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    • 5. 发明申请
    • LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
    • 发光装置和发光装置包装
    • US20110095322A1
    • 2011-04-28
    • US12913351
    • 2010-10-27
    • Dong Hun KANG
    • Dong Hun KANG
    • H01L33/60
    • H01L33/405H01L33/20H01L33/38H01L2224/48091H01L2224/73265H01L2933/0016H01L2933/0091H01L2924/00014
    • Provided are a light emitting device and a light emitting device package. The light emitting device comprises a light emitting structure comprising a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer; a first electrode on the first conductive type semiconductor layer, the first electrode being electrically connected to the first conductive type semiconductor layer; a plurality of reflective islands on the second conductive type semiconductor layer; a second electrode on the second conductive type semiconductor layer and the plurality of reflective islands, the second electrode being electrically connected to the second conductive type semiconductor layer; and a conductive support member on the second electrode.
    • 提供了一种发光器件和发光器件封装。 发光器件包括发光结构,其包括第一导电类型半导体层,第一导电类型半导体层上的有源层和有源层上的第二导电类型半导体层; 在所述第一导电型半导体层上的第一电极,所述第一电极与所述第一导电型半导体层电连接; 在所述第二导电型半导体层上的多个反射岛; 在第二导电型半导体层和多个反射岛上的第二电极,第二电极电连接到第二导电类型半导体层; 以及在第二电极上的导电支撑构件。