27/2804 , H01F17/0033 , H01F27/292
摘要： The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.
摘要翻译：芯片型线圈部件包括：主体; 导电图案彼此连接以具有线圈结构; 以及形成在底表面上的两个表面和长度方向上的两个表面的外部电极; 其中，所述外部电极在所述主体的厚度方向上的高度大于所述导电图案中从所述底面到最远的导电图案的高度，并且小于从所述主体的底面到所述顶面的高度其中。根据本发明的实施例，即使在芯片型线圈部件组件与金属罐接触的情况下，也不会发生短路等干扰，结果是具有良好可靠性的芯片型线圈部件可以获得。

4. 发明授权

US08593247B2 Chip-type coil component 有权
标题翻译：片式线圈组件
公开(公告)号：US08593247B2
公开(公告)日：2013-11-26
申请号：US13458842
申请日：2012-04-27
申请人： Dong Jin Jeong , Jae Wook Lee
发明人： Dong Jin Jeong , Jae Wook Lee
IPC分类号： H01F27/02 , H01F21/04 , H01F27/28 , H01F27/30 , H01F27/24
CPC分类号： H01F27/292 , H01F17/0033
摘要： There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers, and having a lower surface provided as a mounting area, an upper surface corresponding thereto, two end surfaces, and two lateral surfaces; conductor patterns formed on the magnetic layers, respectively, and connected to each other to have a coil structure; and external electrodes formed on at least one external surface of the body, and electrically connected to the conductor patterns, the external electrodes each being formed on the lower surface and spaced apart from edges thereof. Short circuits between electronic components may be prevented and sticking strength between the chip-type coil component and a substrate may be increased.
摘要翻译：提供了一种芯片型线圈部件，包括：通过层叠多个磁性层而形成的主体，并且具有设置为安装区域的下表面，与其对应的上表面，两个端表面和两个侧表面; 分别形成在磁性层上并且彼此连接以具有线圈结构的导体图案; 以及外部电极，其形成在所述主体的至少一个外表面上，并且电连接到所述导体图案，所述外部电极各自形成在所述下表面上并与其边缘间隔开。可以防止电子部件之间的短路，并且可以增加芯片型线圈部件和基板之间的粘附强度。

5. 发明授权

US09314520B2 Adjuvant composition containing poly-gamma-glutamic acid-chitosan nanoparticles 有权
标题翻译：含有聚-γ-谷氨酸 - 壳聚糖纳米粒子的佐剂组合物
公开(公告)号：US09314520B2
公开(公告)日：2016-04-19
申请号：US13380503
申请日：2010-06-25
申请人： Moon-Hee Sung , Haryoung Poo , Chul Joong Kim , Young-Ki Choi , Yong Taik Lim , Dong Jin Jeong , Sang-Mu Shim
发明人： Moon-Hee Sung , Haryoung Poo , Chul Joong Kim , Young-Ki Choi , Yong Taik Lim , Dong Jin Jeong , Sang-Mu Shim
IPC分类号： A61K39/39 , A61K39/145 , A61K39/12 , A61K39/00
CPC分类号： A61K39/39 , A61K39/12 , A61K39/145 , A61K2039/543 , A61K2039/55583 , C12N2760/16134
摘要： The present invention relates to an adjuvant composition containing poly-gamma-glutamic acid-chitosan nanoparticles and a vaccine composition containing the adjuvant composition, and more particularly to an adjuvant composition containing nanoparticles prepared by ionic bonding between poly-gamma-glutamic acid having ensured safety and chitosan, and a vaccine composition containing the poly-gamma-glutamic acid-chitosan nanoparticles and an antigen. The adjuvant containing the poly-gamma-glutamic acid-chitosan nanoparticles has little or no toxicity and side effects and is added to human or animal vaccines for the prevention and treatment of viral and bacterial infections and cancers to increase the production of antibodies.
摘要翻译：本发明涉及包含聚-γ-谷氨酸 - 壳聚糖纳米颗粒的佐剂组合物和含有佐剂组合物的疫苗组合物，更具体地说涉及含有通过确保安全性的聚-γ-谷氨酸之间的离子键合制备的纳米颗粒的佐剂组合物和壳聚糖，以及含有聚-γ-谷氨酸 - 壳聚糖纳米粒子和抗原的疫苗组合物。含有聚-γ-谷氨酸 - 壳聚糖纳米颗粒的佐剂几乎没有或没有毒副作用，并加入到人或动物疫苗中，用于预防和治疗病毒和细菌感染和癌症以增加抗体的产生。

6. 发明申请

US20120164174A1 ADJUVANT COMPOSITION CONTAINING POLY-GAMMA-GLUTAMIC ACID-CHITOSAN NANOPARTICLES 有权
标题翻译：含有聚氨基酸 - 谷氨酸 - 壳聚糖纳米粒子的补充剂组合物
公开(公告)号：US20120164174A1
公开(公告)日：2012-06-28
申请号：US13380503
申请日：2010-06-25
申请人： Moon-Hee Sung , Haryoung Poo , Chul Joong Kim , Young-Ki Choi , Yong Taík Lim , Dong Jin Jeong , Sang-Mu Shim
发明人： Moon-Hee Sung , Haryoung Poo , Chul Joong Kim , Young-Ki Choi , Yong Taík Lim , Dong Jin Jeong , Sang-Mu Shim
IPC分类号： A61K39/39 , A61K39/145 , A61P29/00 , A61P35/00 , A61P31/16 , A61P31/00 , C07K17/10 , A61K39/00
CPC分类号： A61K39/39 , A61K39/12 , A61K39/145 , A61K2039/543 , A61K2039/55583 , C12N2760/16134
摘要： The present invention relates to an adjuvant composition containing poly-gamma-glutamic acid-chitosan nanoparticles and a vaccine composition containing the adjuvant composition, and more particularly to an adjuvant composition containing nanoparticles prepared by ionic bonding between poly-gamma-glutamic acid having ensured safety and chitosan, and a vaccine composition containing the poly-gamma-glutamic acid-chitosan nanoparticles and an antigen. The adjuvant containing the poly-gamma-glutamic acid-chitosan nanoparticles has little or no toxicity and side effects and is added to human or animal vaccines for the prevention and treatment of viral and bacterial infections and cancers to increase the production of antibodies.
摘要翻译：本发明涉及包含聚-γ-谷氨酸 - 壳聚糖纳米颗粒的佐剂组合物和含有佐剂组合物的疫苗组合物，更具体地说涉及含有通过确保安全性的聚-γ-谷氨酸之间的离子键合制备的纳米颗粒的佐剂组合物和壳聚糖，以及含有聚-γ-谷氨酸 - 壳聚糖纳米粒子和抗原的疫苗组合物。含有聚-γ-谷氨酸 - 壳聚糖纳米颗粒的佐剂很少或没有毒性和副作用，并加入到人或动物疫苗中，用于预防和治疗病毒和细菌感染和癌症以增加抗体的产生。

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